Light emitting diode packages
Solid-state lighting devices including light-emitting diodes (LEDs) and LED packages are disclosed. LED packages are provided with improved thermal and/or electrical coupling between LED chips and submounts or lead frames. Various configurations of submounts with via arrangements are disclosed to provide improved coupling between LED chips and submounts. LED chip contacts are disclosed with one or more openings that are registered with vias to provide more uniform mounting. Multiple LED chips may be arranged around a thermally conductive element on a submount, and a via in the submount may be registered with the thermally conductive element. Subassemblies are provided between LED chips and lead frames to improve electrical and thermal coupling. Underfill materials may be arranged between LED chips and lead frames to provide improved mechanical support.
1. A light emitting diode (LED) package, comprising:
a submount comprising a first face, a second face that opposes the first face, a die attach pad on the first face, and at least one via that comprises an electrically conductive material, wherein the at least one via extends between the first face and the second face, and wherein the die attach pad is registered with the at least one via; and
an LED chip comprising a contact pad that is coupled with the die attach pad, wherein the contact pad defines at least one opening that is registered with the at least one via.
2. The LED package of claim 1 , wherein the die attach pad is electrically coupled with the at least one via.
3. The LED package of claim 1 , wherein each opening of the at least one opening comprises a recess having a maximum depth smaller than a thickness of the contact pad.
4. The LED package of claim 1 , wherein each opening of the at least one opening comprises an aperture extending through at least a portion of the contact pad.
5. The LED package of claim 1 , wherein the at least one via comprises a plurality of vias, and wherein the die attach pad is registered with the plurality of vias.
6. The LED package of claim 5 , wherein the at least one opening comprises a plurality of openings that are registered with the plurality of vias.
7. The LED package of claim 1 , wherein the at least one via comprises a plurality of vias that overlap with one another to form a trench via.
8. The LED package of claim 7 , wherein the at least one opening comprises a trench opening that is registered with the trench via.
9. The LED package of claim 1 , wherein:
the LED chip is one of a plurality of LED chips that is mounted on the submount;
the at least one via comprises a plurality of vias; and
the die attach pad is one of a plurality of die attach pads on the first face.
10. The LED package of claim 1 , wherein the LED chip is a multiple-junction LED chip that is mounted on the submount.
11. The LED package of claim 1 , wherein the at least one via comprises three vias that are positioned relative to one another in the submount to form vertices of a triangle.
12. A light emitting diode (LED) packages, comprising:
a submount comprising a first face, a second face that opposes the first face, a first die attach pad on the first face, a second die attach pad on the first face, a first plurality of vias registered with the first die attach pad, and a second plurality of vias registered with the second die attach pad; and
an LED chip comprising a primary light emitting face, a mounting face that opposes the primary light emitting face, an anode contact pad on the mounting face, and a cathode contact pad on the mounting face;
wherein the anode contact pad is coupled with the first die attach pad, the cathode contact pad is coupled with the second die attach pad, and wherein the cathode contact pad defines a plurality of openings, and openings of the plurality of openings are registered with vias of the second plurality of vias.
13. The LED package of claim 12 , wherein the first plurality of vias is electrically coupled with the first die attach pad, and the second plurality of vias is electrically coupled with the second die attach pad.
14. The LED package of claim 13 , wherein the anode contact pad defines a plurality of openings that are registered with vias of the first plurality of vias.
15. The LED package of claim 12 , wherein at least one of a via of the first plurality of vias and at least one of the vias of the second plurality of vias extends in the submount at an oblique angle between the first face and the second face.