IP Library Granted Patent US 8,994,057
Granted Patent B2
US 8,994,057 · App. 14/052,201 · Granted Mar 31, 2015

Light emitting devices for light emitting diodes (LEDS)

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Quick Facts
Patent No.
US 8,994,057
App. No.
14/052,201
Granted
Mar 31, 2015
Kind
B2
Abstract

Light emitting devices for light emitting diodes (LEDs) are disclosed. In one embodiment a light emitting device can include a submount and a light emission area disposed over the submount. The light emission area can include one or more light emitting diodes (LEDs), a fillet at least partially disposed about the one or more the LEDs, and filling material. The filling material can be disposed over a portion of the one or more LEDs and a portion of the fillet.

Claims (10)

1. A light emitting device, comprising:

a submount comprising at least one of a dielectric layer, a core layer, a solder mask layer and one or more reflection layer;

a light emission area disposed over the submount, wherein the light emission area comprises at least one light emitting diode (LED); and

a fillet at least partially disposed about the light emission area, wherein the fillet comprises a substantially horizontal surface disposed against the reflection layer and the fillet further comprises a substantially vertical surface disposed against at least one or more of the dielectric layer and the solder mask layer.

2. The light emitting device of claim 1 , wherein a right angle is formed at an intersection of the substantially horizontal and the substantially vertical surfaces of the fillet, and the fillet comprises a curved upper surface.

3. The light emitting device of claim 2 , wherein the curved upper surface of the fillet is concave.

4. The light emitting device of claim 1 , further comprising retention material at least partially disposed about the light emission area and above a portion of the submount.

5. The light emitting device of claim 1 , wherein the reflection layer is disposed between the core layer and a portion of the light emission area.

6. The light emitting device of claim 1 , further comprising a filling material disposed over a portion of the light emission area and the fillet.

7. The light emitting device of claim 1 , wherein the fillet and the at least one LED are each disposed along a planar surface of the submount.

Assignments (5)
PATENT SECURITY AGREEMENT Recorded Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; SMART MODULAR TECHNOLOGIES, INC.; PENGUIN COMPUTING, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →
RELEASE OF PATENT SECURITY INTEREST RECORDED AT R/F 058983/0001 Recorded Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
SECURITY INTEREST Recorded Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 31, 2021
From: CREE, INC.
To: CREELED, INC.
Reel/Frame 055780/0121 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 14, 2015
From: HUSSELL, CHRISTOPHER P.
To: CREE, INC.
Reel/Frame 034711/0620 →