IP Library Granted Patent US 7,897,980
Granted Patent B2
US 7,897,980 · App. 11/595,720 · Granted Mar 1, 2011

Expandable LED array interconnect

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Quick Facts
Patent No.
US 7,897,980
App. No.
11/595,720
Granted
Mar 1, 2011
Kind
B2
Abstract

A light emitting device that can function as an array element in an expandable array of such devices. The light emitting device comprises a substrate that has a top surface and a plurality of edges. Input and output terminals are mounted to the top surface of the substrate. Both terminals comprise a plurality of contact pads disposed proximate to the edges of the substrate, allowing for easy access to both terminals from multiple edges of the substrate. A lighting element is mounted to the top surface of the substrate. The lighting element is connected between the input and output terminals. The contact pads provide multiple access points to the terminals which allow for greater flexibility in design when the devices are used as array elements in an expandable array.

Claims (37)

1. A light emitting device, comprising:

a substrate having a top surface and a plurality of edges;

an input terminal having a single continuous shape disposed on said top surface to be accessible from a plurality of the edges of said substrate;

an output terminal having a single continuous shape disposed on said top surface to be accessible from a plurality of the edges of said substrate; and

a plurality of LEDs mounted to said substrate top surface, said LEDs connected between said input terminal and said output terminal with at least one conductive trace, wherein said at least one conductive trace is on said substrate top surface.

2. The light emitting device of claim 1 , wherein said substrate is polygonal.

3. The light emitting device of claim 1 , wherein said substrate is hexagonal.

4. The light emitting device of claim 1 , said input terminal further comprising:

a first set of contact pads disposed on said top surface proximate to a corresponding plurality of said edges.

5. The light emitting device of claim 4 , said output terminal further comprising:

a second set of contact pads disposed on said top surface proximate to a corresponding plurality of said edges opposite said first set of contact pads.

6. The light emitting device of claim 1 , wherein said plurality of lighting elements is connected in series, one of said LEDs connected to said input terminal and another of said LEDs connected to said output terminal.

7. The light emitting device of claim 1 , wherein said LEDs are arranged in a serpentine configuration on said substrate.

8. The light emitting device of claim 1 , further comprising a heat spreader made from a material with a high thermal conductivity, said heat spreader contacting said substrate such that heat is drawn away from said substrate.

9. An LED array element, comprising:

a substrate shaped as a regular hexagon having six edges and a top surface;

an input terminal comprising a plurality of segments forming a continuous arc disposed on said top surface of said substrate to be accessible from three of said substrate edges;

an output terminal comprising a plurality of segments forming a continuous arc disposed on said top surface of said substrate to be accessible from three of said substrate edges opposite said input terminal; and

a plurality of LEDs mounted to said top surface of said substrate and connected between said input terminal and said output terminal with at least one conductive trace on said top surface.

10. The LED array element of claim 9 , wherein said input terminal comprises three input contact pads, each of said input contact pads located proximate to a corresponding one of said edges.

11. The LED array element of claim 10 , wherein said output terminal comprises three output contact pads, each of said output contact pads located proximate to a corresponding one of said edges and opposite said input contact pads.

12. The LED array element of claim 10 , wherein said LEDs are connected serially in a serpentine configuration on said substrate.

13. The LED array element of claim 11 , further comprising:

a heat spreader made from a material with a high thermal conductivity, said heat spreader contacting said substrate such that heat is drawn away from said substrate.

14. An expandable LED array, comprising:

a plurality of LED array elements arranged in an expandable tiling on a surface, each of said LED array elements having a plurality of LEDs connected between an input terminal comprising a plurality of segments forming a continuous arc and an output terminal comprising a plurality of segments forming a continuous arc with at least one conductive trace on the top surface of a substrate, each of said input terminals with multiple contact pads and each of said output terminals with multiple contact pads; and

a network of conductors connected to provide power to said plurality of LED array elements.

15. The expandable LED array of claim 14 , further comprising:

a power source connected to provide power to said LED array elements.

16. The expandable LED array of claim 14 , wherein said surface is flat.

17. The expandable LED array of claim 14 , wherein said surface is three-dimensional.

18. The expandable LED array of claim 14 , wherein said LED array elements are shaped as regular hexagons.

19. The expandable LED array of claim 18 , wherein said input terminal contact pads are disposed proximate to three adjacent edges of each of said LED array elements, and said output terminal pads are disposed proximate to three adjacent edges of each of said LED array elements opposite said input terminal pads.

20. The expandable LED array of claim 14 , each of said LED array elements further comprising:

a base having a high thermal conductivity connected to dissipate heat into the ambient air.

21. The expandable LED array of claim 14 , wherein said LED array elements are shaped as polygons.

22. The expandable LED array of claim 14 , wherein said LED array elements are connected in series.

Assignments (6)
PATENT SECURITY AGREEMENT Recorded Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; SMART MODULAR TECHNOLOGIES, INC.; PENGUIN COMPUTING, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →
RELEASE OF PATENT SECURITY INTEREST RECORDED AT R/F 058983/0001 Recorded Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
SECURITY INTEREST Recorded Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 29, 2021
From: CREE, INC.
To: CREELED, INC.
Reel/Frame 057017/0311 →
CONFIRMATORY LICENSE Recorded Oct 10, 2007
From: CREE INCORPORATED
To: ENERGY, UNITED STATES DEPARTMENT OF
Reel/Frame 019944/0584 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 7, 2006
From: YUAN, THOMAS CHENG-HSIN; KELLER, BERND
To: CREE, INC.
Reel/Frame 018608/0205 →