Granted Patent B2

US 12,328,980 · App. 17/336,454 · Granted Jun 10, 2025

Inventor: Michael Check (Apex, NC)

Assignee: CreeLED, Inc.

H10H20/841H10H20/8312H10H20/833H10H20/813H10H20/816H10H20/82H10H20/825H10H20/84H10H20/856

Abstract

Claims (45)

1. A light-emitting diode (LED) chip comprising:

an active LED structure comprising an active layer between an n-type layer and a p-type layer; and

a first reflective layer adjacent the active LED structure and comprising a plurality of first dielectric layers and a plurality of second dielectric layers, wherein each layer of the plurality of first dielectric layers comprises a different thickness;

wherein an average thickness of the plurality of first dielectric layers is greater than an average thickness of the plurality second dielectric layers;

wherein at least one layer of the plurality of second dielectric layers comprises a thickness greater than at least one layer of the plurality of first dielectric layers; and

wherein a thickest layer of the plurality of first dielectric layers is between other layers of the plurality of first dielectric layers and a thinnest layer of the plurality of first dielectric layers is arranged farthest away from the active LED structure than other layers of the plurality of first dielectric layers; and

wherein an average reflectivity of the first reflective layer for a wavelength of 460 nanometers is above 93% for angles of incidence in a range from 15 degrees to 50 degrees.

2. The LED chip of claim 1 wherein the average thickness of the plurality of first dielectric layers is greater than the average thickness of the plurality second dielectric layers by at least a factor of 2.

3. The LED chip of claim 1 wherein the average thickness of the plurality of first dielectric layers is greater than the average thickness of the plurality second dielectric layers by at least a factor of 3.

4. The LED chip of claim 1 wherein the thickest layer of the plurality of first dielectric layers is adjacent the active LED structure.

5. The LED chip of claim 1 wherein the thickest layer of the plurality of first dielectric layers is at least 10 times thicker than the thinnest layer of the plurality of first dielectric layers.

6. The LED chip of claim 1 wherein a second thickest layer of the plurality of first dielectric layers is adjacent the thickest layer of the plurality of first dielectric layers.

7. The LED chip of claim 1 wherein the plurality of first dielectric layers comprises silicon dioxide.

8. The LED chip of claim 1 wherein the plurality of second dielectric layers comprises silicon nitride.

9. The LED chip of claim 1 further comprising:

a current-spreading layer between the active LED structure and the first reflective layer; and

a second reflective layer, wherein the second reflective layer comprises an electrical path through the first reflective layer to the current-spreading layer.

10. A device comprising:

a light source; and

a first reflective layer in an optical path of the light source;

wherein the first reflective layer comprises a plurality of first dielectric layers and a plurality of second dielectric layers;

wherein an average thickness of the plurality of first dielectric layers is greater than an average thickness of the plurality second dielectric layers;

wherein at least one layer of the plurality of second dielectric layers comprises a thickness greater than at least one layer of the plurality of first dielectric layers;

wherein a thickest layer of the plurality of first dielectric layers is between other layers of the plurality of first dielectric layers, and a thinnest layer of the plurality of first dielectric layers is arranged farthest away from the light source than other layers of the plurality of first dielectric layers; and

wherein an average reflectivity of the first reflective layer for a wavelength of 460 nanometers is above 93% for angles of incidence in a range from 15 degrees to 50 degrees.

11. The device of claim 10 further comprising:

a submount;

wherein the light source comprises at least one LED chip mounted to the submount and the first reflective layer is between the at least one LED chip and the submount.

12. The device of claim 11 wherein the at least one LED chip comprises a plurality of LED chips.

13. The device of claim 10 wherein the light source comprises a monolithic multiple-junction LED chip.

14. The device of claim 10 further comprising:

a housing;

wherein the light source comprises at least one packaged LED mounted to the housing and the first reflective layer is on the housing.

15. A device comprising:

a light source; and

a first reflective layer in an optical path of the light source;

wherein the first reflective layer comprises a plurality of first dielectric layers and a plurality of second dielectric layers wherein each layer of the plurality of first dielectric layers comprises a different thickness;

wherein a thickest layer of the plurality of first dielectric layers is between other layers of the plurality of first dielectric layers, and a thinnest layer of the plurality of first dielectric layers is arranged farthest away from the light source than other layers of the plurality of first dielectric layers; and

wherein an average reflectivity of the first reflective layer for a wavelength of 460 nanometers is above 93% for angles of incidence in a range from 15 degrees to 50 degrees.

16. A light-emitting diode (LED) chip comprising:

an active LED structure comprising an active layer between an n-type layer and a p-type layer; and

a first reflective layer adjacent the active LED structure and comprising a plurality of first dielectric layers and a plurality of second dielectric layers, wherein each layer of the plurality of first dielectric layers comprises a different thickness;

wherein a thickest layer of the plurality of first dielectric layers is between other layers of the plurality of first dielectric layers, a thinnest layer of the plurality of first dielectric layers is arranged farthest away from the active LED structure than other layers of the plurality of first dielectric layers, and at least one second dielectric layer of the plurality of second dielectric layers is at least two times thicker than at least one first dielectric layer of the plurality of first dielectric layers; and

wherein an average reflectivity of the first reflective layer for a wavelength of 460 nanometers is above 93% for angles of incidence in a range from 15 degrees to 50 degrees.

17. The LED chip of claim 16 further comprising a second reflective layer on the first reflective layer and an adhesion layer between the first reflective layer and the second reflective layer.

Assignments (3)

Continuity (2)

References Cited (153)