IP Library Granted Patent US 8,766,298
Granted Patent B2
US 8,766,298 · App. 13/040,088 · Granted Jul 1, 2014

Encapsulant profile for light emitting diodes

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Quick Facts
Patent No.
US 8,766,298
App. No.
13/040,088
Granted
Jul 1, 2014
Kind
B2
Abstract

A light emitting packaged diode ids disclosed that includes a light emitting diode mounted in a reflective package in which the surfaces adjacent the diode are near Lambertian reflectors. An encapsulant in the package is bordered by the Lambertian reflectors and a phosphor in the encapsulant converts frequencies emitted by the LED chip and, together with the frequencies emitted by the LED chip, produces white light. A substantially flat meniscus formed by the encapsulant defines the emitting surface of the packaged diode.

Claims (37)

1. A light emitting diode (LED) package, comprising:

an LED with a Lambertian or near Lambertian emission pattern;

a package recess having reflective surfaces, said LED mounted in said package recess;

an encapsulant in said package recess and covering said LED, a top surface of said encapsulant including a curved meniscus that is within about 50 microns of a top surface of said package; and

a phosphor in said encapsulant, wherein said phosphor is proximate said LED.

2. The LED package of claim 1 , wherein said top surface of said encapsulant is dome-shaped.

3. The LED package of claim 1 , wherein said reflective surfaces are near-Lambertian reflectors.

4. The LED package of claim 1 , arranged for surface mounting.

5. The LED package of claim 1 , wherein said phosphor is on said LED.

6. The LED package of claim 1 , wherein said encapsulant further comprises a light diffuser.

7. The LED package of claim 6 , wherein said diffuser physically scatters light within said encapsulant.

8. A light emitting diode (LED) package, comprising:

an LED;

a package recess having reflective surfaces, said LED mounted in said package recess;

an encapsulant in said package recess and covering said LED, said encapsulant having an encapsulant curved top surface with a highest or lowest portion that is within 50 microns of a package top surface; and

a phosphor in said encapsulant, wherein said phosphor is proximate said LED.

9. The LED package of claim 8 , wherein said encapsulant top surface is concave.

10. The LED package of claim 8 , wherein said encapsulant top surface is convex.

11. The LED package of claim 8 , wherein said reflective surfaces comprise walls and a floor.

12. The LED package of claim 8 , arranged for surface mounting.

13. The LED package of claim 8 , wherein said phosphor is on said LED.

14. The LED package of claim 8 , wherein said encapsulant further comprises a light diffuser.

15. The LED package of claim 14 , wherein said light diffuser physically scatters light within said encapsulant.

16. A display, comprising:

a light guide; and

at least one side view light emitting diode (LED) package arranged to emit light into said light guide, said LED package comprising:

an LED with a Lambertian or near Lambertian emission pattern;

a package recess having reflective surfaces, said LED mounted in said package recess;

an encapsulant in said package recess and covering said LED, a top surface of said encapsulant including a domed meniscus that is within about 50 microns of a top surface of said package; and

a phosphor in said encapsulant, wherein said phosphor is proximate said LED.

17. A display, comprising:

a light guide; and

at least one side view light emitting diode (LED) package arranged to emit light into said light guide, said LED package comprising:

an LED with a Lambertian or near Lambertian emission pattern;

a package recess having reflective surfaces, said LED mounted in said package recess;

an encapsulant in said package recess and covering said LED, said encapsulant having a curved top surface with a highest or lowest portion that is within 50 microns of a package top surface; and

a phosphor in said encapsulant, wherein said phosphor is proximate said LED.

Assignments (5)
PATENT SECURITY AGREEMENT Recorded Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; SMART MODULAR TECHNOLOGIES, INC.; PENGUIN COMPUTING, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →
RELEASE OF PATENT SECURITY INTEREST RECORDED AT R/F 058983/0001 Recorded Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
SECURITY INTEREST Recorded Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 29, 2021
From: CREE, INC.
To: CREELED, INC.
Reel/Frame 057017/0311 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 21, 2021
From: HUSSELL, CHRISTOPHER P.; BERGMANN, MICHAEL J.; COLLINS, BRIAN T.; EMERSON, DAVID T.
To: CREE, INC.
Reel/Frame 056928/0873 →