Light emitting diode package and method for fabricating same
An LED package comprising a submount having a top and bottom surface with a plurality of top electrically and thermally conductive elements on its top surface. An LED is included on one of the top elements such that an electrical signal applied to the top elements causes the LED to emit light. The electrically conductive elements also spread heat from the LED across the majority of the submount top surface. A bottom thermally conductive element is included on the bottom surface of said submount and spreads heat from the submount, and a lens is formed directly over the LED. A method for fabricating LED packages comprising providing a submount panel sized to be separated into a plurality of LED package submounts. Top conductive elements are formed on one surface of the submount panel for a plurality of LED packages, and LEDs are attached to the top elements. Lenses are molded over the LEDs and the substrate panel is singulated to separate it into a plurality of LED packages.
1. A method for fabricating a plurality of surface mount Light Emitting Diode (LED) packages, comprising:
sizing a submount panel to accommodate formation of a plurality of LED packages;
forming sets of attach pads and contact pads on a first surface of said submount panel, each of said sets of attach pads and contact pads corresponding to one of said LED packages formed from said submount panel;
attaching a plurality of LEDs to said submount panel, each of said plurality of LEDs attached to an electrically connected to one of said sets of attach pads and contact pads;
molding a plurality of hemispherical lenses on said submount panel, each hemispherical lens in said plurality of hemispherical lenses coupled to the first surface of said submount panel and coupled over one LED in said plurality of said LEDs, such that at least a portion of said hemispherical lenses is directly coupled to the first surface of said submount panel, said hemispherical lenses comprising a protective layer on and covering the first surface of said submount panel between said hemispherical lens and an edge of said submount panel;
forming sets of surface mount contacts on the surface of said submount panel opposite said sets of attach pads and contact pads, each of said sets of said surface mount contacts corresponding to a respective one of said sets of attach pads and contact pads; and
singulating said submount panel into a plurality of LED packages, wherein each of said plurality of said singulated LED packages comprises at least one of said attach pads and at least one of said contact pads that in combination cover at least 75% of said first surface of the portion of said submount panel in said singulated LED package.
2. The method of claim 1 , further comprising forming a thermally conductive metalized layer on the surface of said submount panel.
3. The method of claim 1 , further comprising and forming vias through said submount panel, said vias electrically connecting said mount contacts to said contact pads.
4. The method of claim 1 , further comprising coating said LEDs with a conversion material.
5. The method of claim 1 , wherein said molding process comprises compression molding.
6. The method of claim 1 , wherein said singulating comprises saw singulating.
7. The method of claim 1 , further comprising wire bonding said LED its respective one of said sets of attach pads and contact pads.
8. The method of claim 1 , further comprising forming a plurality of thermally conductive metalized layers on the surface of said submount panel opposite said sets of attach pads and contact pads, each of said plurality of thermally conductive metalized layers corresponding to one of said sets of attach pads and contact pads.
9. The method of claim 1 , further comprising forming sets of vias through said submount panel, each of said vias sets corresponding to one of said sets of attach pads and contact pads, said vias electrically connecting its corresponding contact pads to its said surface mount pads.
10. The method of claim 1 , further comprising wire bonding each of said LEDs to its attach pads or contact pads.
11. The method of claim 1 , further comprising texturing of a surface of said hemispheric lenses.