Light emitting diode (LED) components and methods
Light emitting diode (LED) components and related methods are disclosed. LED components include a submount, at least one LED chip on a first surface of the submount, and a light permeable structure or dam. The light permeable dam can provide a component having a viewing angle that is greater than 115°. A method of providing an LED component includes providing a non-metallic submount, attaching at least one LED chip to a first surface of the submount, and dispensing a light permeable dam over the first surface of the submount about the at least one LED chip thereby providing a component having a viewing angle that is greater than 115°.
1. A method of providing a light emitting diode (LED) component, the method comprising:
providing a submount;
depositing one or more electrical traces onto a first surface of the submount;
attaching at least one LED chip onto the first surface of the submount;
electrically connecting the at least one LED chip to at least one of the one or more electrical traces;
dispensing a light permeable dam onto the one or more electrical traces and onto the first surface of the submount and laterally spaced around the at least one LED chip, such that the dam is arranged only around a perimeter of the at least one LED chip; and
dispensing a filler material between surfaces of the dam and between the at least one LED chip and the dam;
wherein the dam covers the one or more electrical traces and the first surface is devoid of any electrical traces that are outside the dam.
2. The method of claim 1 , where the component comprises a viewing angle that is approximately 120° or more.
3. The method of claim 1 , wherein the component comprises a viewing angle that is approximately 140° or more.
4. The method of claim 1 , wherein the component comprises a viewing angle that is approximately 160° or more.
5. The method of claim 1 , wherein dispensing the light permeable dam comprises dispensing clear silicone having one or more fillers or binders disposed therein.
6. The method of claim 5 , wherein the one or more binders or fillers comprises fumed silica, silica gel, nanomaterials, ceramic nanoparticles, ceramic micro-particles, quantum dots, phosphor, ceramic fibers, non-ceramic fibers, or any combination thereof.
7. The method of claim 1 , wherein the light permeable dam is non-reflective.
8. A method of providing a light emitting diode (LED) component, the method comprising:
providing a submount;
depositing a plurality of electrical traces onto a first surface of the submount;
attaching at least one LED chip onto the first surface of the submount,
electrically connecting the at least one LED chip to one or more of the plurality of electrical traces;
dispensing a dam onto the plurality of electrical traces and onto the first surface of the submount and laterally spaced around the at least one LED chip, such that the dam is arranged only around a perimeter of the at least one LED chip; and
dispensing a filler material between surfaces of the dam and between the at least one LED chip and the dam;
wherein the dam covers the plurality of electrical traces and first portions of the dam that are on first opposing sides of the at least one LED chip are permeable to light from the at least one LED chip and second portions of the dam that are on second opposing sides of the at least one LED chip are more reflective or more opaque to light from the at least one LED chip than the first portions of the dam.
9. The method of claim 8 , wherein the component comprises a viewing angle that is approximately 120° or more.
10. The method of claim 8 , wherein the component comprises a viewing angle that is approximately 140° or more.
11. The method of claim 8 , wherein the component comprises a viewing angle that is approximately 160° or more.
12. The method of claim 8 , wherein dispensing the dam comprises dispensing clear silicone having one or more fillers or binders disposed therein.
13. The method of claim 12 , wherein the one or more binders or fillers comprises fumed silica, silica gel, nanomaterials, ceramic nanoparticles, ceramic micro-particles, quantum dots, phosphor, ceramic fibers, non-ceramic fibers, or any combination thereof.
14. The method of claim 8 , wherein dispensing the filler material comprises dispensing the filler material over the at least one LED chip.
15. The method of claim 8 , wherein the first portions of the dam are non-reflective.
16. The method of claim 8 , wherein the component comprises a viewing angle that is greater than 115°.
17. The method of claim 1 , wherein the component comprises a viewing angle that is greater than 115°.
18. The method of claim 1 , wherein dispensing the filler material comprises dispensing the filler material over the at least one LED chip.
19. The method of claim 1 , wherein the one or more electrical traces are deposited onto the first surface of the submount via sputtering, electroplating, electroless plating, lithography processing, photoresist processing, stenciling, or chemical, plasma, vapor, and/or physical deposition.
20. The method of claim 8 , wherein the plurality of electrical traces are deposited onto the first surface of the submount via sputtering, electroplating, electroless plating, lithography processing, photoresist processing, stenciling, or chemical, plasma, vapor, and/or physical deposition.