Method of providing light emitting device
View Patent ↗Light emitting devices and methods are disclosed. In one embodiment a light emitting device can include a submount and a plurality of light emitting diodes (LEDs) disposed over the submount. At least a portion of the submount can include a reflective layer at least partially disposed below a solder mask. One or more layers within the submount may include one or more holes, a rough surface texture, or combinations thereof to improve adhesion within the device. The device can further include a retention material dispensed about the plurality of LEDs. Devices and methods are disclosed for improved solder mask adhesion.
1. A method of providing a light emitting device, the method comprising:
providing a submount for supporting one or more light emitting diodes (LEDs);
wherein providing the submount comprises:
depositing a conductive layer;
depositing a reflective layer over the conductive layer;
forming at least one hole in the reflective layer; and
depositing a layer of solder mask over the reflective layer such that at least a portion of the solder mask is disposed in the at least one hole.
2. The method of claim 1 , wherein depositing the conductive layer comprises depositing a copper (Cu) layer.
3. The method of claim 1 , wherein depositing the reflective layer comprises depositing a silver (Ag) layer.
4. The method of claim 1 , further comprising depositing a barrier layer between the conductive layer and the reflective layer.
5. The method of claim 4 , wherein depositing the barrier layer comprises depositing a nickel (Ni) layer.
6. The method of claim 1 , wherein forming the at least one hole comprises chemically etching the hole.
7. The method of claim 1 , etching the hole comprises etching the reflective layer such that the hole terminates at an upper surface of the conductive layer.
8. The method of claim 1 , further comprising a dielectric layer.
9. The method of claim 8 , wherein forming the at least one hole comprises chemically etching the reflective layer and the conductive layer, such that the reflective layer and the conductive layer together form a sidewall of the hole.
10. The method of claim 9 , wherein the at least one hole terminates at an upper surface of the dielectric layer.
11. The method of claim 1 , further comprising forming a plurality of holes in the reflective layer.
12. The method of claim 11 , wherein forming the plurality of holes comprises forming a matrix of holes.
13. The method of claim 11 , wherein forming the plurality of holes comprises forming a random pattern of holes.
14. The method of claim 11 , wherein forming the plurality of holes comprises forming the plurality of holes along an edge of the reflective layer.
15. The method of claim 11 , wherein forming the plurality of holes comprises forming at least one of a circle, square, star, asymmetric shaped hole, or combinations thereof.
16. The method of claim 1 , wherein forming the at least one hole comprises chemically etching at least one hole having depth ranging between approximately 0.2 and 500 micrometers (μm).