Method for coating semiconductor device using droplet deposition
View Patent ↗Methods and systems for coating of semiconductor devices using droplets of wavelength conversion or phosphor particles in a liquid medium. A plurality of nozzles delivers a controlled amount of the matrix material to the surface of the semiconductor device, with each of said nozzles having an opening for the matrix material to pass. The opening has a diameter wherein the diameter of the phosphor particles is less than or approximately equal to one half the diameter of the opening. The phosphor particles are also substantially spherical or rounded. The nozzles are typically arranged on a print head that utilizes jet printing techniques to cover the semiconductor device with a layer of the matrix material. The methods and systems are particularly applicable to covering LEDs with a layer of phosphor materials.
1. A system for depositing a layer of phosphor material, comprising:
a semiconductor device;
a reservoir for holding a matrix material comprising phosphor particles mixed in a liquid medium;
a plurality of nozzles each of which is arranged to deliver a controlled amount of droplets of said matrix material to the surface of said semiconductor device, each of said nozzles having an opening for said matrix material to pass through, said opening having a diameter wherein the diameter of said phosphor particles is less than or approximately equal to one half the diameter of said opening; and
an apparatus to impart movement between said semiconductor device and said nozzles to allow the delivery of said matrix material over at least a portion of said surface of said semiconductor device.
2. The system of claim 1 , wherein said semiconductor device is an LED.
3. The system of claim 1 , wherein said liquid medium comprises liquid from the group comprising volatile liquid, non-volatile liquid and curable liquid.
4. The system of claim 1 , wherein said phosphor particles are substantially rounded.
5. The nozzle of claim 1 , wherein said controlled amount of matrix material from each of said nozzles comprises a droplet.
6. A system for depositing a layer of phosphor material, comprising:
a semiconductor device;
a reservoir for holding a matrix material having wavelength conversion particles; and
a print head over said semiconductor device and comprising a plurality of nozzles, said matrix material provided to each of said nozzles, wherein each of said nozzles comprises:
a nozzle opening; and
a mechanism for causing a droplet of said matrix material to be forced out of said nozzle through said nozzle opening and onto said semiconductor device, said nozzle opening having a diameter, the diameter of said wavelength conversion particles being one to two orders of magnitude smaller than said diameter of said nozzle opening and said wavelength conversion particles being substantially rounded.
7. The system of claim 6 , further comprising an apparatus to impart movement between said print head and said semiconductor device to allow said nozzles to deposit a layer of said matrix material on said semiconductor device.
8. The system of claim 6 , wherein said semiconductor device comprises a light emitting diode (LED).
9. The system of claim 6 , further comprising a liquid medium, said matrix material comprising a mixture of said liquid medium and said wavelength conversion particles.
10. The system of claim 9 , wherein said liquid medium comprises a volatile, non-volatile or curable liquid.
11. The system of claim 6 , wherein said nozzles are arranged to deposit droplets of said matrix material on the surface of said semiconductor device with a controlled pitch between adjacent droplets, said droplets running together to form a layer of said matrix material on said semiconductor device.
12. The system of claim 6 , wherein said wavelength conversion particles comprise phosphor particles.