IP Library › Granted Patent US 783,547
Granted Patent S1
US 783,547 · App. 29/529,243 · Granted Apr 11, 2017

LED package

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Quick Facts
Patent No.
US 783,547
App. No.
29/529,243
Granted
Apr 11, 2017
Kind
S1
Claims (1)

The ornamental design for a LED package, as shown and described herein.

Assignments (5)
PATENT SECURITY AGREEMENT Recorded Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; SMART MODULAR TECHNOLOGIES, INC.; PENGUIN COMPUTING, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →
RELEASE OF PATENT SECURITY INTEREST RECORDED AT R/F 058983/0001 Recorded Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
SECURITY INTEREST Recorded Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 29, 2021
From: CREE, INC.
To: CREELED, INC.
Reel/Frame 057017/0311 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 2, 2016
From: BERGMANN, MICHAEL JOHN; REIHERZER, JESSE; CLARK, JOSEPH GATES; JACOBSON, BENJAMIN; JOO, SUNG CHUL
To: CREE, INC.
Reel/Frame 038439/0514 →