IP Library Granted Patent US 8,045,595
Granted Patent B2
US 8,045,595 · App. 11/600,618 · Granted Oct 25, 2011

Self aligned diode fabrication method and self aligned laser diode

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,045,595
App. No.
11/600,618
Granted
Oct 25, 2011
Kind
B2
Abstract

A method for fabricating a laser diode comprising providing a laser diode epitaxial structure and depositing a metal layer stack on the epitaxial structure, the stack comprising a contact and sacrificial layer. A ridge is formed in the laser diode epitaxial structure, the stack being the mask forming the ridge. An insulating layer is deposited over the ridge and at least a portion of the sacrificial layer is removed. At least a portion of the insulating thin film at the top of the stack is also removed. A pad metal is deposited in electrical contact with the contact and is insulated from the ridge and laser diode epitaxial structures by the insulating layer.

Claims (26)

1. A laser diode, comprising:

a laser diode epitaxial structure comprising a ridge with mesas on the sides of said ridge, said ridge having a top surface and side surfaces, said ridge comprising a metal p-contact and a protection layer on said p-contact;

an insulating layer covering said side surfaces of said ridge; and

a pad metal on said insulating layer and in electrical contact with said p-contact through said top surface of said ridge, said pad metal on said side surfaces of said ridge and insulated from said side surfaces of said ridge by said insulating layer.

2. The laser diode of claim 1 , wherein said ridge provides optical and electrical confinement during laser diode operation.

3. The laser diode of claim 1 , wherein said laser diode epitaxial structure is made from the Group-III nitride material system.

4. The laser diode of claim 1 , wherein said insulating layer comprises a dielectric material.

5. The laser diode of claim 1 , wherein said protection layer comprises one or more metals.

6. The laser diode of claim 1 , wherein said p-contact comprises gold (Au) and platinum (Pt).

7. The laser diode of claim 1 , wherein said pad metal comprises gold (Au).

8. A laser diode, comprising:

a laser diode epitaxial structure comprising a ridge having a top surface and side surface, said ridge comprising a metal p-contact and a means for protecting said p-contact during fabrication of said diode;

an insulating thin film on said laser diode epitaxial structure at least a portion of said top surface of said ridge not covered by said insulating thin film; and

a pad metal on said laser diode epitaxial structure, said pad metal in electrical contact with said p-contact through said top surface of said ridge, said pad metal electrically insulated from said side surfaces of said ridge by said insulating thin film.

9. The laser diode of claim 8 , further comprising mesas at the base of and on both sides of said ridge, at least a portion of said mesas covered by said insulating layer such that said mesas are insulated from said pad metal.

10. The laser diode of claim 8 , wherein said ridge provides optical and electrical confinement during laser diode operation.

11. The laser diode of claim 8 , wherein said laser diode epitaxial structure is made from the Group-III nitride material system.

12. The laser diode of claim 8 , wherein said insulating thin film comprises a dielectric material.

13. The laser diode of claim 8 , wherein said p-contact comprises gold (Au) and platinum (Pt).

14. The laser diode of claim 8 , wherein said pad metal comprises gold (Au).

15. The laser diode of claim 8 , wherein said p-contact comprises one or more elements from group comprising gold, palladium, platinum and nickel.

16. A solid state emitter, comprising:

an epitaxial structure comprising a ridge with mesas on the sides of said ridge, said ridge having a top surface and side surfaces;

a p-contact on said ridge;

an insulating layer covering said side surfaces of said ridge and no more than a portion of said top surface of said ridge; and

a pad metal on said insulating layer and in electrical contact with said p-contact through said top surface of said ridge, said pad metal running from one of said side surfaces, over said top surface to another of said side surfaces, and insulated from said side surfaces of said ridge and said mesas by said insulating layer.

Assignments (4)
PATENT SECURITY AGREEMENT Recorded Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; SMART MODULAR TECHNOLOGIES, INC.; PENGUIN COMPUTING, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →
RELEASE OF PATENT SECURITY INTEREST RECORDED AT R/F 058983/0001 Recorded Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
SECURITY INTEREST Recorded Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 29, 2021
From: CREE, INC.
To: CREELED, INC.
Reel/Frame 057017/0311 →