Packages for semiconductor light emitting devices utilizing dispensed reflectors and methods of forming the same
View Patent ↗A packaged LED includes a substrate, an LED chip on the upper surface of the substrate, a first encapsulant material, including a reflective material, on the substrate and spaced apart from the LED chip, and a second encapsulant material on the LED chip. A method of forming a packaged LED includes forming a first meniscus control feature on a substrate and defining a first region of the substrate, forming a second meniscus control feature surrounding the first region and defining a second region of the substrate between the first meniscus control feature and the second meniscus control feature, mounting an LED chip within the first region, dispensing a first encapsulant material including a reflective material within the second region, curing the first encapsulant material, dispensing a second encapsulant material on the substrate within the first region, and curing the second encapsulant material.
1. A packaged LED comprising:
a substrate;
an LED chip on the substrate;
a first encapsulant material including a reflective material on the substrate in a region defined by a first and second meniscus control features comprising concentric traces on the surface of the substrate, the first encapsulant material spaced apart from the LED chip to thereby define an optical cavity around the LED chip and being configured to reflect at least a portion of light emitted by the LED chip; and
a second encapsulant material within the optical cavity and covering the LED chip.
2. The packaged LED of claim 1 , further comprising a third encapsulant material on the first encapsulant material and on the second encapsulant material wherein the third encapsulant material is in direct contact with both the first encapsulant material and the second encapsulant material.
3. The packaged LED of claim 1 , wherein the third encapsulant material extends onto the surface of the substrate outside the region in which the first encapsulant material is formed.
4. The packaged LED of claim 3 , wherein the third encapsulant material is within a region defined by a third trace on the surface of the substrate.
5. The packaged LED of claim 1 , wherein the first encapsulant material forms a generally semi-toroidal three dimensional geometric shape.
6. The packaged LED of claim 1 , wherein the first encapsulant material comprises a silver epoxy.
7. The packaged LED of claim 1 , wherein the first encapsulant material comprises silicone.
8. The packaged LED of claim 7 , wherein the reflective material comprises silver chrome flakes, and/or TiO 2 and/or SiO 2 particles.
9. The packaged LED of claim 8 , wherein the reflective material is coated on the first encapsulant material.
10. The packaged LED of claim 1 , wherein the second encapsulant material comprises a wavelength conversion material.
11. The packaged LED of claim 1 , further comprising a lens above the second encapsulant material, wherein the reflective material is configured to reflect light emitted from the LED chip through the lens.
12. The packaged LED of claim 2 , wherein the third encapsulant material comprises a wavelength conversion material.
13. A packaged LED comprising:
a submount including a substrate;
an LED chip on the substrate;
a first meniscus control feature on the substrate, the first meniscus control feature comprising a first trace on a surface of the substrate and defining an encapsulant region around the LED chip, and
a second meniscus control feature on the substrate, the second meniscus control feature comprising a second trace on the surface of the substrate and surrounding the encapsulant region and defining a region of the substrate between the first meniscus control feature and the second meniscus control feature;
a first encapsulant material on the substrate within the region defined by the first meniscus control feature and the second meniscus control feature, the first encapsulant material including a reflective material and defining a cavity around the LED chip; and
a second encapsulant material within the cavity.
14. The packaged LED of claim 13 , further comprising:
a third meniscus control feature comprising a third trace on the surface of the substrate surrounding the second meniscus control feature; and
a third encapsulant material directly on the first encapsulant material and the second encapsulant material within a region defined by the third meniscus control feature, wherein the third encapsulant material extends onto the substrate between the second meniscus control feature and the third meniscus control feature.
15. The packaged LED of claim 13 , further comprising a third encapsulant material directly on the first encapsulant material and the second encapsulant material.
16. The packaged LED of claim 13 , wherein the region of the substrate between the first meniscus control feature and the second meniscus control feature is generally annular.
17. The packaged LED of claim 13 , wherein the first and second meniscus control features comprise metal traces.
18. The packaged LED of claim 13 , wherein the first and/or second meniscus control features comprises a metal film.
19. The packaged LED of claim 13 , wherein the first and second meniscus control features comprise the same material.
20. The packaged LED of claim 19 , wherein the first and/or second meniscus control features comprise a plated metal film or a polymer feature.