Semiconductor light emitting devices including an optically transmissive element
View Patent ↗Methods of packaging a semiconductor light emitting device include dispensing a first quantity of encapsulant material into a cavity including the light emitting device. The first quantity of encapsulant material in the cavity is treated to form a hardened upper surface thereof having a shape. A luminescent conversion element is provided on the upper surface of the treated first quantity of encapsulant material. The luminescent conversion element includes a wavelength conversion material and has a thickness at a middle region of the cavity greater than proximate a sidewall of the cavity.
1. A semiconductor light emitting device, comprising:
a light emitting device;
a first quantity of cured encapsulant material on the light emitting device; and
an optically transmissive element on an upper surface of the first quantity of encapsulant material; and
wherein at least on of the first quantity of cured encapsulant material or the optically transmissive element include a wavelength conversion material and wherein the semiconductor light emitting device exhibits a variation of correlated color temperature across a 180 (+/−90 from central axis)-degree range of emission angles of less than 2000 K.
2. The device of claim 1 , wherein the optically transmissive element has a thickness at a middle region of the light emitting device greater than at a region displaced from the middle region of the light emitting device.
3. The device of claim 2 wherein the thickness of the optically transmissive element continuously decreases as the optically transmissive element extends radially outward from the middle region to the sidewall.
4. The device of claim 2 wherein the thickness of the optically transmissive element varies by more than ten percent of a maximum thickness of the optically transmissive element.
5. The device of claim 1 wherein the light emitting device comprises a light emitting diode (LED).
6. The device of claim 1 wherein the device has a minimum color temperature no more than 30 percent below a maximum color temperature thereof over a 180 (+/−90 from central axis)-degree range of emission angles.
7. The device of claim 1 wherein the device has a primary emission pattern having a total correlated color temperature (CCT) variation of less than about 1000K over a 180 (+/−90 from central axis)-degree range of emission angles.
8. The device of claim 1 wherein the device has a primary emission pattern having a total CCT variation of about 500K over a 180 (+/−90 from central axis)-degree range of emission angles.
9. The device of claim 1 wherein the device has a primary emission pattern having a total correlated color temperature (CCT) variation of less than about 1000K over a 120 (+/−45 from central axis)-degree range of emission angles.
10. The device of claim 1 wherein the device has a primary emission pattern having a total correlated color temperature (CCT) variation of less than about 500K over a 90 (+/−45 from central axis)-degree range of emission angles.
11. The device of claim 1 wherein the optically transmissive element has a concavo-convex shape.