IP Library Granted Patent US 7,539,183
Granted Patent B2
US 7,539,183 · App. 10/178,670 · Granted May 26, 2009

Multi-service platform system and method

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Quick Facts
Patent No.
US 7,539,183
App. No.
10/178,670
Granted
May 26, 2009
Kind
B2
Abstract

A multi-service platform system ( 100, 200 ) including a VMEbus network ( 102 ) and a switched fabric network ( 104 ) wherein the VMEbus network ( 102 ) and the switched fabric network ( 104 ) operate concurrently within the multi-service platform system ( 100, 200 ). Multi-service platform system ( 100, 200 ) can include a payload module ( 106 ) with a first switched fabric connector ( 210 ) in a P 0 mechanical envelope ( 218 ) that is designed to interface with a corresponding first switched fabric connector ( 212 ) in the J 0 mechanical envelope ( 220 ) on a backplane ( 204 ).

Claims (31)

1. A multi-service platform system comprising:

a VMEbus network;

a switched fabric network, wherein the VMEbus network and the switched fabric network operate concurrently within the multi-service platform system and wherein the switched fabric network uses one of InfiniBand, Serial RapidIO, FibreChannel, Ethernet, PCI Express and Hypertransport switched fabric network standards;

a payload module having a first switched fabric connector in a P0 mechanical envelope on the pavload module; and

a multi-service platform system chassis having a backplane and a first slot, wherein the backplane and the first slot are designed to receive the payload module, and wherein the backplane comprises a corresponding first switched fabric connector in a J0 mechanical envelope designed to interface with the first switched fabric connector.

2. The multi-service platform system of claim 1 , wherein the VMEbus network operates as a control plane, and wherein the switched fabric network operates as a data plane.

3. The multi-service platform system of claim 1 , further comprising a plurality of switched fabric network standards, wherein the payload module includes a payload module keying mechanism in the P0 mechanical envelope that uniquely corresponds to one of the plurality of switched fabric network standards, wherein the backplane includes a corresponding payload module keying mechanism in the J 0 mechanical envelope that uniquely corresponds to one of the plurality of switched fabric network standards, and wherein the payload module keying mechanism and the corresponding payload module keying mechanism are designed to interconnect when both correspond to a same one of the plurality of switched fabric network standards.

4. The multi-service platform system of claim 3 , wherein the corresponding payload module keying mechanism precludes coupling of an incompatible payload module to the backplane.

5. The multi-service platform system of claim 1 , further comprising a plurality of switched fabric network standards, wherein the first switched fabric connector is compatible with any of the plurality of switched fabric network standards.

6. The multi-service platform system of claim 1 , wherein the corresponding first switched fabric connector is configured to allow coupling of a legacy VME module to the backplane in the first slot.

7. The multi-service platform system of claim 1 , further comprising a switch module, wherein the multi-service platform system chassis further comprises a second slot, wherein the backplane and the second slot are designed to receive the switch module, and wherein the switch module is coupled to the corresponding first switched fabric connector through the backplane.

8. The multi-service platform system of claim 7 , further comprising a plurality of switched fabric network standards, wherein the switch module includes a switch module keying mechanism that uniquely corresponds to one of the plurality of switched fabric network standards, wherein the backplane includes a corresponding switch module keying mechanism that uniquely corresponds to one of the plurality of switched fabric network standards, and wherein the switch module keying mechanism and the corresponding switch module keying mechanism are designed to interconnect when both correspond to a same one of the plurality of switched fabric network standards.

9. The multi-service platform system of claim 7 , wherein the corresponding switch module keying mechanism precludes coupling of an incompatible switch module to the backplane.

10. The multi-service platform system of claim 7 , wherein the payload module and the switch module communicate using the switched fabric network via the first switched fabric connector.

11. The multi-service platform system of claim 7 , further comprising a plurality of payload modules, wherein the switch module is coupled to the plurality of payload modules.

12. A payload module designed to operate within a multi-service platform system chassis having a VMEbus network and a switched fabric network that operate concurrently comprising:

a first switched fabric connector in a P 0 mechanical envelope on the payload module, wherein the first switched fabric connector is designed to interface with a corresponding first switched fabric connector on a backplane of the multi-service platform system chassis; and

a payload module keying mechanism in the P 0 mechanical envelope that uniquely corresponds to one of a plurality of switched fabric network standards.

13. The payload module of claim 12 , wherein the first switched fabric connector is compatible with any of the plurality of switched fabric network standards.

14. The payload module of claim 12 , wherein the switched fabric network uses one of InfiniBand, Serial RapidIO, FibreChannel, Ethernet, PCI Express and Hypertransport switched fabric network standards.

15. A method of operating a multi-service platform system, comprising:

providing a VMEbus network and a switched fabric network that operate concurrently within the multi-service platform system;

providing a payload module having a first switched fabric connector in a P 0 mechanical envelope on the payload module, wherein the payload module is coupled to the multi-service platform system via a first slot and a backplane;

providing a switch module, wherein the switch module is coupled to the multi-service platform system via a second slot and the backplane; and

the payload module and the switch module communicating using the switched fabric network.

16. The method of claim 15 , further comprising:

the VMEbus network operating as a control plane; and

the switched fabric network operating as a data plane.

17. The method of claim 15 , further comprising the switched fabric network using one of InfiniBand, Serial RapidIO, FibreChannel, Ethernet, PCI Express and Hypertransport switched fabric network standards.

18. The method of claim 17 , further comprising the multi-service platform system using a corresponding payload module keying mechanism in a J 0 mechanical envelope that uniquely corresponds to one of a plurality of switched fabric network standards to preclude coupling of an incompatible payload module to the backplane.

19. The method of claim 17 , further comprising the multi-service platform system using a corresponding switch module keying mechanism that uniquely corresponds to one of a plurality of switched fabric network standards to preclude coupling of an incompatible switch module to the backplane.

Assignments (10)
PATENT SECURITY AGREEMENT Recorded Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; SMART MODULAR TECHNOLOGIES, INC.; PENGUIN COMPUTING, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →
RELEASE OF PATENT SECURITY INTEREST RECORDED AT R/F 058983/0001 Recorded Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
SECURITY INTEREST Recorded Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
CHANGE OF NAME Recorded Jun 24, 2020
From: ARTESYN EMBEDDED COMPUTING, INC.
To: SMART EMBEDDED COMPUTING, INC.
Reel/Frame 053023/0953 →
CHANGE OF NAME Recorded Jun 18, 2020
From: EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.
To: ARTESYN EMBEDDED COMPUTING, INC.
Reel/Frame 052978/0634 →
RELEASE OF SECURITY INTEREST Recorded Jul 9, 2019
From: ARTESYN EMBEDDED COMPUTING, INC. (F/K/A EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.)
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049698/0222 →
PARTIAL RELEASE OF SECURITY INTEREST Recorded Jul 8, 2019
From: BANK OF AMERICA, N.A.
To: ARTESYN EMBEDDED COMPUTING, INC. (F/K/A EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.)
Reel/Frame 049694/0096 →
SECURITY AGREEMENT Recorded Nov 26, 2013
From: ARTESYN TECHNOLOGIES, INC.; ARTESYN NORTH AMERICA LLC; EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 031731/0048 →
SECURITY AGREEMENT Recorded Nov 25, 2013
From: ARTESYN TECHNOLOGIES, INC.; ARTESYN NORTH AMERICA LLC; EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT AND GRANTEE
Reel/Frame 031719/0417 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 22, 2008
From: MOTOROLA, INC.
To: EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.
Reel/Frame 020540/0714 →