Light-emitting diodes, light-emitting diode arrays and related devices
Light-emitting diodes (LEDs), LED arrays, and related devices are disclosed. An LED device includes a first LED chip and a second LED chip mounted on a submount with a light-altering material in between. The light-altering material may include at least one of a light-reflective material and/or a light-absorbing material. Individual wavelength conversion elements may be arranged on each of the first and second LED chips. The light-altering material may improve the contrast between the first and second LED chips as well as between the individual wavelength conversion elements. LED devices may include submounts in modular configurations where LED chips may be mounted on adjacent submounts to form an LED array. Each LED chip of the LED array may be laterally separated from at least one other LED chip by a same distance and a light-altering material may be arranged around the LED array.
1. A light emitting diode (LED) device comprising:
a submount;
a first LED chip and a second LED chip on a surface of the submount, wherein the first LED chip is laterally separated from the second LED chip on the surface;
a first wavelength conversion element registered with the first LED chip;
a second wavelength conversion element registered with the second LED chip;
a first light-altering material arranged between the first LED chip and the second LED chip on the submount, wherein the first light-altering material is further arranged between the first wavelength conversion element and the second wavelength conversion element, wherein the first light-altering material comprises a first light-reflective material and a first light-absorbing material, and wherein a gap is formed entirely through the first light-altering material to a surface of the submount that is between the first LED chip and the second LED chip; and
a second light-altering material that is in the gap such that at least a portion of the first light-altering material is uncovered by the second light-altering material.
2. The LED device of claim 1 , wherein the first light-reflective material and the first light-absorbing material are interspersed in a same binder.
3. The LED device of claim 2 , wherein the first light-reflective material comprises a weight percent that is in a range from 10% to 90% of a total weight of the first light-altering material.
4. The LED device of claim 2 , wherein the first light-absorbing material comprises a weight percent that is in a range from greater than 0% to 15% of a total weight of the first light-altering material.
5. The LED device of claim 1 , wherein the second light-altering material is arranged between the first wavelength conversion element and the second wavelength conversion element.
6. The LED device of claim 1 , wherein the second light-altering material comprises a different amount of the first light-absorbing material than the first light-altering material.
7. The LED device of claim 1 , wherein the second light-altering material comprises at least one of the first light-absorbing material or a second light-reflective material.
8. The LED device of claim 1 , wherein the first light-altering material is arranged around an entire perimeter of the first LED chip and around an entire perimeter of the second LED chip.
9. The LED device of claim 1 , wherein the second light-altering material comprises a thickness above the submount that is greater than a thickness of the first light-altering material.
10. The LED device of claim 1 , wherein the second light-altering material is arranged to extend above a top surface of the first wavelength conversion element.
11. The LED device of claim 1 , wherein the first wavelength conversion element comprises a first superstrate and a first lumiphoric material that is arranged between the first superstrate and the first LED chip, and the second wavelength conversion element comprises a second superstrate and a second lumiphoric material that is arranged between the second superstrate and the second LED chip.
12. A light emitting diode (LED) device comprising:
a submount comprising a first face and a second face that opposes the first face;
a first LED chip and a second LED chip on the first face, wherein the first LED chip is laterally separated from the second LED chip on the first face;
a first wavelength conversion element registered with the first LED chip;
a second wavelength conversion element registered with the second LED chip;
a first light-altering material arranged between the first LED chip and the second LED chip and arranged between the first wavelength conversion element and the second wavelength conversion element, wherein the first light-altering material is arranged around an entire perimeter of the first LED chip and the second LED chip, wherein a portion of the first light-altering material extends to a lateral edge of the first face, and wherein a gap is formed entirely through the first light-altering material to a surface of the submount that is between the first LED chip and the second LED chip; and
a second light-altering material that is in the gap such that at least a portion of the first light-altering material is uncovered by the second light-altering material.
13. The LED device of claim 12 wherein the first light-altering material comprises a light-absorbing material.
14. The LED device of claim 12 wherein the first light-altering material comprises a light-reflective material.
15. The LED device of claim 12 , wherein the second light-altering material is arranged to extend above a top surface of the first wavelength conversion element.
16. The LED device of claim 12 , wherein the first wavelength conversion element comprises a first superstrate and a first lumiphoric material that is arranged between the first superstrate and the first LED chip, and the second wavelength conversion element comprises a second superstrate and a second lumiphoric material that is arranged between the second superstrate and the second LED chip.