IP Library Granted Patent US 11,510,294
Granted Patent B2
US 11,510,294 · App. 17/364,987 · Granted Nov 22, 2022

Lumiphoric arrangements for light emitting diode packages

Inventors: Aaron Francis (Apex, NC); Kyle Damborsky (Apex, NC); Robert Wilcox (Rolesville, NC); Jasper Cabalu (Apex, NC); Colin Blakely (Raleigh, NC)
Assignee: CreeLED, Inc.
H05B45/20H01L27/156H01L33/50H01L33/62
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Quick Facts
Patent No.
US 11,510,294
App. No.
17/364,987
Granted
Nov 22, 2022
Kind
B2
Abstract

Solid-state lighting devices including light-emitting diodes (LEDs), and more particularly packaged LED devices are disclosed. LED packages are disclosed herein with arrangements of LED chips and corresponding lumiphoric regions that are configured to provide overall light emissions having improved color mixing and emission uniformity. LED packages are further disclosed herein that are configured to be tunable between different colors or correlated color temperatures (CCTs) while providing improved color mixing and emission uniformity. Arrangements may include differing lumiphoric regions that are arranged with various alternating patterns including one or more intersecting lines, rows of alternating lumiphoric regions, patterns that alternate in at least two directions, and checkerboard patterns.

Claims (46)

1. A method comprising:

mounting a plurality of light-emitting diode (LED) chips on a submount, the plurality of LED chips comprising a first group of LED chips and a second group of LED chips;

selectively forming a plurality of first lumiphoric regions on the first group of LED chips; and

selectively forming a plurality of second lumiphoric regions on the second group of LED chips, individual first lumiphoric regions of the plurality of first lumiphoric regions being provided in an alternating arrangement with individual second lumiphoric regions of the plurality of second lumiphoric regions, the alternating arrangement comprising connecting corners of the individual first lumiphoric regions of the plurality of first lumiphoric regions and connecting corners of the individual second lumiphoric regions of the plurality of second lumiphoric regions.

2. The method of claim 1 , wherein:

the plurality of first lumiphoric regions are formed through a mask that covers the second group of LED chips; and

the plurality of second lumiphoric regions are formed through a mask that covers the first group of LED chips.

3. The method of claim 1 , wherein:

the first group of LED chips and the plurality of first lumiphoric regions are configured to provide emissions of a first correlated color temperature (CCT) value; and

the second group of LED chips and the plurality of second lumiphoric regions are configured to provide emissions of a second CCT value that differs from the first CCT value.

4. The method of claim 3 , wherein each of the first group of LED chips and the second group of LED chips is individually controllable.

5. The method of claim 1 , wherein the plurality of LED chips, the plurality of first lumiphoric regions and the plurality of second lumiphoric regions form an emission area of an LED package, and the alternating arrangement comprises a checkerboard pattern in at least twenty-five percent of the emission area.

6. The method of claim 1 , wherein:

the plurality of first lumiphoric regions are formed by spray coating the first lumiphoric regions on the first group of LED chips and on surfaces of the submount that are adjacent mounting surfaces of each LED chip of the first group of LED chips; and

the plurality of second lumiphoric regions are formed by spray coating the second lumiphoric regions on the second group of LED chips and on surfaces of the submount that are adjacent mounting surfaces of each LED chip of the second group of LED chips.

7. The method of claim 1 , wherein:

the plurality of first lumiphoric regions comprise preformed structures that are attached to the first group of LED chips; and

the plurality of second lumiphoric regions comprise preformed structures that are attached to the second group of LED chips.

8. The method of claim 7 , wherein the preformed structures comprise at least one of a lumiphoric material on a surface of a transparent support substrate, a lumiphoric material that is embedded within a binder, and a ceramic phosphor plate.

9. The method of claim 1 , wherein:

the plurality of first lumiphoric regions comprise a curved surface above the first group of LED chips; and

the plurality of second lumiphoric regions comprise a curved surface above the second group of LED chips.

10. The method of claim 1 , wherein:

the plurality of first lumiphoric regions are formed by dispensing the first lumiphoric regions on the first group of LED chips; and

the plurality of second lumiphoric regions are formed by dispensing the second lumiphoric regions on the second group of LED chips.

11. The method of claim 10 , further comprising:

dispensing the first lumiphoric regions on surfaces of the submount that are adjacent mounting surfaces of each LED chip of the first group of LED chips; and

dispensing the second lumiphoric regions on surfaces of the submount that are adjacent mounting surfaces of each LED chip of the second group of LED chips.

12. A method comprising:

mounting a plurality of light-emitting diode (LED) chips on a submount; and

forming a plurality of first lumiphoric regions in an alternating arrangement with a plurality of second lumiphoric regions on the submount to form an emission area of an LED package that is registered with the plurality of LED chips, the plurality of first lumiphoric regions being discrete regions from the plurality of second lumiphoric regions;

wherein the alternating arrangement comprises individual first lumiphoric regions of the plurality of first lumiphoric regions that are in contact with individual second lumiphoric regions of the plurality of second lumiphoric regions.

13. The method of claim 12 , wherein the plurality of LED chips comprises:

a first group of LED chips that are registered with the plurality of first lumiphoric regions to provide emissions of a first correlated color temperature (CCT) value; and

a second group of LED chips that are registered with the plurality of second lumiphoric regions to provide emissions of a second CCT value that differs from the first CCT value, wherein each of the first group of LED chips and the second group of LED chips is individually controllable.

14. The method of claim 13 , wherein the first CCT value differs from the second CCT value by at least 500 K.

15. The method of claim 13 , wherein the emission area is tunable between the first CCT value and the second CCT value.

16. The method of claim 13 , wherein the first CCT value is configured above a blackbody locus and the second CCT value is configured below the blackbody locus.

17. The method of claim 12 , wherein:

the plurality of LED chips comprises a first group of LED chips and a second group of LED chips;

the plurality of first lumiphoric regions are formed through a mask that covers the second group of LED chips; and

the plurality of second lumiphoric regions are formed through a mask that covers the first group of LED chips.

18. The method of claim 12 , wherein:

the plurality of LED chips comprises a first group of LED chips and a second group of LED chips;

the plurality of first lumiphoric regions comprise preformed structures that are attached to the first group of LED chips after the first group of LED chips are mounted to the submount; and

the plurality of second lumiphoric regions comprise preformed structures that are attached to the second group of LED chips after the second group of LED chips are mounted to the submount.

Assignments (3)
PATENT SECURITY AGREEMENT Recorded Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; SMART MODULAR TECHNOLOGIES, INC.; PENGUIN COMPUTING, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →
RELEASE OF PATENT SECURITY INTEREST RECORDED AT R/F 058983/0001 Recorded Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
SECURITY INTEREST Recorded Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →