IP Library › Granted Patent US 902,448
Granted Patent S1
US 902,448 · App. 29/661,900 · Granted Nov 17, 2020

Light emitting diode package

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Quick Facts
Patent No.
US 902,448
App. No.
29/661,900
Granted
Nov 17, 2020
Kind
S1
Claims (1)

The ornamental design for a light emitting diode package, as shown and described.

Assignments (5)
PATENT SECURITY AGREEMENT Recorded Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; SMART MODULAR TECHNOLOGIES, INC.; PENGUIN COMPUTING, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →
RELEASE OF PATENT SECURITY INTEREST RECORDED AT R/F 058983/0001 Recorded Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
SECURITY INTEREST Recorded Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 29, 2021
From: CREE, INC.
To: CREELED, INC.
Reel/Frame 057017/0311 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 4, 2018
From: MURTHY, ROSHAN; ANDREWS, PETER SCOTT; DAVIS, KENNETH M.; REIHERZER, JESSE
To: CREE, INC.
Reel/Frame 047664/0516 →