Leadframe based light emitter components and related methods

1. A leadframe based light emitter component comprising:

a leadframe element;

at least one light emitting diode (LED) chip connected to a first portion of the leadframe element;

an electrical device connected to a second portion of the leadframe element; and

a molded body disposed around the first portion of the leadframe element and the LED chip connected thereto, wherein the molded body encases the second portion of the leadframe element and a portion of the electrical device connected thereto.

2. The component of claim 1 , wherein the electrical device is fully encased by the molded body other than at the leadframe element to which the electrical device is connected.

3. The component of claim 1 , wherein the electrical device comprises a non-light emitting device.

4. The component of claim 1 , wherein the electrical device comprises one or more of an electrostatic discharge (ESD) protection device, a surge protection device, a resistor, a rectifier, a capacitor, a thermistor, an inverter, a transistor, a wire, a lead, a socket, and/or a connector.

5. The component of claim 1 , wherein the electrical device is wire bonded to the leadframe element.

6. The component of claim 1 , wherein the electrical device is directly attached to two or more portions of the leadframe element.

7. The component of claim 1 , wherein the molded body comprises plastic, polymer, silicone, epoxy, sheet molding compound (SMC), and/or epoxy molding compound (EMC).

8. The component of claim 1 , wherein the molded body comprises a molded cup.

9. The component of claim 1 , wherein the molded body is transparent.

10. The component of claim 1 , wherein the molded body is opaque.

11. The component of claim 1 , wherein the at least one LED chip is configured to emit light that is blue, red, or green.

12. The component of claim 1 , further comprising multiple light emitting diode (LED) chips electrically connected to the leadframe element.

13. The component of claim 1 , further comprising multiple electrical devices connected to multiple leadframe elements, wherein the molded body comprises a molded cup that encases portions of the multiple leadframe elements and multiple electrical devices attached to the leadframe elements such that the multiple electrical devices are concealed from view.

14. A method of providing a leadframe based light emitter component, the method comprising:

providing a leadframe element;

connecting at least one light emitting diode (LED) chip to a first portion of the leadframe element;

connecting an electrical device to a second portion of the leadframe element; and

molding a body around the first portion of the leadframe element and the LED chip connected thereto, and molding the body over the second portion of the leadframe element and the electrical device connected thereto.

15. The method of claim 14 , wherein the electrical device comprises a non-light emitting device.

16. The method of claim 14 , wherein the electrical device comprises one or more of an electrostatic discharge (ESD) protection device, a surge protection device, a resistor, a rectifier, a capacitor, a thermistor, an inverter, a transistor, a wire, a lead, a socket, and/or a connector.

17. The method of claim 14 , further comprising wire bonding the electrical device to the leadframe element.

18. The method of claim 14 , further comprising directly attaching the electrical device to two or more portions of the leadframe element.

19. The method of claim 14 , wherein molding the molded body comprises molding a body from plastic, polymer, silicone, epoxy, sheet molding compound (SMC), and/or epoxy molding compound (EMC).

20. The method of claim 14 , wherein the molded body is opaque.

21. The method of claim 14 , wherein the molded body is transparent.

22. The method of claim 14 , wherein the at least one LED chip is configured to emit light that is blue, red, or green.

23. The method of claim 14 , further comprising connecting a plurality of electrical devices to a plurality of leadframe elements, and molding the molded body as a molded cup over at least portions of the plurality of electrical devices and the plurality of leadframe elements.

24. A leadframe based light emitter component comprising:

a leadframe element, wherein some portions of the leadframe element are disposed within a molded cup and other portions of the leadframe element are disposed outside of the molded cup;

a light emitting diode (LED) chip attached to an unmolded portion of the leadframe element; and

an electrical device connected to the leadframe element and disposed within and covered by the molded cup.

25. The component of claim 24 , wherein the electrical device is a non-light emitting device.

26. The component of claim 24 , wherein the electrical device comprises one or more of an electrostatic discharge (ESD) protection device, a surge protection device, a resistor, a rectifier, a capacitor, a thermistor, an inverter, a transistor, a wire, a lead, a socket, and/or a connector.

27. The component of claim 24 , further comprising two or more electrical devices attached to the leadframe element and disposed within and covered by the molded cup.

28. The component of claim 24 , wherein the light emitting diode (LED) chip attached to an unmolded portion of the leadframe element is a wire bonded light emitting diode (LED) chip.

29. The component of claim 24 , wherein the light emitting diode (LED) chip attached to an unmolded portion of the leadframe element is a direct attach light emitting diode (LED) chip that bridges a gap between portions of the leadframe element.

30. A leadframe based light emitter component comprising:

multiple leadframe elements;

multiple electrical devices connected to the multiple leadframe elements; and

a molded body comprising a molded cup, wherein the molded body encases portions of the multiple leadframe elements and the multiple electrical devices attached to the multiple leadframe elements such that the multiple electrical devices are concealed from view.

31. A method of providing a leadframe based light emitter component, the method comprising:

providing a plurality of leadframe elements;

connecting a plurality of electrical devices to the plurality of leadframe elements; and

molding a body comprising a molded cup, wherein the molded body is disposed over at least portions of the plurality of electrical devices and the plurality of leadframe elements such that the plurality of electrical devices are concealed from view.