Light emitting device packages with improved heat transfer
View Patent ↗Packages containing one or more light emitting devices, such as light emitting diodes (LEDs), are disclosed. In one embodiment, LED package can include a thermal element having improved solder reliability to improve heat dissipation capacity of the LED package. LED package can include a molded plastic body having one or more LEDs attached to one or more electrical elements. The LEDs can be connected to an upper surface of the thermal element. The thermal element can include a bottom surface which can extend further away in distance from a body of the LED package than a bottom surface of the electrical element. This configuration can result in an improved connection between the LED package and an external circuitry source, thereby increasing heat transfer ability of the LED package.
1. A light emitting device package, the package comprising:
a body comprising at least a portion of a thermal element and at least a portion of an electrical element, the electrical element contained between lateral sides of the body without extending beyond the lateral sides of the body;
at least one light emitting device mounted on a top surface of the body; and
both the thermal element and the electrical element extending from a bottom surface of the body wherein a bottom surface of the electrical element extends away from the body a first distance, and a bottom surface of the thermal element extends away from the body a second distance that is greater than the first distance.
2. The light emitting device package according to claim 1 , further comprising a lens.
3. The light emitting device package according to claim 1 , wherein the second distance is greater than the first distance by from about 0 μm to about 100 μm.
4. The light emitting device package according to claim 1 , wherein the second distance is greater than the first distance by greater than about 100 μm.
5. The light emitting device package according to claim 1 , wherein the body comprises an insulating material.
6. The light emitting device package of claim 1 , wherein the electrical element extends to a first plane and the thermal element extends to a second plane which is lower than the first plane.
7. The light emitting device package of claim 1 , wherein the body comprises a reflector cavity.
8. A light emitting device package, the package comprising:
a body comprising at least a portion of a thermal element and at least a portion of an electrical element, the electrical element and the thermal element both contained between lateral sides of the body without extending beyond the lateral sides of the body;
at least one light emitting device thermally connected with the thermal element; and
both the thermal element and the electrical element extending from a bottom surface of the body wherein a bottom surface of the electrical element extends away from the body a first distance, and a bottom surface of the thermal element extends away from the body a second distance that is greater than the first distance.
9. The light emitting device package according to claim 8 , further comprising a lens.
10. The light emitting device package according to claim 8 , wherein the second distance is greater than the first distance by from about 0 μm to about 100 μm.
11. The light emitting device package according to claim 8 , wherein the second distance is greater than the first distance by greater than about 100 μm.
12. The light emitting device package according to claim 8 , wherein the body comprises an insulating material.
13. The light emitting device package of claim 8 , wherein the electrical element extends to a first plane and the thermal element extends to a second plane which is lower than the first plane.
14. The light emitting device package of claim 8 , wherein the body comprises a reflector cavity.
15. A light emitting device package, the package comprising:
a body comprising a first surface and a second surface;
at least one light emitting device mounted on the first surface of the body;
an electrical element contained between lateral sides of the body without extending beyond the lateral sides of the body, wherein at least a portion of the electrical element is exposed on the second surface of the body;
the electrical element having an electrical element bottom surface that is disposed along a first plane; and
a thermal element with a thermal element bottom surface that is disposed along a second plane that is different from the first plane.
16. The light emitting device package of claim 15 , wherein the portion of the electrical element exposed on the second surface is flush with the second surface.
17. The light emitting device package of claim 15 , wherein the portion of the electrical element exposed on the second surface extends away from the second surface a distance that is less than a distance the thermal element extends away from the second surface.
18. A light emitting device package, the package comprising:
a body comprising a first surface and a second surface;
at least one light emitting device electrically connected to an anode and a cathode on the first surface of the body;
at least one electrical element on the second surface of the body that is electrically connected to at least one of the anode and cathode;
a thermal element on the second surface of the body; and
wherein the at least one electrical element extends away from the second surface of the body a first distance and the thermal element extends away from the second surface of the body a second distance that is greater than the first distance.