Method to form primary optic with variable shapes and/or geometries without a substrate
View Patent ↗A submount-free light emitter package with primary optic and method of fabricating the same are disclosed, these packages and methods comprising a light emitter with an optic. The optic may have a shape, which includes a portion that is wider at a point further from the light emitter than a point which is closer. The method includes a light emitter disposed on a carrier surface with at least one structure at least partially surrounding the light emitter. The encapsulant is over the light emitter forming a primary optic. The intermediate element at least partially defines the shape of the primary optic.
1. A light emitter package, comprising:
a light emitter;
at least a package contact on said light emitter with no intervening submount between said at least a package contact and said light emitter; and
an encapsulant over said light emitter forming a shaped primary optic, wherein said at least a package contact is on said light emitter without directly contacting said encapsulant.
2. The light emitter package of claim 1 , wherein said primary optic is capable of beam shaping.
3. The light emitter package of claim 2 , further comprising a reflective material on the same side of the package as said at least a package contact.
4. The light emitter package of claim 2 , wherein said at least a package contact directly connects to a circuit board.
5. The light emitter package of claim 1 , further comprising a structure at least partially surrounding said light emitter, said structure at least partially defining the shape of said primary optic.
6. The light emitter package of claim 5 , wherein at least a portion of said structure is capable of being removed.
7. The light emitter package of claim 5 , wherein said structure cooperates with a dispense process.
8. The light emitter package of claim 5 , wherein said structure is a permanent portion of said package.
9. The light emitter package of claim 5 , wherein at least a portion of said structure is reflective.
10. The light emitter package of claim 1 , wherein said primary optic is shaped to have an overhang portion.
11. The light emitter package of claim 1 , wherein said primary optic includes wavelength conversion material.
12. The light emitter package of claim 1 , further comprising a wavelength conversion material over said primary optic.
13. The light emitter package of claim 1 , wherein said encapsulant is dispensed over said light emitter.
14. The light emitter package of claim 1 , wherein said encapsulant is comprised of silicone.
15. The light emitter package of claim 1 further comprising a secondary optic over said primary optic.
16. The light emitter package of claim 1 , wherein said primary optic has a tapered shape such that at least a portion closer to a base of said primary optic is narrower than at least a portion closer to an exit face.
17. The light emitter package of claim 1 , wherein said primary optic has a parabolic shape.
18. The light emitter package of claim 1 , wherein said package is a cavity optic with a tapered primary optic and reflective cavity walls.
19. The light emitter package of claim 18 , further comprising a glass lens over said encapsulant.
20. The light emitter package of claim 1 , further comprising a conversion material over said light emitter.
21. The light emitter package of claim 1 , wherein said light emitter is on a removable carrier surface.
22. The light emitter package of claim 21 , wherein said removable carrier surface is a thermal release tape.
23. The light emitter package of claim 21 , wherein said removable carrier surface further comprises a metal frame.
24. A light emitter package, comprising:
a light emitter;
at least one structure at least partially surrounding said light emitter;
an encapsulant over said light emitter forming a primary optic, said at least one structure at least partially defining the shape of said primary optic, wherein said primary optic is shaped such that at least a portion closer to a base of said primary optic is narrower than at least a portion closer to an exit face; and
at least one package contact, said at least one package contact on said light emitter without directly contacting said encapsulant;
wherein said package is submount free.
25. The light emitter package of claim 24 , wherein said primary optic is capable of beam shaping.
26. The light emitter package of claim 24 , wherein at least a portion of said at least one structure is capable of being removed.
27. The light emitter package of claim 24 , wherein said primary optic is shaped to have an overhang portion.
28. The light emitter package of claim 24 , wherein said at least one structure is a permanent portion of said package.
29. The light emitter package of claim 24 , wherein at least a portion of said at least one structure is reflective.
30. The light emitter package of claim 24 , wherein said primary optic has a parabolic shape.
31. The light emitter package of claim 24 , wherein said package is a cavity optic with a tapered primary optic and reflective cavity walls.
32. The light emitter package of claim 24 , further comprising a glass lens over said encapsulant.
33. The light emitter package of claim 24 , wherein said at least one package contact is completely underneath said light emitter.
34. The light emitter package of claim 24 , further comprising a reflective material on the same side of the package as said at least one package contact.