IP Library Granted Patent US 10,327,357
Granted Patent B2
US 10,327,357 · App. 14/490,186 · Granted Jun 18, 2019

Thermal conduction to a cylindrical shaft

Inventors: Martin Peter John Cornes (Phoenix, AZ); Suzanne Marye Wong (Tempe, AZ); Ross L. Armstrong (Phoenix, AZ); Douglas L. Sandy (Chandler, AZ)
Assignee: Artesyn Embedded Computing, Inc.
H05K7/2039H05K1/0201H05K1/0203H05K7/20H05K7/2049H05K7/20436G06F1/183G06F1/188G06F1/20H05K1/0204H05K1/181H05K5/0247H05K7/023H05K7/026H05K7/1427H05K7/20409H05K7/20418H05K7/20427H05K7/20445H05K2201/066
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Quick Facts
Patent No.
US 10,327,357
App. No.
14/490,186
Granted
Jun 18, 2019
Kind
B2
Abstract

A canister system having a cylindrical housing and a modular electronic rack system disposed within the cylindrical housing. The modular electronic rack system includes a thermal contact member that is in at least selective physical contact with an interior surface of the cylindrical housing to permit conductive heat transfer there through. An input/output device extends along at least a portion of the modular electronic rack system and includes a power input and a signal output electrically coupled thereto. A plurality of electronic slots disposed at a position generally along the modular electronic rack system is provided.

Claims (18)

1. A canister system comprising:

a cylindrical housing;

a modular electronic rack system disposed within said cylindrical housing, said modular electronic rack system having a plurality of generally parallel, thermally conductive, ribs arranged generally perpendicularly to a central axis of the cylindrical housing a housing and extending away from a backplane in an arcuate manner, said plurality of ribs being in physical contact with an interior surface of said cylindrical housing to permit conductive heat transfer there through, said plurality of ribs supported by and extending away from the backplane at a first end and the backplane being arranged generally parallel to the central axis of the cylindrical housing;

an input/output board extending along at least a portion of said modular electronic rack system, said input/output board having a power input and a signal output electrically coupled thereto; and

a plurality of generally planar, parallel electronic slots defined by adjacent and opposite pairs of ribs in proximity to a second end of the ribs opposite the backplane and arranged perpendicularly to the backplane, each slot configured to receive a generally planar electronic card arranged perpendicularly to the backplane and inserted into the slot for electronic coupling to a corresponding slot in the backplane.

2. The canister system according to claim 1 wherein said plurality of electronic slots is configured to physically and operably receive an electronic card therein, each of said plurality of electronic slots being electrically connected to said input/output board to establish electrical communication between the electronic card and said input/output board.

3. The canister system according to claim 1 , wherein

physical contact between said plurality of ribs and said interior surface of said cylindrical housing is adjustable to selectively vary the conductive heat transfer.

4. The canister system according to claim 3 further comprising a wedge cam device operable to selectively exert a driving force to urge said plurality of ribs into said physical contact with said interior surface.

5. A canister system comprising:

a cylindrical housing;

a modular electronic rack system disposed within said cylindrical housing, said modular electronic rack system having a plurality of generally parallel rib members arranged generally perpendicularly to a central axis of the cylindrical housing and extending away from a backplane in an arcuate manner, said plurality of rib members being in physical contact at a variable force with an interior surface of said cylindrical housing to permit variable conductive heat transfer there through, said plurality of rib members supported by and extending away from a planar backplane at a first end the backplane being arranged generally parallel to the central axis of the cylindrical housing;

an input/output board extending along at least a portion of said modular electronic rack system, said input/output board having a power input and a signal output electrically coupled thereto;

a plurality of generally planar, parallel electronic slots defined by adjacent pairs of ribs in proximity to a second end of the ribs opposite to the backplane and arranged perpendicularly to the backplane, each slot configured to receive a generally planar electronic card arranged perpendicularly to the backplane and inserted into the slot for electronic coupling to the backplane, wherein the plurality of parallel electronic slots is dispose at a position generally along said modular electronic rack system; and

said plurality of rib members being adjustable to selectively vary a force of said physical contact with said interior surface of said cylindrical housing.

6. The canister system according to claim 5 wherein said plurality of electronic slots is configured to physically and operably receive an electronic card therein, each of said plurality of electronic slots being electrically connected to said input/output board to establish electrical communication between the electronic card and said input/output board.

7. The canister system according to claim 5 further comprising a wedge cam device operable to selectively exert a driving force to urge said rib members into said physical contact with said interior surface.

8. The canister system according to claim 7 wherein said backplane has a longitudinal axis generally parallel to a longitudinal axis of said cylindrical housing.

Assignments (9)
PATENT SECURITY AGREEMENT Recorded Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; SMART MODULAR TECHNOLOGIES, INC.; PENGUIN COMPUTING, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →
RELEASE OF PATENT SECURITY INTEREST RECORDED AT R/F 058983/0001 Recorded Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
RELEASE OF SECURITY INTEREST Recorded Feb 7, 2022
From: BANK OF AMERICA, N.A., AS AGENT
To: SMART EMBEDDED COMPUTING, INC.
Reel/Frame 058913/0097 →
RELEASE OF SECURITY INTEREST AT REEL 050471 FRAME 0912 Recorded Feb 7, 2022
From: BARCLAYS BANK PLC
To: SMART EMBEDDED COMPUTING, INC.
Reel/Frame 058961/0005 →
SECURITY INTEREST Recorded Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
SECURITY INTEREST Recorded Dec 23, 2020
From: SMART EMBEDDED COMPUTING INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 054739/0137 →
CHANGE OF NAME Recorded Jun 24, 2020
From: ARTESYN EMBEDDED COMPUTING, INC.
To: SMART EMBEDDED COMPUTING, INC.
Reel/Frame 053023/0953 →
SECURITY AGREEMENT Recorded Sep 24, 2019
From: SMART EMBEDDED COMPUTING, INC.
To: BARCLAYS BANK PLC
Reel/Frame 050471/0912 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 24, 2014
From: CORNES, MARTIN PETER JOHN; WONG, SUZANNE MARYE; ARMSTRONG, ROSS L; SANDY, DOUGLAS L
To: ARTESYN EMBEDDED COMPUTING, INC.
Reel/Frame 034245/0984 →
Continuity (1)
Related Publication 20160088776A1 · Mar 24, 2016