Light-emitting diode package with light-altering material
Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly packaged LEDs with light-altering materials are disclosed. A light-altering material is provided in particular configurations within an LED package to redirect light from an LED chip within the LED package and contribute to a desired emission pattern of the LED package. The light-altering material may also block light from the LED chip from escaping in a non-desirable direction, such as large or wide angle emissions. The light-altering material may be arranged on a lumiphoric material adjacent to the LED chip in various configurations. The LED package may include an encapsulant on the light-altering material and the lumiphoric material.
1. A light emitting diode (LED) package comprising:
a submount;
at least one LED chip on the submount;
a lumiphoric material arranged on the at least one LED chip and on at least a portion of the submount adjacent to the at least one LED chip;
a light-altering material on the lumiphoric material and arranged around a perimeter of the at least one LED chip such that the light-altering material is arranged in a position that is spaced from an edge of the submount; and
an encapsulant over the at least one LED chip, wherein the encapsulant is arranged to extend past the light-altering material and to the edge of the submount;
wherein the encapsulant forms a shape that includes a lens and a lens base; and
wherein the light-altering material is registered with the lens base.
2. The LED package of claim 1 , wherein the light-altering material comprises:
an outer face and an inner face that generally opposes the outer face, wherein the outer face is aligned with the lens base.
3. The LED package of claim 1 , wherein the light-altering material comprises:
an outer face and an inner face that generally opposes the outer face, wherein the lens base is aligned between the outer face and the inner face.
4. The LED package of claim 1 , wherein the light-altering material comprises:
an outer face and an inner face that generally opposes the outer face, wherein the inner face is aligned with the lens base.
5. The LED package of claim 1 , wherein the lens comprises a hemispherical shape with a circular lens base.
6. The LED package of claim 1 , wherein the lens comprises a curved top surface and one or more planar side surfaces.
7. The LED package of claim 1 , wherein the lens comprises a planar top surface and one or more planar side surfaces.
8. The LED package of claim 1 , wherein the at least one LED chip comprises a plurality of LED chips.
9. The LED package of claim 1 , wherein the light-altering material comprises a light-reflective material.
10. The LED package of claim 9 , wherein the light-reflective material comprises at least one of fused silica, fumed silica, or titanium dioxide (TiO 2 ) particles suspended in silicone.
11. The LED package of claim 1 , wherein the light-altering material comprises a light-absorbing material.
12. A light emitting diode (LED) package comprising:
a submount;
at least one LED chip on the submount;
a lumiphoric material arranged on the at least one LED chip and on at least a portion of the submount adjacent to the at least one LED chip;
an encapsulant layer on the lumiphoric material, wherein the encapsulant layer forms a shape that includes a lens; and
a light-altering material arranged around a perimeter of the at least one LED chip and outside a perimeter of the lens;
wherein a portion of the encapsulant layer is arranged between the light-altering material and the submount such that at least a top portion of the light-altering material is uncovered by the encapsulant.
13. The LED package of claim 12 , wherein a portion of the lumiphoric material is arranged between the light-altering material and the submount.
14. The LED package of claim 13 , wherein the portion of the encapsulant layer that is arranged between the light-altering material and the submount is also arranged between the light-altering material and the portion of the lumiphoric material that is arranged between the light-altering material and the submount.
15. The LED package of claim 12 , wherein the encapsulant layer comprises silicone.
16. The LED package of claim 12 , wherein the encapsulant layer entirely covers the lumiphoric material and the at least one LED chip.
17. The LED package of claim 12 , wherein the encapsulant layer forms a lens base and the light-altering material is registered with the lens base.
18. The LED package of claim 17 , wherein the lens comprises a curved top surface.
19. The LED package of claim 18 , wherein the lens further comprises one or more planar side surfaces.
20. The LED package of claim 17 , wherein the lens comprises a planar top surface and one or more planar side surfaces.
21. A light emitting diode (LED) package comprising:
a submount;
at least one LED chip on the submount;
a light-altering material arranged around a perimeter of the at least one LED chip; and
a lumiphoric material that forms a coating over the at least one LED chip, the light-altering material, and a portion of the submount that is uncovered by the at least one LED chip and the light-altering material, wherein the light-altering material is arranged between the lumiphoric material and the submount.
22. The LED package of claim 21 , further comprising an encapsulant layer on the lumiphoric material, the at least one LED chip, and the light-altering material.
23. The LED package of claim 22 , wherein the encapsulant layer forms a shape that includes a lens with a lens base and the light-altering material is registered with the lens base.
24. The LED package of claim 23 , wherein the lens comprises a curved top surface.
25. The LED package of claim 24 , wherein the lens further comprises one or more planar side surfaces.
26. The LED package of claim 23 , wherein the lens comprises a planar top surface and one or more planar side surfaces.