Granted Patent
S1
US 1,060,278 · App. 29/877,879 · Granted Feb 4, 2025
Light-emitting diode package
Inventors:
Sarah Trinkle (Broadway, NC); Alexis Rile (Durham, NC); Robert Wilcox (Rolesville, NC); Colin Blakely (Raleigh, NC)
Assignee:
CreeLED, Inc.
View Patent ↗
Loading inventors, assignments & file history…
Claims (1)
The ornamental design for a light-emitting diode package, as shown and described.
Assignments (2)
PATENT SECURITY AGREEMENT
Recorded Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; SMART MODULAR TECHNOLOGIES, INC.; PENGUIN COMPUTING, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded Jun 14, 2023
From: TRINKLE, SARAH; RILE, ALEXIS; WILCOX, ROBERT; BLAKELY, COLIN
To: CREELED, INC.
Reel/Frame 063949/0607 →
Continuity (1)
Division
29829994
· Mar 9, 2022
References Cited (128)
US D521948S
· Inoue
· 2006
[cited by examiner]
US D573554S
· Kobayakawa
· 2008
[cited by applicant]
US D574336S
· Okada
· 2008
[cited by examiner]
US D575244S
· Lee
· 2008
[cited by applicant]
US D576574S
· Kobayakawa
· 2008
[cited by applicant]
US D596592S
· Yong et al.
· 2009
[cited by applicant]
US D602451S
· Gielen
· 2009
[cited by applicant]
US D615504S
· Keller et al.
· 2010
[cited by applicant]
US D615505S
· Butterworth
· 2010
[cited by examiner]
US D623151S
· Hwang
· 2010
[cited by examiner]
US D623152S
· Hwang et al.
· 2010
[cited by applicant]
US D642142S
· Kuwaharada et al.
· 2011
[cited by applicant]
US D649943S
· Kuwaharada
· 2011
[cited by examiner]
US D650342S
· Kuwaharada et al.
· 2011
[cited by applicant]
US D650343S
· Andrews et al.
· 2011
[cited by applicant]
US D660257S
· Andrews et al.
· 2012
[cited by applicant]
US D667802S
· Otaki et al.
· 2012
[cited by applicant]
US D672731S
· Bergmann
· 2012
[cited by examiner]
US D673126S
· Donofrio et al.
· 2012
[cited by applicant]
US D673127S
· Cho et al.
· 2012
[cited by applicant]
US D674758S
· Wu et al.
· 2013
[cited by applicant]
US D675169S
· Chou
· 2013
[cited by applicant]
US D691973S
· Donofrio et al.
· 2013
[cited by applicant]
US D697642S
· Amari et al.
· 2014
[cited by applicant]
US D704154S
· Andrews et al.
· 2014
[cited by applicant]
US D705957S
· Lin
· 2014
[cited by examiner]
US D711841S
· Britt et al.
· 2014
[cited by applicant]
US D712849S
· Britt et al.
· 2014
[cited by applicant]
US D713804S
· Britt et al.
· 2014
[cited by applicant]
US D718258S
· Lowes et al.
· 2014
[cited by applicant]
US 9006763B2
· Ueno et al.
· 2015
[cited by applicant]
US 9070850B2
· Keller et al.
· 2015
[cited by applicant]
US D738832S
· Hussell
· 2015
[cited by examiner]
US D741821S
· Song
· 2015
[cited by applicant]
US D749051S
· Clark et al.
· 2016
[cited by applicant]
US 9349929B2
· Clark et al.
· 2016
[cited by applicant]
US D762183S
· Kim et al.
· 2016
[cited by applicant]
US D762184S
· Kiridoshi
· 2016
[cited by examiner]
US D763472S
· Watson-Levack
· 2016
[cited by examiner]
US D763473S
· Watson-Levack
· 2016
[cited by applicant]
US 9461024B2
· Hussell et al.
· 2016
[cited by applicant]
US 9515055B2
· Britt et al.
· 2016
[cited by applicant]
US D777122S
· Bergmann et al.
· 2017
[cited by applicant]
US 9627361B2
· Andrews et al.
· 2017
[cited by applicant]
US D790486S
· Reiherzer et al.
· 2017
[cited by applicant]
US D800679S
· Omori
· 2017
[cited by examiner]
US 9887327B2
· Reiherzer et al.
· 2018
[cited by applicant]
US D833989S
· Tamura
· 2018
[cited by examiner]
US D844576S
· Miura
· 2019
[cited by examiner]
US D915308S
· Maruyama
· 2021
[cited by examiner]
US D915309S
· Maruyama
· 2021
[cited by examiner]
US D926714S
· Wilcox et al.
· 2021
[cited by applicant]
US D996377S
· Celano et al.
· 2023
[cited by applicant]
US D996378S
· Trinkle
· 2023
[cited by examiner]
US D100040S
· Wilcox et al.
· 2023
[cited by applicant]
US 20110062482A1
· Solomensky et al.
· 2011
[cited by applicant]
US 20110220920A1
· Collins et al.
· 2011
[cited by applicant]
US 20120087108A1
· Ke et al.
· 2012
[cited by applicant]
US 20130322088A1
· Huang et al.
· 2013
[cited by applicant]
US 20150221839A1
· Park
· 2015
[cited by examiner]
US 20160079478A1
· Kong
· 2016
[cited by examiner]
US 20190198709A1
· Wildeson et al.
· 2019
[cited by applicant]
US 20190355886A9
· Hussell et al.
· 2019
[cited by applicant]
US 20220165923A1
· Kamp et al.
· 2022
[cited by applicant]
JP D1353072A
· 2009
[cited by applicant]
JP D1655194A
· 2020
[cited by applicant]
TW D140189S
· 2011
[cited by applicant]
TW D141208S
· 2011
[cited by applicant]
TW D149503S
· 2012
[cited by applicant]
TW D157837S
· 2013
[cited by applicant]
TW D170851S
· 2015
[cited by applicant]
TW D188043S
· 2018
[cited by applicant]
WO 2010035206A1
· 2010
[cited by applicant]
WO 2018088671A1
· 2018
[cited by applicant]
WO 2021023532A1
· 2021
[cited by applicant]
Office Action for Chinese Patent Application No. 202230530277.0, mailed Jul. 21, 2023, 8 pages.
[cited by applicant]
Examination Report for Taiwanese Patent Application No. 112303066, mailed Oct. 19, 2023, 9 pages.
[cited by applicant]
Examination Report for Taiwanese Patent Application No. 111303915, mailed Mar. 24, 2023, 4 pages.
[cited by applicant]
Notice of Allowance for U.S. Appl. No. 29/829,994, mailed Mar. 15, 2023, 8 pages.
[cited by applicant]
Notice of Allowance for U.S. Appl. No. 29/827,155, mailed Mar. 15, 2023, 9 pages.
[cited by applicant]
International Search Report and Written Opinion for International Patent Application No. PCT/US2023/062635, mailed May 22, 2023, 13 pages.
[cited by applicant]
International Search Report and Written Opinion for International Patent Application No. PCT/US2023/018595, mailed Jul. 31, 2023, 13 pages.
[cited by applicant]
Notification to Grant for Chinese Patent Application No. 202230530277.0, mailed Feb. 22, 2024, 4 pages.
[cited by applicant]
Office Action for Taiwanese Patent Application No. 112112910, mailed Feb. 22, 2024, 17 pages.
[cited by applicant]
Notice of Allowance for Taiwanese Patent Application No. 112303066, mailed Feb. 19, 2024, 3 pages.
[cited by applicant]
Notice of Allowance for U.S. Appl. No. 29/877,887, mailed Mar. 6, 2024, 8 pages.
[cited by applicant]
Notice of Allowance for Taiwanese Patent Application No. 111303915, mailed Sep. 1, 2023, 5 pages.
[cited by applicant]
Preliminary Examination Report for Taiwanese Patent Application No. 112103007, mailed Sep. 20, 2023, 17 pages.
[cited by applicant]
MG Chemicals, “Epoxy Potting Compunds,” Technical Data Sheet, Sep. 27, 2021, MG Chemicals, web. archive/org/web/20210927001739/https://mgchemicals.com/products/potting-compounds/epoxy-potting/high- temperature-epoxy/, 3…
[cited by applicant]
MG Chemicals, “832HT: High Temperature Epoxy, Encapsulating and Potting Compound,” Technical Data Sheet, Nov. 21, 2019, MG Chemicals, web.archive.org/web/20201028085732/https://mgchemicals.com/downloads/tds/ tds-832ht-2…
[cited by applicant]
Non-Final Office Action for U.S. Appl. No. 17/674,430, mailed Jul. 30, 2024, 22 pages.
[cited by applicant]
Non-Final Office Action for U.S. Appl. No. 17/726,072, mailed Oct. 10, 2024, 7 pages.
[cited by applicant]