IP Library Granted Patent US 8,034,647
Granted Patent B2
US 8,034,647 · App. 12/821,069 · Granted Oct 11, 2011

LED with substrate modifications for enhanced light extraction and method of making same

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Quick Facts
Patent No.
US 8,034,647
App. No.
12/821,069
Granted
Oct 11, 2011
Kind
B2
Abstract

The surface morphology of an LED light emitting surface is changed by applying processes, such as a reactive ion etch (RIE) process to the light emitting surface. In one embodiment, the changed surface morphology takes the form of a moth-eye surface. The surface morphology created by the RIE process may be emulated using different combinations of non-RIE processes such as grit sanding and deposition of a roughened layer of material or particles followed by dry etching.

Claims (34)

1. A method of fabricating a light emitting diode (LED) comprising:

growing a light emission region on a first surface of a substrate, the light emission region including an active layer between first and second oppositely doped layers;

creating a moth-eye morphology in at least a portion of a second surface of the substrate;

forming a first contact on the second surface of the substrate and in electrical contact with one of the first or second doped layers; and

forming a second contact in electrical contact with the other of the first or second doped layers.

2. The method of claim 1 wherein the moth-eye morphology is created by reactive ion etching the second surface.

3. The method of claim 1 wherein the moth-eye morphology is created by:

forming a layer on the second surface having a surface morphology; and

etching the layer and underlying second surface to create the moth-eye morphology.

4. The method of claim 3 wherein the layer is formed by:

depositing a substantially uniform layer of material on the second surface; and

forming the surface morphology in the uniform layer.

5. The method of claim 4 wherein the surface morphology is formed in the uniform layer by annealing the uniform layer at a temperature and for a time duration sufficient to form the surface morphology.

6. The method of claim 4 wherein the surface morphology is formed in the uniform layer by:

depositing a mask layer over the uniform layer; and

etching the uniform layer through the mask layer to form the surface morphology.

7. The method of claim 4 wherein the surface morphology is formed in the uniform layer by:

depositing nano-particles over the uniform layer; and

etching the particles and underlying layer to form the surface morphology.

8. The method of claim 3 wherein the layer is formed by depositing a layer of nano-particles on the second surface.

9. The method of claim 3 wherein the layer and second surface are etched using a dry etching process.

10. The method of claim 9 further comprising applying a chemical etch to the second surface after the second surface has been dry etched.

11. The method of claim 9 further comprising annealing the second surface after the second surface has been dry etched.

12. The method of claim 1 wherein the morphology is created using a grit polishing process.

13. A method of fabricating a light emitting diode (LED) comprising:

growing a light emission region on a first surface of a substrate, the light emission region including an active layer between first and second oppositely doped layers;

forming a layer on a second surface of the substrate, the layer having a refractive index substantially the same as the substrate and a moth-eye surface morphology;

forming a first contact on the layer and in electrical contact with one of the first or second doped layers; and

forming a second contact in electrical contact with the other of the first or second doped layers.

14. The method of claim 13 wherein the layer is formed by:

depositing material on the second surface under growth conditions that form the moth-eye surface morphology.

15. The method of claim 13 wherein the layer is formed by:

depositing nano-particles on the second surface, the particles having size, shape and density that form the moth-eye surface; and

mechanically fixing the nano-particles to the second surface.

Assignments (5)
PATENT SECURITY AGREEMENT Recorded Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; SMART MODULAR TECHNOLOGIES, INC.; PENGUIN COMPUTING, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →
RELEASE OF PATENT SECURITY INTEREST RECORDED AT R/F 058983/0001 Recorded Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
SECURITY INTEREST Recorded Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 29, 2021
From: CREE, INC.
To: CREELED, INC.
Reel/Frame 057017/0311 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 21, 2021
From: BATRES, MAX; IBBETSON, JAMES; LI, TING; SAXLER, ADAM W.
To: CREE, INC.
Reel/Frame 056927/0806 →