IP Library Granted Patent US 7,020,727
Granted Patent B2
US 7,020,727 · App. 10/854,818 · Granted Mar 28, 2006

Full-span switched fabric carrier module and method

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Quick Facts
Patent No.
US 7,020,727
App. No.
10/854,818
Granted
Mar 28, 2006
Kind
B2
Abstract

A multi-service platform system ( 100 ) includes a switched fabric backplane ( 102 ), a baseboard ( 104 ) coupled to interface with the switched fabric backplane, a full-span switched fabric carrier module ( 106 ) coupled to interface with the baseboard, and a switched fabric link ( 108 ), wherein the full-span carrier interfaces with the baseboard via the switched fabric link.

Claims (31)

1. A multi-service platform system, comprising:

a switched fabric backplane;

a baseboard coupled to interface with the switched fabric backplane;

a full-span switched fabric carrier module coupled to interface with the baseboard, wherein the full-span switched fabric carrier module has substantially the same form factor as the baseboard;

a switched fabric link, wherein the full-span switched fabric carrier module interfaces with the baseboard via the switched fabric link; and

a switched fabric enabled mezzanine card coupled to the full-span switched fabric carrier module, wherein the switched fabric enabled mezzanine card is coupled to directly communicate with the multi-service platform system using the switched fabric link via the baseboard without communicating with the baseboard or the full-span switched fabric carrier module.

2. The multi-service platform system of claim 1 , wherein the switched fabric link transfers data at least one gigabyte per second.

3. The method of claim 1 , the switched fabric link operates using one of InfiniBand, Serial RapidIO, FibreChannel, Ethernet, PCI Express, Universal Serial Bus, Serial ATA, Serial Attached SCSI switched fabric standards.

4. The multi-service platform system of claim 1 , wherein the switched fabric link comprises an expansion connector, and wherein the expansion connector is coupled to communicate data using a switched fabric standard.

5. The multi-service platform system of claim 4 , wherein the expansion connector is coupled to communicate data using a parallel multi-drop bus standard simultaneously with the switched fabric standard.

6. The multi-service platform system of claim 1 , further comprising a parallel bus link, wherein the full-span switched fabric carrier module interfaces with the baseboard via the parallel bus link, and wherein the switched fabric enabled mezzanine card is coupled to communicate with the multi-service platform system using the parallel bus link via the baseboard.

7. The multi-service platform system of claim 1 , further comprising a second full-span switched fabric carrier module coupled to interface with the full-span switched fabric carrier module via a second switched fabric link.

8. A full-span switched fabric carrier module, comprising:

a switched fabric enabled mezzanine card connection site; and

a switched fabric link coupled to the switched fabric enabled mezzanine card connection site, wherein the switched fabric link interfaces the full-span switched fabric carrier module to a baseboard that is coupled to interface with a switched fabric backplane, wherein a switched fabric enabled mezzanine card coupled to the full-span switched fabric carrier module is coupled to directly communicate with the switched fabric backplane using the switched fabric link without communicating with the baseboard or the full-span switched fabric carrier module.

9. The full-span switched fabric carrier module of claim 8 , wherein the switched fabric link comprises an expansion connector, and wherein the expansion connector is coupled to communicate data using a switched fabric standard.

10. The full-span switched fabric carrier module of claim 9 , wherein the switched fabric connector is coupled to communicate data using a parallel multi-drop bus standard simultaneously with the switched fabric standard.

11. The full-span switched fabric carrier module of claim 8 , further comprising a switched fabric enabled mezzanine card coupled to the full-span switched fabric carrier module at the switched fabric enabled mezzanine card connection site, wherein the switched fabric enabled mezzanine card is coupled to communicate with a multi-service platform system using the switched fabric link via the baseboard.

12. The full-span switched fabric carrier module of claim 11 , further comprising a parallel bus link, wherein the full-span carrier interfaces with the baseboard via the parallel bus link, and wherein the switched fabric enabled mezzanine card is coupled to communicate with the multi-service platform system using the parallel bus link via the baseboard.

13. The full-span switched fabric carrier module of claim 8 , further comprising a second switched fabric link coupled to interface with a second full-span switched fabric carrier module.

14. A method, comprising:

providing a switched fabric backplane in multi-service platform system;

providing a baseboard coupled to interface with the switched fabric backplane;

interfacing a full-span switched fabric carrier module to the baseboard at a switched fabric link, wherein the full-span switched fabric carrier module has substantially the same form factor as the baseboard;

coupling a switched fabric enabled mezzanine card to the full-span switched fabric carrier module; and

the switched fabric enabled mezzanine card directly communicating with the multi-service platform system using the switched fabric link via the baseboard without communicating with the baseboard or the full-span switched fabric carrier module.

15. The method of claim 14 , further comprising communicating data through the switched fabric link using a switched fabric standard.

16. The method of claim 14 , wherein the switched fabric link comprises an expansion connector, and further comprising communicating data through the expansion connector using a switched fabric standard.

17. The method of claim 16 , further comprising communicating data through the expansion connector using a parallel multi-drop bus standard simultaneously with the switched fabric standard.

18. The method of claim 14 , further comprising interfacing the full-span switched fabric carrier module to the baseboard at a parallel bus link and the switched fabric enabled mezzanine card communicating with the multi-service platform system using the parallel bus link via the baseboard.

19. The method of claim 14 , further comprising interfacing a second full-span switched fabric carrier module to the full-span switched fabric carrier module via a second switched fabric link.

Assignments (10)
RELEASE OF PATENT SECURITY INTEREST RECORDED AT R/F 058983/0001 Recorded Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
SECURITY INTEREST Recorded Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
CHANGE OF NAME Recorded Jun 24, 2020
From: ARTESYN EMBEDDED COMPUTING, INC.
To: SMART EMBEDDED COMPUTING, INC.
Reel/Frame 053023/0953 →
CHANGE OF NAME Recorded Jun 18, 2020
From: EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.
To: ARTESYN EMBEDDED COMPUTING, INC.
Reel/Frame 052978/0634 →
RELEASE OF SECURITY INTEREST Recorded Jul 9, 2019
From: ARTESYN EMBEDDED COMPUTING, INC. (F/K/A EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.)
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049698/0222 →
PARTIAL RELEASE OF SECURITY INTEREST Recorded Jul 8, 2019
From: BANK OF AMERICA, N.A.
To: ARTESYN EMBEDDED COMPUTING, INC. (F/K/A EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.)
Reel/Frame 049694/0096 →
SECURITY AGREEMENT Recorded Nov 26, 2013
From: ARTESYN TECHNOLOGIES, INC.; ARTESYN NORTH AMERICA LLC; EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 031731/0048 →
SECURITY AGREEMENT Recorded Nov 25, 2013
From: ARTESYN TECHNOLOGIES, INC.; ARTESYN NORTH AMERICA LLC; EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT AND GRANTEE
Reel/Frame 031719/0417 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 22, 2008
From: MOTOROLA, INC.
To: EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.
Reel/Frame 020540/0714 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 27, 2004
From: TUFFORD, ROBERT C.; HARRIS, JEFFREY M.
To: MOTOROLA, INC.
Reel/Frame 016088/0331 →