IP Library Granted Patent US 7,759,682
Granted Patent B2
US 7,759,682 · App. 11/210,713 · Granted Jul 20, 2010

LED with substrate modifications for enhanced light extraction and method of making same

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Quick Facts
Patent No.
US 7,759,682
App. No.
11/210,713
Granted
Jul 20, 2010
Kind
B2
Abstract

The surface morphology of an LED light emitting surface is changed by applying processes, such as a reactive ion etch (RIE) process to the light emitting surface. In one embodiment, the changed surface morphology takes the form of a moth-eye surface. The surface morphology created by the RIE process may be emulated using different combinations of non-RIE processes such as grit sanding and deposition of a roughened layer of material or particles followed by dry etching.

Claims (21)

1. A light emitting diode (LED) comprising:

a conductive substrate having a first surface and a second surface, a portion of the first surface having a moth-eye morphology formed in said substrate by a maskless etching process;

a light emission region on the second surface, the light emission region including an active layer between first and second oppositely doped layers;

a first contact on the first surface and in contact with one of the first or second doped layers;

a second contact in contact with the other of the first or second doped layers; and

a current spreading structure in contact with the portion of the first surface having the moth-eye morphology and the first contact.

2. The LED of claim 1 further comprising a substantially smooth region on the first surface, wherein the first contact is on the smooth region.

3. The LED of claim 1 wherein the current spreading structure comprises:

at least one conductive element on the first surface in contact with the first contact.

4. The LED of claim 1 wherein the current spreading structure comprises:

a substantially smooth region on the first surface; and

a conductive element on the smooth region and in contact with the first contact.

5. The LED of claim 1 wherein the current spreading structure comprises a transparent conducting layer on at least a portion of the first surface.

6. The LED of claim 5 wherein the transparent conducting layer is metallic.

7. The LED of claim 5 wherein the transparent conducting layer is doped semiconductor material.

8. The LED of claim 7 wherein the doped semiconductor material is part of the substrate.

9. A light emitting diode (LED) comprising:

a conductive substrate having a nonporous first surface and a second surface, a portion of the first surface having a moth-eye morphology formed in said substrate by a maskless etching process;

a light emission region on the second surface, the light emission region including an active layer between first and second oppositely doped layers;

a first contact on the portion of the first surface having the moth-eye morphology and in contact with one of the first or second doped layers; and

a second contact in contact with the other of the first or second doped layers.

Assignments (4)
PATENT SECURITY AGREEMENT Recorded Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; SMART MODULAR TECHNOLOGIES, INC.; PENGUIN COMPUTING, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →
RELEASE OF PATENT SECURITY INTEREST RECORDED AT R/F 058983/0001 Recorded Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
SECURITY INTEREST Recorded Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 29, 2021
From: CREE, INC.
To: CREELED, INC.
Reel/Frame 057017/0311 →