IP Library Granted Patent US 10,222,004
Granted Patent B2
US 10,222,004 · App. 15/788,376 · Granted Mar 5, 2019

Lighting devices that comprise one or more solid state light emitters

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Quick Facts
Patent No.
US 10,222,004
App. No.
15/788,376
Granted
Mar 5, 2019
Kind
B2
Abstract

A light engine module including at least a first solid state light emitter on a first circuit board, and a second circuit board non-parallel to the first circuit board. Also, a light engine module including at least a first solid state light emitter on a non-circular first surface of a first solid state light emitter support member. Also, a light engine module including a first solid state light emitter on a first surface of a first solid state light emitter support member, and at least a first electronic component on a second surface of the first solid state light emitter support member.

Claims (52)

1. A light engine module, comprising:

at least first and second circuit boards; and

at least a first solid state light emitter,

the first solid state light emitter on the first circuit board,

the second circuit board non-parallel to the first circuit board.

2. A light engine module as recited in claim 1 , wherein the second circuit board is substantially perpendicular to the first circuit board.

3. A light engine module as recited in claim 1 , wherein the light engine module further comprises compensation circuitry, the compensation circuitry on the second circuit board.

4. A light engine module as recited in claim 3 , wherein the compensation circuitry adjusts current and/or voltage of electricity supplied to at least the first solid state light emitter based at least in part on temperature sensed by at least one temperature sensor.

5. A light engine module as recited in claim 3 , wherein the compensation circuitry adjusts current and/or voltage of electricity supplied to at least the first solid state light emitter based at least in part light emission sensed by at least one light sensor.

6. A light engine module as recited in claim 1 , wherein the light engine module is configured to connect with any of a plurality of different housing elements.

7. A light engine module, comprising:

at least a first solid state light emitter support member; and

at least a first solid state light emitter,

the first solid state light emitter on a first surface of the first solid state light emitter support member,

the first surface of the first solid state light emitter support member non-circular.

8. A light engine module as recited in claim 7 , wherein the first surface of the first solid state light emitter support member comprises at least a first arc-shaped region, the arc-shaped region defining a portion of a substantially circular shape.

9. A light engine module as recited in claim 7 , wherein the first surface of the first solid state light emitter support member comprises a substantially circular perimeter with at least a first notch extending inward from said perimeter.

10. A light engine module as recited in claim 7 , wherein a perimeter of the first surface of the first solid state light emitter support member comprises at least a first substantially flat region.

11. A light engine module as recited in claim 7 , wherein a perimeter of the first surface of the first solid state light emitter support member comprises two substantially flat regions that are substantially parallel to each other and two arc-shaped regions that each define a portion of a substantially circular shape.

12. A light engine module as recited in claim 7 , wherein the first light engine module is configured to connect with any of a plurality of different housing elements.

13. A light engine module as recited in claim 7 , wherein the first solid state light emitter is on a first circuit board and the first circuit board is on the first solid state light emitter support member.

14. A light engine module as recited in claim 7 , wherein the first solid state light emitter support member comprises at least one structure that provides and/or enhances heat dissipation.

15. A light engine module as recited in claim 14 , wherein the at least one structure that provides and/or enhances heat dissipation comprises at least one heat dissipation fin and/or at least one heat dissipation pin.

16. A light engine element comprising at least a first light engine module as recited in claim 7 and an interface element, the first light engine module connected to the interface element.

17. A light engine element comprising:

a first light engine module as recited in claim 7 ,

a second light engine module, and

an interface element,

the first light engine module connected to a first region of the interface element, the second light engine module connected to a second region of the interface element,

the second light engine module, comprising:

at least a second solid state light emitter support member; and

at least a second solid state light emitter,

the second solid state light emitter on a first surface of the second solid state light emitter support member,

the first surface of the second solid state light emitter support member non-circular.

18. A light engine module as recited in claim 17 , wherein:

the first light engine module comprises the first solid state light emitter support member, and

the first solid state light emitter support member is substantially the same shape and size as the second solid state light emitter support member.

19. A light engine module, comprising:

at least a first solid state light emitter support member; and

at least a first solid state light emitter,

the first solid state light emitter on a first surface of the first solid state light emitter support member,

the first solid state light emitter support member further comprising at least a second surface,

at least a first electronic component on the second surface of the first solid state light emitter support member.

20. A light engine module as recited in claim 19 , wherein the first surface of the first solid state light emitter support member is on a side of the first solid state light emitter support member that is opposite to the second surface of the first solid state light emitter support member.

21. A light engine module as recited in claim 19 , wherein the first electronic component comprises compensation circuitry that adjusts current and/or voltage of electricity supplied to at least one solid state light emitter based at least in part on temperature sensed by at least one temperature sensor.

22. A light engine module as recited in claim 19 , wherein the first electronic component comprises compensation circuitry that adjusts current and/or voltage of electricity supplied to at least one solid state light emitter based at least in part light emission sensed by at least one light sensor.

23. A light engine module as recited in claim 19 , wherein the light engine module is configured to connect with any of a plurality of different housing elements.

24. A light engine module as recited in claim 19 , wherein the second surface of the first solid state light emitter support member is non-parallel to the first surface of the first solid state light emitter support member.

25. A light engine module as recited in claim 19 , wherein the second surface of the first solid state light emitter support member is substantially perpendicular to the first surface of the first solid state light emitter support member.

26. A light engine module as recited in claim 19 , wherein the first solid state light emitter is on a first circuit board and the first circuit board is on the first solid state light emitter support member.

27. A light engine module as recited in claim 19 , wherein the first solid state light emitter support member comprises at least one structure that provides and/or enhances heat dissipation.

28. A light engine module as recited in claim 27 , wherein the at least one structure that provides and/or enhances heat dissipation comprises at least one heat dissipation fin and/or at least one heat dissipation pin.

Assignments (5)
PATENT SECURITY AGREEMENT Recorded Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; SMART MODULAR TECHNOLOGIES, INC.; PENGUIN COMPUTING, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →
NUNC PRO TUNC ASSIGNMENT Recorded Jun 26, 2025
From: VAN DE VEN, ANTONY PAUL; THIEKEN, PAUL
To: CREE, INC.
Reel/Frame 071538/0102 →
RELEASE OF PATENT SECURITY INTEREST RECORDED AT R/F 058983/0001 Recorded Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
SECURITY INTEREST Recorded Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 14, 2021
From: CREE, INC.
To: CREELED, INC.
Reel/Frame 055914/0065 →