Light emitting diode packages
Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly LED packages are disclosed. A light-altering material may be provided in particular configurations within an LED package to redirect light toward a primary emission direction. The light-altering material may be arranged on any of a first face, a second face, or a plurality of sidewalls of an LED chip in the LED package. In certain embodiments, a lumiphoric material may be arranged on one or more of the sidewalls. A superstrate may be arranged to mechanically support the LED chip from the first face. The light-altering material may be arranged on or dispersed within the superstrate. In certain embodiments, the primary emission direction of the LED package is substantially parallel to the second face of the LED chip in the LED package. An overall thickness or height of the LED package may be less than or equal to 0.25 mm.
1. A light emitting diode (LED) package, comprising:
one or more LED chips comprising a first face, a second face, and a plurality of sidewalls therebetween;
a light-altering material that surrounds the first face, the second face, and at least one sidewall of the plurality of sidewalls; and
a package anode pad and a package cathode pad arranged to electrically connect with the one or more LED chips from the second face, wherein a portion of the light-altering material is arranged between the one or more LED chips and the package anode pad and the package cathode pad.
2. The LED package of claim 1 , wherein a primary emission direction of the LED package is substantially parallel to the second face.
3. The LED package of claim 1 , wherein the light-altering material surrounds the first face, the second face, and at least three sidewalls of the plurality of sidewalls.
4. The LED package of claim 1 , wherein any material that is on the first face or on the second face is devoid of a lumiphoric material.
5. The LED package of claim 1 , wherein the light-altering material is an integral single component around the first face, the second face, and the at least one sidewall of the plurality of sidewalls.
6. The LED package of claim 1 , wherein the light-altering material comprises discontinuous segments that are joined together around the first face, the second face, and the at least one sidewall of the plurality of sidewalls.
7. The LED package of claim 1 , wherein the light-altering material comprises a thinned light-altering material through which a portion of the one or more LED chips may be electrically connected.
8. A lighting fixture comprising the LED package of claim 1 , wherein the LED package is configured to provide illumination to an edge of a light guide.
9. The LED package of claim 1 , wherein the light-altering material comprises at least one of a light-reflective particle, a light-refractive particle, or an opaque particle.
10. A light emitting diode (LED) package, comprising:
one or more LED chips comprising a first face, a second face, and a plurality of sidewalls therebetween, wherein the one or more LED chips are mounted in the LED package on either the first face or the second face and a primary emission direction of the LED package is substantially parallel to the second face;
a first light-altering material on the first face and a second light-altering material on the second face; and
a package anode pad and a package cathode pad arranged to electrically connect with the one or more LED chips from the second face, wherein a portion of the second light-altering material is arranged between the one or more LED chips and the package anode pad and the package cathode pad.
11. The LED package of claim 10 , further comprising
a lumiphoric material arranged on a first sidewall of the plurality of sidewalls.
12. The LED package of claim 10 , wherein the first light-altering material comprises at least one of a light-reflective particle, a light-refractive particle, or an opaque particle.
13. The LED package of claim 10 , wherein the first light-altering material extends toward the second light-altering material along at least one sidewall of the plurality of sidewalls.
14. The LED package of claim 10 , wherein the first light-altering material surrounds the one or more LED chips on three sidewalls of the plurality of sidewalls.
15. The LED package of claim 10 , further comprising a superstrate configured to mechanically support the one or more LED chips from the first face.
16. The LED package of claim 15 , wherein the superstrate comprises the first light-altering material as a dispersion of particles.
17. The LED package of claim 15 , wherein the first light-altering material is arranged in one or more layers on the superstrate.
18. The LED package of claim 10 , wherein the package anode pad and the package cathode pad are electrically connected with a corresponding chip anode pad and a corresponding chip cathode pad of the one or more LED chips.
19. The LED package of claim 10 , wherein the LED package is configured as a surface mount device having an overall thickness in a range of about 0.06 mm to about 0.25 mm.
20. The LED package of claim 10 , further comprising a submount wherein the one or more LED chips are mechanically attached to the submount from the second face of the one or more LED chips.
21. The LED package of claim 20 , wherein the package anode pad and the package cathode pad that are electrically connected to the one or more LED chips by one or more traces on a surface of the submount and a plurality of vias that extend through the submount.
22. The LED package of claim 20 , further comprising one or more wirebonds that are electrically connected with the one or more LED chips, wherein the one or more wirebonds extend into the first light-altering material.
23. A light emitting diode (LED) package, comprising:
an LED chip comprising a first face, a second face, and a plurality of sidewalls therebetween;
a superstrate configured to mechanically support the LED chip from the first face;
a chip anode pad and a chip cathode pad on the second face; and
a package anode pad and a package cathode pad arranged to electrically connect with the chip anode pad and the chip cathode pad from the second face;
wherein the superstrate is configured to redirect light from the LED chip toward a primary emission direction of the LED package that is substantially parallel to the second face.
24. The LED package of claim 23 , wherein an overall thickness of the LED package is in a range of about 0.06 mm to about 0.25 mm.
25. The LED package of claim 23 , wherein the superstrate comprises a light-altering material as a dispersion of particles.
26. The LED package of claim 23 , further comprising a light-altering material arranged in one or more layers on the superstrate.
27. A method of forming a light emitting diode (LED) package, the method comprising:
providing an LED chip comprising a first face, a second face, and a plurality of sidewalls therebetween;
mounting the second face of the LED chip to a surface of the LED package, wherein a primary emission direction of the LED package is substantially parallel to the second face;
forming an optical material to cover the LED chip; and
removing a portion of the optical material over the LED chip.
28. The method of claim 27 , wherein removing the portion of the optical material over the LED chip exposes one or more electrically conductive paths on the LED chip for the LED chip.
29. The method of claim 28 , wherein the one or more electrically conductive paths comprises at least one of an electrically conductive pedestal, a bump bond, a solder material, a wire, or a via.
30. The method of claim 29 , further comprising forming a light-altering material to cover the optical material, the LED chip and the one or more electrically conductive paths.
31. The method of claim 30 , further comprising removing a portion of the light-altering material to expose the one or more electrically conductive paths.
32. The method of claim 31 , wherein removing the portion of the light-altering material comprises one or more steps of planarization, grinding, polishing, and thinning.