Encapsulant profile for light emitting diodes
View Patent ↗A light emitting packaged diode ids disclosed that includes a light emitting diode mounted in a reflective package in which the surfaces adjacent the diode are near-Lambertian reflectors. An encapsulant in the package is bordered by the Lambertian reflectors and a phosphor in the encapsulant converts frequencies emitted by the LED chip and, together with the frequencies emitted by the LED chip, produces white light. A substantially flat meniscus formed by the encapsulant defines the emitting surface of the packaged diode.
1. A light emitting packaged diode comprising:
a light emitting diode chip mounted in a reflective package in which the surfaces of the reflective package adjacent said diode are near-Lambertian reflectors;
an encapsulant in said package and bordered by said near-Lambertian reflectors;
a phosphor in said encapsulant that converts frequencies emitted by said chip and that together with the frequencies emitted by said chip produces white light; and
a domed meniscus that does not exceed 50 microns from said reflective package, said meniscus formed by said encapsulant and said package, said meniscus defining the emitting surface of said packaged diode.
2. A packaged diode according to claim 1 comprising a light emitting diode chip with a near-Lambertian far field pattern.
3. A packaged diode according to claim 1 wherein said encapsulant comprises a plurality of layers of said encapsulant.
4. A light emitting packaged diode according to claim 1 wherein said light emitting diode is formed from the Group III nitride material system.
5. A light emitting packaged diode according to claim 1 wherein said phosphor comprises cerium doped yttrium aluminum garnet.
6. A light emitting packaged diode according to claim 1 wherein said reflective package comprises a white resin.
7. A light emitting packaged diode according to claim 1 wherein said encapsulant includes a diffuser.
8. A light emitting packaged diode according to claim 1 wherein said encapsulant comprises a polysiloxane resin.
9. A display that incorporates the packaged diode of claim 1 in a side view surface mount orientation in combination with a light guide.
10. A light emitting packaged diode comprising:
a light emitting diode chip mounted in a side view surface mount reflective package in which the surfaces of the reflective package adjacent said diode are near-Lambertian reflectors;
an encapsulant in said package and bordered by said near-Lambertian reflectors;
a phosphor in said encapsulant that converts frequencies emitted by said chip and that together with the frequencies emitted by said chip produces white light; and
a domed meniscus that does not exceed 50 microns from said reflective package, said meniscus formed by said encapsulant and said package, said meniscus defining the emitting surface of said packaged diode.
11. A packaged diode according to claim 10 comprising a light emitting diode with a near-Lambertian far field pattern.
12. A packaged diode according to claim 10 wherein said encapsulant comprises a plurality of layers of said encapsulant.
13. A light emitting packaged diode according to claim 10 wherein said light emitting diode is formed from the Group III nitride material system.
14. A light emitting packaged diode according to claim 10 wherein said phosphor comprises cerium doped yttrium aluminum garnet.
15. A light emitting packaged diode according to claim 10 wherein said reflective package comprises a white resin.
16. A light emitting packaged diode according to claim 10 wherein said encapsulant includes a diffuser.
17. A light emitting packaged diode according to claim 10 wherein said encapsulant comprises a polysiloxane resin.
18. A light emitting packaged diode according to claim 10 wherein said phosphor is positioned to cover only the emissive area of said chip.
19. A lighted display comprising:
a light guide;
at least one packaged light emitting diode along one edge of said light guide;
said packaged diode including,
a reflective package with near-Lambertian reflectors,
a light emitting diode chip in said reflective package,
an encapsulant in said package and covering said chip,
a phosphor in said encapsulant that converts frequencies emitted by said chip and that together with the frequencies emitted by said chip produce white light, and
a domed meniscus that does not exceed 50 microns from said reflective package, said meniscus formed by said encapsulant and said package, said meniscus defining the emitting surface of said packaged diode against the edge of said light guide.
20. A lighted display according to claim 19 wherein said packaged diode is a side view surface mount package with a rectangular profile with the light emitting surface of said domed encapsulant forming an arc-shaped profile that extends in the direction of primary emission of said chip and toward said edge of said light guide.
21. A lighted display according to claim 19 wherein said diode chip is formed from the Group III nitride material system.
22. A lighted display according to claim 19 wherein said reflective package is a white polymer resin.
23. A lighted display according to claim 19 including at least two packaged light emitting diodes along at least one edge of said light guide.
24. A lighted display according to claim 23 wherein said light guide is rectangular and has substantially planar dimensions.
25. A lighted display according to claim 19 wherein said encapsulant is a polysiloxane resin.
26. A lighted display according to claim 19 wherein said phosphor comprises cerium-doped yttrium aluminum garnet.
27. A light emitting packaged diode according to claim 1 , wherein:
said package defines a top surface; and
said meniscus is maintained within 50 microns of a plane defined by the top surface of said package.
28. A light emitting packaged diode according to claim 10 , wherein:
said package defines a top surface; and
said meniscus is maintained within 50 microns of a plane defined by the top surface of said package.
29. A lighted display according to claim 19 , wherein:
said package defines a top surface; and
said meniscus is maintained within 50 microns of a plane defined by the top surface of said package.
30. A packaged diode according to claim 1 wherein said domed meniscus does not exceed 50 microns from a top surface of said reflective package.
31. A packaged diode according to claim 10 wherein said domed meniscus does not exceed 50 microns from a top surface of said reflective package.
32. A lighted display according to claim 19 wherein said domed meniscus does not exceed 50 microns from top surface of said reflective package.