IP Library Granted Patent US 7,718,991
Granted Patent B2
US 7,718,991 · App. 11/751,990 · Granted May 18, 2010

Lighting device and method of making

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Quick Facts
Patent No.
US 7,718,991
App. No.
11/751,990
Granted
May 18, 2010
Kind
B2
Abstract

A lighting device comprises a solid state light emitter, first and second electrodes connected to the emitter, an encapsulant region comprising a silicone compound and a supporting region. The encapsulant region extends to an external surface of the lighting device. At least a portion of the first electrode is surrounded by the supporting region. The encapsulant region and the supporting region together define an outer surface which substantially encompasses the emitter. A method of making a lighting device, comprises electrically connecting first and second electrodes to an emitter; inserting the emitter into mold cavity; inserting an encapsulant composition comprising a one silicone compound; and then inserting a second composition to substantially surround at least a portion of the first electrode.

Claims (44)

1. A lighting device, comprising:

at least one solid state light emitter;

at least a first electrode and a second electrode, said first electrode and said second electrode each being electrically connected to said solid state light emitter;

an encapsulant element that defines part of an outer surface of said lighting device, at least one region of said encapsulant element comprising at least one silicone compound and extending to said outer surface of said lighting device;

at least one supporting region, at least a portion of said first electrode being surrounded by said supporting region; and

a reflective element, said solid state light emitter being mounted on said reflective element,

said encapsulant element and said at least one supporting region together defining said outer surface of said lighting device, said outer surface of said lighting device substantially encompassing said solid state light emitter.

2. A lighting device as recited in claim 1 , wherein at least a portion of said second electrode is also surrounded by said supporting region.

3. A lighting device as recited in claim 1 , further comprising at least one luminescence region, said luminescence region comprising at least one luminescent material, said luminescence region being positioned inside said reflective element.

4. A lighting device as recited in claim 1 , wherein at least 50% of light emitted from said solid state light emitter does not enter said at least one supporting region.

5. A lighting device as recited in claim 1 , wherein said supporting region comprises at least one epoxy compound.

6. A lighting device as recited in claim 1 , further comprising at least one luminescence region, said luminescence region comprising at least one luminescent material.

7. A lighting device as recited in claim 6 , wherein said luminescence region is in contact with said solid state light emitter.

8. A lighting device as recited in claim 1 , wherein said solid state light emitter comprises a light emitting diode.

9. A method of making a lighting device, comprising:

electrically connecting at least first and second electrodes to a solid state light emitter to form a light emitter element, said solid state light emitter being mounted on a reflective element;

inserting said light emitter element into a region located within a space defined by a mold cavity;

inserting into a first portion of said space an encapsulant composition comprising at least one silicone compound; and

then inserting into a second portion of said space a supporting region forming composition, whereby said supporting region forming composition substantially surrounds at least a portion of said first electrode,

whereby at least a portion of an outer surface of said at least one encapsulant composition and at least a portion of an outer surface of said at least one supporting region forming composition together define a combined encapsulant-supporting region outer surface which substantially encompasses said solid state light emitter.

10. A method as recited in claim 9 , wherein at least a portion of said second electrode is also surrounded by said supporting region forming composition.

11. A method as recited in claim 9 , wherein said electrically connecting said first and second electrodes to said solid state light emitter is performed before said inserting said light emitter element into said region located within said space defined by said mold cavity.

12. A method as recited in claim 9 , wherein said inserting said light emitter element into said region located within said space defined by said mold cavity is performed before said inserting said encapsulant composition into said first portion of said space.

13. A method as recited in claim 9 , further comprising at least partially curing said encapsulant composition before said inserting said supporting region forming composition into said second portion of said space.

14. A method as recited in claim 9 , wherein said supporting region forming composition comprises at least one epoxy compound.

15. A lighting device as recited in claim 1 , wherein:

said reflective element comprises a reflective cup,

said reflective cup has a lip portion,

said encapsulant region and said supporting region abut each other substantially along a plane, and

said plane is adjacent to said lip portion of said cup.

16. A lighting device as recited in claim 9 , wherein:

said reflective element comprises a reflective cup,

said reflective cup has a lip portion,

said encapsulant region and said supporting region abut each other substantially along a plane, and

said plane is adjacent to said lip portion of said cup.

17. A lighting device, comprising:

at least one solid state light emitter;

at least a first electrode and a second electrode, said first electrode and said second electrode each being electrically connected to said solid state light emitter;

an encapsulant element that defines part of an outer surface of said lighting device, at least one region of said encapsulant element comprising at least one silicone compound and extending to said outer surface of said lighting device;

at least one supporting region, at least a portion of said first electrode being surrounded by said supporting region; and

a cup comprising sidewalls extending to a lip portion, said solid state light emitter being mounted in said cup,

said encapsulant element and said at least one supporting region together defining said outer surface of said lighting device, said outer surface said lighting device substantially encompassing said solid state light emitter,

said encapsulant element and said supporting region abutting each other substantially along a plane, said plane being adjacent to said lip portion of said cup.

18. A lighting device as recited in claim 17 , wherein said cup is reflective.

Assignments (4)
PATENT SECURITY AGREEMENT Recorded Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; SMART MODULAR TECHNOLOGIES, INC.; PENGUIN COMPUTING, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →
RELEASE OF PATENT SECURITY INTEREST RECORDED AT R/F 058983/0001 Recorded Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
SECURITY INTEREST Recorded Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 14, 2021
From: CREE, INC.
To: CREELED, INC.
Reel/Frame 055914/0065 →