IP Library › Granted Patent US 1,000,400
Granted Patent S1
US 1,000,400 · App. 29/779,119 · Granted Oct 3, 2023

Light emitting diode package

Inventors: Robert Wilcox (Rolesville, NC); Sarah Trinkle (Todd, NC); Kyle Damborsky (Apex, NC); Colin Blakely (Raleigh, NC); Ayush Tripathi (Raleigh, NC)
Assignee: CreeLED, Inc.
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Quick Facts
Patent No.
US 1,000,400
App. No.
29/779,119
Granted
Oct 3, 2023
Kind
S1
Claims (1)

The ornamental design for a light emitting diode package, as shown and described.

Assignments (4)
PATENT SECURITY AGREEMENT Recorded Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; SMART MODULAR TECHNOLOGIES, INC.; PENGUIN COMPUTING, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →
RELEASE OF PATENT SECURITY INTEREST RECORDED AT R/F 058983/0001 Recorded Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
SECURITY INTEREST Recorded Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 8, 2021
From: WILCOX, ROBERT; TRINKLE, SARAH; DAMBORSKY, KYLE; BLAKELY, COLIN; TRIPATHI, AYUSH
To: CREELED, INC.
Reel/Frame 056789/0061 →