Light-emitting diode package with light-altering material
Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly packaged LEDs with light-altering materials are disclosed. A light-altering material is provided in particular configurations within an LED package to redirect light from an LED chip within the LED package and contribute to a desired emission pattern of the LED package. The light-altering material may also block light from the LED chip from escaping in a non-desirable direction, such as large or wide angle emissions. The light-altering material may be arranged on a lumiphoric material adjacent to the LED chip in various configurations. The LED package may include an encapsulant on the light-altering material and the lumiphoric material.
1. A light emitting diode (LED) package comprising:
a submount;
at least one LED chip on the submount, wherein the at least one LED chip comprises a first thickness measured in a direction perpendicular to the submount;
a lumiphoric material arranged on the at least one LED chip and on at least a portion of the submount adjacent to the LED chip; and
a light-altering material on the lumiphoric material and arranged around a perimeter of the at least one LED chip such that a portion of the lumiphoric material is arranged between the light-altering material and the submount, wherein the light-altering material comprises a second thickness measured in a direction perpendicular to the submount;
wherein the second thickness is greater than or equal to the first thickness.
2. The LED package of claim 1 wherein the light-altering material comprises a light-reflective material.
3. The LED package of claim 2 wherein the light-reflective material comprises fused silica, fumed silica, or titanium dioxide (TiO 2 ) particles suspended in silicone.
4. The LED package of claim 1 wherein the light-altering material comprises a light-absorbing material.
5. The LED package of claim 1 wherein the light-altering material partially covers the submount around the perimeter of the at least one LED chip.
6. The LED package of claim 1 wherein the light-altering material extends to an edge of submount.
7. The LED package of claim 1 further comprising an encapsulant on the lumiphoric material and the light-altering material.
8. The LED package of claim 1 wherein the second thickness is at least one and a half times greater than the first thickness.
9. The LED package of claim 1 wherein the second thickness is at least two times greater than the first thickness.
10. The LED package of claim 1 wherein the at least one LED chip comprises a plurality of LED chips.
11. The LED package of claim 1 further comprising a reflective layer between the light-altering material and the submount.
12. The LED package of claim 1 further comprising at least one of a spacer layer or a smoothing layer between the light-altering material and the lumiphoric material.
13. The LED package of claim 1 further comprising an electrical element on the submount, wherein the light-altering material is arranged on the electrical element.
14. The LED package of claim 1 further comprising an encapsulant, wherein at least a portion of the encapsulant is between the light-altering material and the submount.
15. The LED package of claim 1 wherein the light-altering material comprises a plurality of light-altering material segments.
16. The LED package of claim 15 wherein at least one light-altering material segment of the plurality of light-altering material segments comprises a different shape, dimension, or reflectivity.
17. The LED package of claim 16 further comprising an additional material between the light-altering material and an edge of the submount.
18. A light emitting diode (LED) package comprising:
a submount;
at least one LED chip on the submount;
a lumiphoric material arranged on the at least one LED chip and on at least a portion of the submount adjacent to the at least one LED chip; and
a light-altering material on the lumiphoric material and arranged around a perimeter of the at least one LED chip such that a portion of the lumiphoric material is arranged between the light-altering material and the submount, wherein a highest elevation position of the light-altering material relative to the submount is greater than a highest elevation position of the lumiphoric material relative to the submount.
19. The LED package of claim 18 further comprising an encapsulant on the lumiphoric material and the light-altering material.
20. The LED package of claim 18 wherein the at least one LED chip comprises a plurality of LED chips.
21. The LED package of claim 1 wherein the at least one LED chip comprises a first face mounted to the submount, a second face that generally opposes the first face, and a sidewall between the first face and the second face, wherein the lumiphoric material is arranged on the sidewall and the light-altering material is spaced from the lumiphoric material on the sidewall by a gap of at least 50 microns (μm).
22. The LED package of claim 21 wherein the light-altering material is spaced from the lumiphoric material on the sidewall by a gap of at least 100 μm.
23. The LED package of claim 21 wherein the light-altering material is spaced from the lumiphoric material on the sidewall by a gap in a range of about 50 μm to about 300 μm.
24. The LED package of claim 21 further comprising an encapsulant that is arranged on the lumiphoric material, on the light-altering material, and in the gap.
25. A light emitting diode (LED) package comprising:
a submount;
at least one LED chip on the submount, wherein the at least one LED chip comprises a first thickness measured in a direction perpendicular to the submount;
a lumiphoric material arranged on the at least one LED chip and on at least a portion of the submount adjacent to the LED chip;
a light-altering material on the lumiphoric material and arranged around a perimeter of the at least one LED chip, wherein the light-altering material comprises a second thickness measured in a direction perpendicular to the submount, and the second thickness is greater than or equal to the first thickness; and
an encapsulant on the light-altering material such that at least a portion of the light-altering material is between a portion of the encapsulant and the submount, and at least a portion of the encapsulant is between the light-altering material and the at least one LED chip.
26. The LED package of claim 25 wherein a portion of the lumiphoric material is arranged between the light-altering material and the submount.
27. The LED package of claim 25 wherein the encapsulant forms a shape that includes a lens with a lens base and the light-altering material is registered with the lens base.
28. The LED package of claim 27 wherein the lens comprises a curved top surface and one or more planar side surfaces.
29. The LED package of claim 27 wherein the lens comprises a planar top surface and one or more planar side surfaces.
30. The LED package of claim 27 wherein the encapsulant forms a protective layer that covers portions of the submount that are uncovered by the lens.