LED package with efficient, isolated thermal path
View Patent ↗Packages for containing one or more light emitting devices, such as light emitting diodes (LEDs), are disclosed with an efficient, isolated thermal path. In one embodiment, LED package can include a thermal element and at least one electrical element embedded within a body. The thermal element and electrical element can have the same and/or substantially the same thickness and can extend directly from a bottom surface of the LED package such that they are substantially flush with or extend beyond the bottom surface of the LED package. The thermal and electrical element have exposed portions which can be substantially flush with lateral sides of the body such that the thermal and electrical element do not have a significant portion extending beyond an outermost edge of the lateral sides of the body.
1. A light emitting diode (LED) package, the package comprising:
a body comprising at least a portion of a thermal element and at least a portion of an electrical element, both of which are embedded within the body and extend directly from a bottom surface of the body, the thermal element being electrically isolated from the electrical element; and
at least one light emitting device thermally connected to the thermal element and electrically connected to the electrical element;
wherein a top surface of the thermal element and a top surface of the electrical element are substantially flush with a bottom surface of a reflector cavity formed in the body.
2. The LED package according to claim 1 , wherein the thermal element comprises a substantially same thickness as the electrical element within the body.
3. The LED package according to claim 1 , wherein the top surface of the thermal element is disposed along a lower plane than an embedded top surface of the thermal element.
4. The LED package according to claim 3 , wherein the thermal element comprises a bending portion embedded within the body that transitions the top surface of the thermal element into the embedded top surface of the thermal element.
5. The LED package according to claim 4 , wherein the thermal element comprises a longitudinal axis orthogonal to opposing lateral sides upon which exposed portions of the thermal element are located, the exposed portions of the thermal element being substantially flush with the opposing lateral sides of the body.
6. The LED package according to claim 4 , wherein the electrical element comprises a longitudinal axis that is parallel to a longitudinal axis of the thermal element and orthogonal to opposing lateral sides upon which exposed portions of the electrical element are located, the exposed portions of the electrical element being substantially flush with the opposing lateral sides of the body.
7. The LED package according to claim 1 , wherein the thermal element is electrically isolated from the electrical element by an insulating portion of the body.
8. The LED package according to claim 1 , further comprising a lens.
9. The LED package according to claim 1 , wherein an encapsulant is disposed within the reflector cavity.
10. The LED package according to claim 1 , wherein the thermal element and electrical element only extend directly from a bottom surface of the body.
11. The LED package according to claim 1 , wherein the thermal element and electrical element are only embedded on two opposing lateral sides of the body.
12. A light emitting diode (LED) package, the package comprising:
a body comprising at least a portion of a thermal element and at least a portion of an electrical element both embedded within the body and extending directly from a bottom surface of the body, the thermal element and electrical element comprising bottom surfaces which are substantially flush with the bottom surface of the body; and
at least one light emitting device thermally connected to the thermal element and electrically connected to the electrical element.
13. The LED package according to claim 12 , wherein the thermal element is electrically isolated from the electrical element by an insulating portion of the body.
14. The LED package according to claim 12 , wherein a top surface of the thermal element and a top surface of the electrical element are flush with a bottom surface of a reflector cavity formed in the body.
15. The LED package according to claim 12 , wherein an encapsulant is disposed in the reflector cavity.
16. The LED package according to claim 12 , wherein a top surface of the thermal element is disposed along a lower plane than an embedded top surface of the thermal element.
17. The LED package according to claim 16 , wherein the thermal element comprises a bending portion embedded within the body that transitions the top surface of the thermal element into the embedded top surface of the thermal element.
18. The LED package according to claim 17 , wherein the thermal element comprises a longitudinal axis orthogonal to opposing lateral sides upon which exposed portions of the thermal element are located, the exposed portions of the thermal element being substantially flush with opposing lateral sides of the body.
19. The LED package according to claim 18 , wherein the electrical element comprises a longitudinal axis parallel to the longitudinal axis of the thermal element and orthogonal to opposing lateral sides upon which exposed portions of the electrical element are located, the exposed portions of the electrical element being substantially flush with opposing lateral sides of the body.
20. The LED package according to claim 12 , wherein the thermal element and electrical element only extend directly from a bottom surface of the body.
21. The LED package according to claim 12 , wherein the thermal element and electrical element are only embedded in two opposing lateral sides of the body.
22. A light emitting diode (LED) package, the package comprising:
a body comprising at least a portion of a thermal element and at least a portion of an electrical element, both of which are embedded within the body and extend directly from a bottom surface of the body, the thermal element being electrically isolated from the electrical element; and
at least one light emitting device thermally connected to the thermal element and electrically connected to the electrical element;
wherein a top surface of the thermal element is disposed along a lower plane than an embedded top surface of the thermal element.
23. A light emitting diode (LED) package, the package comprising:
a body comprising at least a portion of a thermal element and at least a portion of an electrical element, both of which are embedded within the body and extend directly from a bottom surface of the body, the thermal element being electrically isolated from the electrical element; and
at least one light emitting device thermally connected to the thermal element and electrically connected to the electrical element;
wherein a top surface of the thermal element is disposed along a lower plane than an embedded top surface of the thermal element; and
wherein the thermal element comprises a bending portion embedded within the body that transitions the top surface of the thermal element into the embedded top surface of the thermal element.
24. A light emitting diode (LED) package, the package comprising:
a body comprising at least a portion of a thermal element and at least a portion of an electrical element, both of which are embedded within the body and extend directly from a bottom surface of the body, the thermal element being electrically isolated from the electrical element; and
at least one light emitting device thermally connected to the thermal element and electrically connected to the electrical element;
wherein a top surface of the thermal element is disposed along a lower plane than an embedded top surface of the thermal element;
wherein the thermal element comprises a bending portion embedded within the body that transitions the top surface of the thermal element into the embedded top surface of the thermal element; and
wherein the thermal element comprises a longitudinal axis orthogonal to opposing lateral sides upon which exposed portions of the thermal element are located, the exposed portions of the thermal element being substantially flush with the opposing lateral sides of the body.
25. A light emitting diode (LED) package, the package comprising:
a body comprising at least a portion of a thermal element and at least a portion of an electrical element, both of which are embedded within the body and extend directly from a bottom surface of the body, the thermal element being electrically isolated from the electrical element; and
at least one light emitting device thermally connected to the thermal element and electrically connected to the electrical element;
wherein a top surface of the thermal element is disposed along a lower plane than an embedded top surface of the thermal element;
wherein the thermal element comprises a bending portion embedded within the body that transitions the top surface of the thermal element into the embedded top surface of the thermal element; and
wherein the electrical element comprises a longitudinal axis that is parallel to a longitudinal axis of the thermal element and orthogonal to opposing lateral sides of the body upon which exposed portions of the electrical element are located, the exposed portions of the electrical element being substantially flush with the opposing lateral sides of the body.
26. A light emitting diode (LED) package, the package comprising:
a body comprising at least a portion of a thermal element and at least a portion of an electrical element, both of which are embedded within the body and extend directly from a bottom surface of the body, the thermal element being electrically isolated from the electrical element; and
at least one light emitting device thermally connected to the thermal element and electrically connected to the electrical element;
wherein a top surface of the thermal element and a top surface of the electrical element are substantially flush with a bottom surface of a reflector cavity formed in the body; and
wherein an encapsulant is disposed within the reflector cavity.
27. A light emitting diode (LED) package, the package comprising:
a body comprising at least a portion of a thermal element and at least a portion of an electrical element, both of which are embedded within the body and extend directly from a bottom surface of the body, the thermal element being electrically isolated from the electrical element; and
at least one light emitting device thermally connected to the thermal element and electrically connected to the electrical element;
wherein the thermal element and electrical element are only embedded on two opposing lateral sides of the body.
28. A light emitting diode (LED) package, the package comprising:
a body comprising at least a portion of a thermal element and at least a portion of an electrical element, both of which are embedded within the body and extend directly from a bottom surface of the body, the thermal element being electrically isolated from the electrical element;
at least one light emitting device thermally connected to a mounting surface of the thermal element and electrically connected to the electrical element; and
a top surface of the thermal element and a top surface of the electrical element being substantially flush with the mounting surface.