IP Library Patent Application 15459161
Patent Application
App. No. 15/459,161

FORMATION OF NITRIDE-BASED OPTOELECTRONIC AND ELECTRONIC DEVICE STRUCTURES ON LATTICE-MATCHED SUBSTRATES

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Patent No.
US None
App. No.
15/459,161
Abstract

A method of forming an AlInGaN alloy-based electronic or optoelectronic device structure on a nitride substrate and subsequent removal of the substrate. An AlInGaN alloy-based electronic or optoelectronic device structure formed on a nitride substrate is freed from the substrate on which it was grown.

Claims (23)

1 . A method of making an optoelectronic device structure, the method comprising:

epitaxially growing one or more layers of Al x In y Ga 1-x-y N, wherein 0≦x≦1 and 0≦y≦1, over a nitride substrate including a metal content of at least 60 weight percent Ga, wherein the nitride substrate is devoid of sapphire and silicon carbide, to form a semiconductor device complex; and

removing the nitride substrate from the semiconductor device complex to form the optoelectronic device structure;

wherein the Al x In y Ga 1-x-y N and the nitride substrate comprise different stoichiometry, and the optoelectronic device structure is devoid of the nitride substrate on which it was grown; and

the method comprises at least one of the following features: (a) said removing of the nitride substrate from the semiconductor device complex comprises grinding; or (b) the method comprises annealing the optoelectronic device structure after removal of the nitride substrate.

2 . The method of claim 1 , wherein said removing of the nitride substrate from the semiconductor device complex comprises grinding.

3 . The method of claim 1 , wherein the method comprises annealing the optoelectronic device structure after removal of the nitride substrate.

4 . The method of claim 1 , further comprising chemically cleaning the optoelectronic device structure after removal of the nitride substrate.

5 . The method of claim 1 , further comprising growing a graded composition layer over the nitride substrate, wherein the epitaxially growing of the one or more layers of Al x In y Ga 1-x-y N over the nitride substrate comprises growing the one or more layers of Al x In y Ga 1-x-y N over the graded composition layer.

6 . The method of claim 5 , wherein the graded composition layer comprises a parting layer.

7 . The method of claim 1 , wherein the Al x In y Ga 1-x-y N is selected from any of AlGaN, AlInN, InGaN, AlN and InN.

8 . The method of claim 1 , wherein the nitride substrate consists essentially of GaN.

9 . The method of claim 1 , further comprising attaching a substrate to the optoelectronic device structure, wherein the attached substrate differs from the nitride substrate on which the one or more layers of Al x In y Ga 1-x-y N were grown.

10 . The method of claim 9 , wherein the attached substrate comprises any of silicon, diamond, sapphire, glass, copper or other metal, AlN and GaN.

11 . The method of claim 1 , further comprising attaching a carrier to the optoelectronic device structure.

12 . The method of claim 11 , wherein the carrier comprises any of silicon, diamond, sapphire, glass and copper.

13 . The method of claim 1 , further comprising defining vias in the optoelectronic device structure.

14 . The method of claim 1 , wherein said removing of the nitride substrate from the semiconductor device complex comprises etching the nitride substrate.

15 . An optoelectronic device structure formed by the method of claim 1 .

16 . The optoelectronic device structure of claim 15 , comprising a UV light emitting diode (LED) adapted to emit a peak wavelength of less than or equal to about 400 nm.

17 . The optoelectronic device structure of claim 15 , wherein the nitride substrate consists essentially of GaN.

18 . The optoelectronic device structure of claim 15 , further comprising a graded composition layer arranged between the nitride substrate and the one or more layers of Al x In y Ga 1-x-y N.

19 . The optoelectronic device structure of claim 15 , further comprising an attached substrate affixed to the optoelectronic device structure, wherein the attached substrate differs from the nitride substrate over which the one or more layers of Al x In y Ga 1-x-y N were grown.

Assignments (5)
RELEASE OF PATENT SECURITY INTEREST RECORDED AT R/F 058983/0001 Recorded Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
SECURITY INTEREST Recorded Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 29, 2021
From: CREE, INC.
To: CREELED, INC.
Reel/Frame 057017/0311 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 15, 2021
From: HUTCHINS, EDWARD LLOYD
To: CREE, INC.
Reel/Frame 056865/0784 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 15, 2021
From: BRANDES, GEORGE R.
To: CREE, INC.
Reel/Frame 056865/0845 →