IP Library Granted Patent US 8,390,022
Granted Patent B2
US 8,390,022 · App. 13/347,243 · Granted Mar 5, 2013

Side view surface mount LED

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Quick Facts
Patent No.
US 8,390,022
App. No.
13/347,243
Granted
Mar 5, 2013
Kind
B2
Abstract

A light emitting diode is disclosed. The diode includes a package support and a semiconductor chip on the package support, with the chip including an active region that emits light in the visible portion of the spectrum. Metal contacts are in electrical communication with the chip on the package. A substantially transparent encapsulant covers the chip in the package. A phosphor in the encapsulant emits a frequency in the visible spectrum different from the frequency emitted by the chip and in response to the wavelength emitted by the chip. A display element is also disclosed that combines the light emitting diode and a planar display element. The combination includes a substantially planar display element with the light emitting diode positioned on the perimeter of the display element and with the package support directing the output of the diode substantially parallel to the plane of the display element.

Claims (21)

1. A side view light emitting diode (LED) package, comprising:

a side oriented package recess with a plurality of LEDs mounted in said recess, each of said LEDs emitting a different wavelength of light, said LED package capable of emitting a combination of said different wavelengths of light.

2. The package of claim 1 , emitting a white light combination of said different wavelengths.

3. The LED package of claim 1 , wherein said plurality of LEDs comprise three LEDs.

4. The LED package of claim 2 , forming a three-color pixel.

5. The LED package of claim 1 , wherein said plurality of LEDs comprise red, green and blue emitting LEDs.

6. The LED package of claim 1 , wherein said different wavelengths comprise red, green and blue wavelengths.

7. The LED package of claim 1 , wherein said different wavelengths of light comprise blue and yellow wavelengths of light.

8. The LED package of claim 1 , wherein said different wavelengths comprise blue, green, yellow and red wavelengths of light.

9. The LED package of claim 1 , wherein said different wavelengths of light comprise blue, yellow and red wavelengths of light.

10. The LED package of claim 1 , emitting light with a correlated color temperature (CCT) in the range of 2700 to 10000K.

11. The LED package of claim 1 , emitting light with a CCT of at least 4500 to 8000K.

12. The LED package of claim 1 , arranged for surface mounting.

13. The LED package of claim 1 , further comprising a light diffuser.

14. The LED package of claim 1 , further comprising an encapsulant with a light diffuser that physically scatters light passing through said encapsulant.

15. A side view light emitting diode (LED) package, comprising:

a side oriented package with a plurality of LEDs mounted to said package, each of said LEDs emitting a different wavelength of light, said LED package capable of emitting a combination of said different wavelengths of light.

16. A display, comprising:

a light guide; and

at least one side view light emitting diode (LED) package arranged to emit light into said light guide, said LED package comprising:

a side oriented package recess with a plurality of LEDs mounted in said recess, said each of said LEDs emitting a different wavelength of light, said LED package capable of emitting combination of said different wavelengths of light.

Assignments (5)
PATENT SECURITY AGREEMENT Recorded Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; SMART MODULAR TECHNOLOGIES, INC.; PENGUIN COMPUTING, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →
RELEASE OF PATENT SECURITY INTEREST RECORDED AT R/F 058983/0001 Recorded Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
SECURITY INTEREST Recorded Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 29, 2021
From: CREE, INC.
To: CREELED, INC.
Reel/Frame 057017/0311 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 21, 2021
From: HUSSELL, CHRISTOPHER P.; BERGMANN, MICHAEL J.; COLLINS, BRIAN T.; EMERSON, DAVID T.
To: CREE, INC.
Reel/Frame 056928/0577 →