Patent Assignment
Reel/Frame 057017/0311
Assignment of Assignor's Interest
Recorded: 2021-07-29
Pages: 246
Assignor
CREE, INC.
Executed: 2021-03-01
Assignee
CREELED, INC.
4400 SILICON DRIVE, DURHAM, NORTH CAROLINA, 27703
Covered Properties
(254)
Multiple Component Solid State White Light
Saturated phosphor solid state emitter
Application:
10/461,561 →
Publication:
US 2004/0012027
Enhanced Light Extraction in Leds Through the Use of Internal and External Optical Elements
Molded Chip Fabrication Method
Light Emitting Diode with Porous Sic Substrate and Method for Fabricating
Composite White Light Source and Method for Fabricating
High powered light emitter packages with compact optics
Lift-Off Process for Gan Films Formed on Sic Substrates and Devices Fabricated Using the Method
Method for Fabricating Group-Iii Nitride Devices and Devices Fabricated Using Method
Methods of Coating Semiconductor Light Emitting Elements by Evaporating Solvent from a Suspension
Light Emission Device and Method Utilizing Multiple Emitters and Multiple Phosphors
Substrate Removal Process for High Light Extraction Leds
Led with Substrate Modifications for Enhanced Light Extraction and Method of Making Same
Power lamp package
High power solid-state lamp
Roughened High Refractive Index Layer/Led for High Light Extraction
Led with Substrate Modifications for Enhanced Light Extraction and Method of Making Same
High Efficacy White Led
Side-Emitting Optical Coupling Device
Method for Coating Semiconductor Device Using Droplet Deposition
External Extraction Light Emitting Diode Based Upon Crystallographic Faceted Surfaces
Multiple Component Solid State White Light
High Efficiency Led with Tunnel Junction Layer
Apparatus and Method for Use in Mounting Electronic Elements
Uniform Emission Led Package
Multi-Element Led Lamp Package
System for and Method for Closed Loop Electrophoretic Deposition of Phosphor Materials on Semiconductor Devices
Efficient Emitting Led Package and Method for Efficiently Emitting Light
Light Emitting Diode Package Element with Internal Meniscus for Bubble Free Lens Placement
Light emitting diode package with optical element
Light Emitting Diode with High Aspect Ratio Submicron Roughness for Light Extraction and Methods of Forming
Quantum wells for light conversion
Semiconductor Devices Having Low Threading Dislocations and Improved Light Extraction and Methods of Making the Same
Permanent wafer bonding using metal alloy preform discs
Expandable Led Array Interconnect
Laser Diode and Method for Fabricating Same
Group-Iii Nitride Based Laser Diode and Method for Fabricating Same
Self Aligned Diode Fabrication Method and Self Aligned Laser Diode
High Performance Led Package
Wafer Level Phosphor Coating Method and Devices Fabricated Utilizing Method
Transparent Led Chip
Dielectric wafer level bonding with conductive feed-throughs for electrical connection and thermal management
Transparent ohmic Contacts on Light Emitting Diodes with Carrier Substrates
Side-View Surface Mount White Led
Multi-Chip Light Emitting Device Lamps for Providing High-Cri Warm White Light and Light Fixtures Including the Same
LED Chip Design for White Conversion
Methods of Coating Semiconductor Light Emitting Elements by Evaporating Solvent from a Suspension
Encapsulant with Scatterer to Tailor Spatial Emission Pattern and Color Uniformity in Light Emitting Diodes
Phosphor Position in Light Emitting Diodes
Encapsulant Profile for Light Emitting Diodes
Led with Integrated Constant Current Driver
Method of Uniform Phosphor Chip Coating and Led Package Fabricated Using Method
Wafer level phosphor coating method and devices fabricated utilizing method
Polarization Doping in Nitride Based Diodes
Phosphor Distribution in Led Lamps Using Centrifugal Force
Multiple Conversion Material Light Emitting Diode Package and Method of Fabricating Same
Light Emitting Diode Package and Method for Fabricating Same
Wire bond free wafer level LED
Textured encapsulant surface in LED packages
Flip-Chip Phosphor Coating Method and Devices Fabricated Utilizing Method
Ohmic Contacts to Nitrogen Polarity Gan
Illumination Devices Using Externally Interconnected Arrays of Light Emitting Devices, and Methods of Fabricating Same
Low Index Spacer Layer in Led Devices
Leds Using Single Crystalline Phosphor and Methods of Fabricating Same
Encapsulation for phosphor-converted white light emitting diode
Solid State Lighting Component
Solid State Lighting Component
Improved Bond Pad Design for Enhancing Light Extraction from Led Chips
LED chips having fluorescent substrates with microholes and methods for fabricating
Wafer Level Phosphor Coating Technique for Warm Light Emitting Diodes
Light Emitter Array
Composite High Reflectivity Layer
Color Correction for Wafer Level White Leds
Light Emitting Diode with Improved Light Extraction
Light Emitting Diode with a Dielectric Mirror Having a Lateral Configuration
Led with substrate modifications for enhanced light extraction and method of making same
Emission Tuning Methods and Devices Fabricated Utilizing Methods
High Voltage Low Current Surface-Emitting Led
Light Emission Device and Method Utilizing Multiple Emitters
Semiconductor Light Emitting Diodes Having Reflective Structures and Methods of Fabricating Same
Light Source with Near Field Mixing
Method for Coating Semiconductor Device Using Droplet Deposition
Led Packages with Scattering Particle Regions
High Reflectivity Mirrors and Method for Making Same
Solid State Emitter Package Including Red and Blue Emitters
Apparatus and Method for Use in Mounting Electronic Elements
Light Emitter Array Layout for Color Mixing
Side-View Surface Mount White Led
Saturated Yellow Phosphor Converted Led and Blue Converted Red Led
High Cri Lighting Device with Added Long-Wavelength Blue Color
Efficient Emitting Led Package and Method for Efficiently Emitting Light
High Reflective Substrate of Light Emitting Devices with Improved Light Output
Led Package with Increased Feature Sizes
Lighting Device
White-Emitting Led Chips and Method for Making Same
High Efficiency Leds with Tunnel Junctions
Led with Substrate Modifications for Enhanced Light Extraction and Method of Making Same
Laser Diode and Method for Fabricating Same
External Extraction Light Emitting Diode Based Upon Crystallographic Faceted Surfaces
Multiple Component Solid State White Light
Group-Iii Nitride Based Laser Diode and Method for Fabricating Same
Solid State Lighting Component
Multi-Element Led Lamp Package
High Voltage Wire Bond Free Leds
Multi-Chip Light Emitting Device Lamps for Providing High-Cri Warm White Light and Light Fixtures Including the Same
Leds Using Single Crystalline Phosphor and Methods of Fabricating Same
High Power Leds with Non-Polymer Material Lenses and Methods of Making the Same
Solid State Emitter Packages Including Accessory Leads
Conformally Coated Light Emitting Devices and Methods for Providing the Same
Color Correction for Wafer Level White Leds
Lighting Device with Flexibly Coupled Heatsinks
Lateral Semiconductor Light Emitting Diodes Having Large Area Contacts
High Cri Lighting Device with Added Long-Wavelength Blue Color
Encapsulant Profile for Light Emitting Diodes
Light Emitting Diode with High Aspect Ratio Submicron Roughness for Light Extraction and Methods of Forming
Side View Surface Mount Led
Encapsulant with Index Matched Thixotropic Agent
Composite High Reflectivity Layer
Molded Chip Fabrication Method and Apparatus
Substrate Removal Process for High Light Extraction Leds
Led Structure with Enhanced Mirror Reflectivity
High Voltage Low Current Surface Emitting LED
White Leds with Emission Wavelength Correction
Method for Coating Semiconductor Device Using Droplet Deposition
High Efficiency Leds
Light Emission Device
Solid State Lighting Device Including Multiple Wavelength Conversion Materials
Complex Primary Optics with Intermediate Elements
Led with Integrated Constant Current Driver
Side View Surface Mount Led
High Reflective Board or Substrate for Leds
Lighting Device Including Multiple Wavelength Conversion Material Layers
Lighting Device Including Multiple Encapsulant Material Layers
Composite High Reflectivity Layer
Phosphor Distribution in Led Lamps Using Centrifugal Force
Solid State Lighting Device Including Green Shifted Red Component
Light Emitting Devices Including Multiple Anodes and Cathodes
Solid State Lighting Component
Led with Integrated Constant Current Driver
Light Emitting Diode Primary Optic for Beam Shaping
Wafer Level Packaging of Light Emitting Diodes (Leds)
Led Package with Encapsulant Having Planar Surfaces
Led Package with Multiple Element Light Source and Encapsulant Having Planar Surfaces
Multi-Element Led Lamp Package
Led with Integrated Constant Current Driver
Solid State Lighting Apparatuses and Related Methods
Solid State Lighting Apparatuses and Related Methods
Wafer Level Packaging of Multiple Light Emitting Diodes (Leds) on a Single Carrier Die
Tilted Emission Led Array
Quantum Dot Narrow-Band Downconverters for High Efficiency LEDs
Multi-Chip Light Emitting Device Lamps for Providing High-Cri Warm White Light and Light Fixtures Including the Same
Light Emitting Diode Dielectric Mirror
Solid State Lighting Devices and Fabrication Methods Including Deposited Light-Affecting Elements
Led Package with Encapsulant Having Curved and Planar Surfaces
Solid State Lighting Component
Side-Emitting Optical Coupling Device
Solid State Lighting Apparatus with High Scotopic / Photopic (S/P) Ratio
Composite High Reflectivity Layer
High Voltage Monolithic Led Chip
Multi-Element Led Lamp
Wafer Level Contact Pad Solder Bumping for Surface Mount Devices with Non-Planar Recessed Contacting Surfaces
Lateral Semiconductor Light Emitting Diodes Having Large Area Contacts
Molded Chip Fabrication Method and Apparatus
Solid State Lighting Devices Incorporating Notch Filtering Materials
Solid State Light-Emitting Devices with Improved Contrast
Solid State Lighting Devices with Color Point Non-Coincident with Blackbody Locus
Method to Form Primary Optic with Variable Shapes and/or Geometries Without a Substrate
Multi-Layer Conversion Material for Down Conversion in Solid State Lighting
Group Iii Nitride Based Led Structures Including Multiple Quantum Wells with Barrier-Well Unit Interface Layers
Patent:
9,985,168 →
Application:
14/546,524 →
Non-Magnified Led for High Center-Beam Candle Power
Application:
14/633,734 →
Publication:
US 2016/0254423
Led Package with Encapsulant Having Planar Surfaces
Graded Vias for Led Chip P- and N- Contacts
Patent:
9,412,907 →
Application:
14/690,284 →
Multi-Segment Monolithic Led Chip
High Voltage Monolithic Led Chip with Improved Reliability
Light Emitting Diode Package and Method for Fabricating Same
High Density Pixelated Led and Devices and Methods Thereof
High Density Pixelated Led and Devices and Methods Thereof
Formation of Nitride-Based Optoelectronic and Electronic Device Structures on Lattice-Matched Substrates
Application:
15/459,161 →
Publication:
US 2017/0186913
Illumination Devices, and Methods of Fabricating Same
Wafer Level Packaging of Light Emitting Diodes (Leds)
High Voltage Monolithic Led Chip
Light Emitting Diodes, Components and Related Methods
Light Emitting Devices Including Narrowband Converters for Outdoor Lighting Applications
Solid State Lighting Devices with Opposing Emission Directions
Light-Emitting Diode Package with Light-Altering Material
Group Iii Nitride Based Led Structures Including Multiple Quantum Wells with Barrier-Well Unit Interface Layers
High Density Pixelated-Led Chips and Chip Array Devices
Light-Emitting Diodes, Light-Emitting Diode Arrays and Related Devices
Group Iii Nitride Led Structures with Improved Electrical Performance
High Voltage Monolithic Led Chip
High Density Pixelated-Led Chips and Chip Array Devices
Light Emitting Diode Packages
Interconnects for Light Emitting Diode Chips
Pixelated-Led Chips and Chip Array Devices, and Fabrication Methods
Light Emitting Diode Packages
Group Iii Nitride Based Led Structures Including Multiple Quantum Wells with Barrier-Well Unit Interface Layers
High Voltage Monolithic Led Chip with Improved Reliability
Molded Chip Fabrication Method and Apparatus
Application:
16/293,267 →
Publication:
US 2019/0198725
Active Control of Light Emitting Diodes and Light Emitting Diode Displays
Light Emitting Diodes, Components and Related Methods
Active Control of Light Emitting Diodes and Light Emitting Diode Displays
High Density Pixelated Led and Devices and Methods Thereof
Active Control of Light Emitting Diodes and Light Emitting Diode Displays
Active Control of Light Emitting Diodes and Light Emitting Diode Displays
Active Control of Light Emitting Diodes and Light Emitting Diode Displays
Light-Emitting Diodes, Light-Emitting Diode Arrays and Related Devices
Led Package with Multiple Element Light Source and Encapsulant Having Curved and/or Planar Surfaces
Light-Emitting Diode Package with Light-Altering Material
Submount Structures for Light Emitting Diode Packages
Light Emitting Diodes, Components and Related Methods
Illumination Devices Using Externally Interconnected Arrays of Light Emitting Devices, and Methods of Fabricating Same
Active Control of Light Emitting Diodes and Light Emitting Diode Displays
Light-Emitting Diode Chip with Electrical Overstress Protection
Active Electrical Elements with Light-Emitting Diodes
Lens Arrangements for Light-Emitting Diode Packages
High Voltage Monolithic Led Chip with Improved Reliability
High Density Pixelated Led and Devices and Methods Thereof
Reflective Layers for Light-Emitting Diodes
High Density Pixelated-Led Chips and Chip Array Devices
Interconnects for Light Emitting Diode Chips
Pixelated-Led Chips and Chip Array Devices, and Fabrication Methods
Light-Emitting Diode Package with Light-Altering Material
Spacer Layer Arrangements for Light-Emitting Diodes
High Voltage Monolithic Led Chip
Pixelated-Led Chips with Inter-Pixel Underfill Materials, and Fabrication Methods
Active Control of Light Emitting Diodes and Light Emitting Diode Displays
Texturing for High Density Pixelated-Led Chips and Chip Array Devices
Cover Structure Arrangements for Light Emitting Diode Packages
Application:
17/103,121 →
Publication:
US 2022/0165923
Wafer Level Packaging of Light Emitting Diodes (Leds)
Light Emitting Diodes, Components and Related Methods
Support Structures for Light Emitting Diode Packages
Light Emitting Diode Package and Method for Fabricating Same
Pixelated-Led Chips and Chip Array Devices, and Fabrication Methods
Optical Arrangements in Cover Structures for Light Emitting Diode Packages and Related Methods
Application:
17/173,735 →
Publication:
US 2022/0254962
Led Chips with Irregular Microtextured Light Extraction Surfaces, and Fabrication Methods
Emitter Package
Patent:
615,504 →
Application:
29/292,900 →
Led Component
Patent:
700,584 →
Application:
29/396,759 →
Light Emitting Diode (Led) Package with Multiple Anodes and Cathodes
Patent:
712,849 →
Application:
29/420,874 →
Light Emitting Diode (Led) Package with Multiple Anodes and Cathodes
Patent:
713,804 →
Application:
29/420,876 →
Led Package
Patent:
711,840 →
Application:
29/424,353 →
Led Package
Patent:
725,613 →
Application:
29/424,861 →
Light Emitting Diode (Led) Package
Patent:
711,841 →
Application:
29/430,291 →
Led Package
Patent:
718,258 →
Application:
29/431,064 →
Led Package
Patent:
735,683 →
Application:
29/453,958 →
Led Package with Encapsulant
Patent:
718,725 →
Application:
29/462,353 →
Led Package
Patent:
758,976 →
Application:
29/462,795 →
Led Package with Truncated Encapsulant
Patent:
790,486 →
Application:
29/503,928 →
Light Emitting diode device
Patent:
826,871 →
Application:
29/511,587 →
Led Package
Patent:
777,122 →
Application:
29/518,882 →
Led Package
Patent:
783,547 →
Application:
29/529,243 →
Light Emitting Diode Package
Patent:
902,448 →
Application:
29/661,900 →
Led Chips with Irregular Microtextured Light Extraction Surfaces, and Fabrication Methods
Application:
63/044,746 →
Led Chips and Devices with Textured Light-Extracting Portions, and Fabrication Methods
Application:
63/128,691 →
Encapsulant Profile for Light Emitting Diodes
Application:
90/013,789 →
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 21, 2021
From: THIBEAULT, BRIAN; MACK, MICHAEL; DENBAARS, STEVEN
To: CREE LIGHTING COMPANY
Reel/Frame 056927/0594 →
Merger
Jul 27, 2021
From: CREE LIGHTING COMPANY
To: CREE, INC.
Reel/Frame 056981/0966 →
Security Interest
Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
Release of Patent Security Interest Recorded at R/F 058983/0001
Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
Patent Security Agreement
Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →