LED apparatuses and methods for high lumen output density
Light emitting diode (LED) apparatuses and methods having a high lumen output density. An example apparatus can include a substrate with one or more LEDs enclosed by an encapsulant. The encapsulant comprises beveled edges and/or top surface facets. By providing facets in the encapsulant and minimizing the chip-to-area ratio through efficient via placement, a high lumen density is achieved. Facets and bevels can be created by removing material from the encapsulant with a beveled blade.
1. A light emitting diode (LED) apparatus, comprising:
a substrate having a total upper surface area and electrical vias connecting an upper surface and a lower surface of the substrate;
one or more LEDs disposed over the substrate such that each of the vias is disposed under and covered by a respective one of the one or more LEDs; and
a light-transmissive encapsulant disposed over the one or more LEDs,
wherein the LED apparatus is configured to emit light with a lumen output density of at least 200 lumens per square mm, and
wherein a ratio of LED area to the total upper surface area of the substrate is equal to or greater than 0.50, wherein the LED area is defined by a footprint of the one or more LEDs; and
wherein the top surface of the encapsulant comprises at least one faceted recess that extends to a depth within the encapsulant that is coincident with a top surface of the one or more LEDs.
2. The LED apparatus of claim 1 , wherein a top surface of the encapsulant is substantially flat.
3. The LED apparatus of claim 1 , wherein the lumen output density is at least 230 lumens per square mm.
4. The LED apparatus of claim 1 , wherein the lumen output density is at least 260 lumens per square mm.
5. The LED apparatus of claim 1 , wherein a ratio of LED area to the total upper surface area is equal to or greater than 0.75.
6. The LED apparatus of claim 1 , wherein the one or more LEDs comprises a plurality of LEDs.
7. The LED apparatus of claim 6 , wherein the plurality of LEDs are arranged in a linear array.
8. The LED apparatus of claim 6 , wherein the plurality of LEDs are arranged in a rectangular array.
9. A light emitting diode (LED) apparatus, comprising:
a substrate having a total upper surface area;
one or more LEDs disposed over the substrate; and
a light-transmissive encapsulant disposed over the one or more LEDs, wherein an outermost top surface of the encapsulant is substantially flat and comprises at least one faceted recess that extends to a depth within the encapsulant that is coincident with a top surface of the one or more LEDs, and
wherein a ratio of LED area to the total upper surface area of the substrate is equal to or greater than 0.50, wherein the LED area is defined by a footprint of the one or more LEDs.
10. The LED apparatus of claim 9 , further comprising beveled walls on a perimeter of the encapsulant, wherein the beveled walls are coincident with edges of the substrate.
11. The LED apparatus of claim 9 , wherein the at least one faceted recess is in the form of a V-shaped linear channel.
12. The LED apparatus of claim 9 , wherein a ratio of LED area to the upper surface area is equal to or greater than 0.75.
13. The LED apparatus of claim 9 , wherein the one or more LEDs comprises a plurality of LEDs.
14. The LED apparatus of claim 13 , wherein the plurality of LEDs are arranged in a linear array.
15. The LED apparatus of claim 13 , wherein the plurality of LEDs are arranged in a rectangular array.