IP Library Granted Patent US 7,312,474
Granted Patent B2
US 7,312,474 · App. 10/963,666 · Granted Dec 25, 2007

Group III nitride based superlattice structures

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Quick Facts
Patent No.
US 7,312,474
App. No.
10/963,666
Granted
Dec 25, 2007
Kind
B2
Abstract

A light emitting diode is provided having a Group III nitride based superlattice and a Group III nitride based active region on the superlattice. The active region has at least one quantum well structure. The quantum well structure includes a first Group III nitride based barrier layer, a Group III nitride based quantum well layer on the first barrier layer and a second Group III nitride based barrier layer. A Group III nitride based semiconductor device and methods of fabricating a Group III nitride based semiconductor device having an active region comprising at least one quantum well structure are provided. The quantum well structure includes a well support layer comprising a Group III nitride, a quantum well layer comprising a Group III nitride on the well support layer and a cap layer comprising a Group III nitride on the quantum well layer. A Group III nitride based semiconductor device is also provided that includes a gallium nitride based superlattice having at least two periods of alternating layers of In X Ga 1-X N and In Y Ga 1-Y N, where 0≦X<1 and 0≦Y<1 and X is not equal to Y. The semiconductor device may be a light emitting diode with a Group III nitride based active region. The active region may be a multiple quantum well active region.

Claims (27)

1. A Group III nitride based semiconductor device, comprising:

a superlattice having more than 5 periods of alternating layers of In X Ga 1-X N and In Y Ga 1-Y N, where 0≦X<1 and 0≦Y<1 and X is not equal to Y;

a first layer on the superlattice, wherein the first layer is undoped and/or is doped with silicon; and

a second layer on the superlattice opposite the first layer, wherein the second layer is an n-type layer,

wherein the first and second layers have different thicknesses than the alternating layers of the superlattice.

2. The Group III nitride based semiconductor device according to claim 1 , wherein the superlattice comprises from more than 5 to about 50 periods.

3. The Group III nitride based semiconductor device according to claim 1 , wherein the superlattice comprises 25 periods.

4. The Group III nitride based semiconductor device according to claim 1 , wherein the superlattice comprises 10 periods.

5. The Group III nitride based semiconductor device according to claim 1 , wherein layers of In X Ga 1-X N and In Y Ga 1-Y N of the alternating layers of In X Ga 1-X N and In Y Ga 1-Y N have a combined thickness of less than about 70 Å.

6. The Group III nitride based semiconductor device according to claim 1 , wherein X=0.

7. The Group III nitride based semiconductor device according to claim 6 , wherein InGaN layers of the alternating layers of In X Ga 1-X N and In Y Ga 1-Y N have a thickness of from about 5 to about 40 Å and GaN layers of the alternating layers of In X Ga 1-X N and In Y Ga 1-Y N have a thickness of from about 5 to about 100 Å.

8. The Group III nitride based semiconductor device according to claim 6 , wherein InGaN layers of the alternating layers of In X Ga 1-X N and In Y Ga 1-Y N have a thickness of about 15 Å and GaN layers of the alternating layers of In X Ga 1-X N and In Y Ga 1-Y N have a thickness of from about 30 Å.

9. The Group III nitride based semiconductor device according to claim 1 , wherein the superlattice is doped with an n-type impurity to a level of from about 1×10 17 cm −3 to about 5×10 19 cm −3 .

10. The Group III nitride based semiconductor device according to claim 9 , wherein the doping level of the superlattice is an actual doping level of at least one of the alternating layers of In X Ga 1-X N and In Y Ga 1-Y N.

11. The Group III nitride based semiconductor device according to claim 9 , wherein the doping level is an average doping level of the alternating layers of In X Ga 1-X N and In Y Ga 1-Y N.

12. The Group III nitride based semiconductor device according to claim 1 , further comprising doped Group III nitride layers adjacent the superlattice and wherein the doped Group III nitride layers are doped with an n-type impurity to provide an average doping of the doped Group III nitride layers and the superlattice of from about 1×10 17 cm −3 to about 5×10 19 cm −3 .

13. The Group III nitride based semiconductor device according to claim 1 , wherein the average bandgap of the superlattice is about 3.15 eV.

14. The Group III nitride based semiconductor device according to claim 1 , wherein the average bandgap of the superlattice is from about 2.95 to about 3.15 eV.

15. The Group III nitride based semiconductor device according to claim 1 , wherein the semiconductor device comprises a light emitting diode, the light emitting diode further comprising a Group III nitride based active region on the superlattice.

16. The Group III nitride based semiconductor device according to claim 15 , further comprising a Group III nitride based spacer layer between the active region and the superlattice.

17. The Group III nitride based semiconductor device according to claim 16 , wherein the spacer layer comprises undoped GaN.

18. The Group III nitride based semiconductor device according to claim 15 , wherein the active region comprises at least one quantum well.

19. The Group III nitride based semiconductor device according to claim 18 , wherein a bandgap of the at least one quantum well is less than a bandgap of the superlattice.

20. A light emitting diode, comprising:

a superlattice having at least two periods of alternating layers of In X Ga 1-X N and In Y Ga 1-Y N, where 0≦X<1 and 0≦Y<1 and X is not equal to Y; and

an active region on the superlattice, wherein a bandgap of the active region is less than an average bandgap of the superlattice.

21. The light emitting diode of claim 20 wherein the active region comprises at least one layer of a binary, ternary or quaternary Group III nitride material.

Assignments (8)
CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF THE ASSIGNEE PREVIOUSLY RECORDED ON REEL 56012 FRAME 200. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Jul 9, 2025
From: CREE, INC.
To: CREELED, INC.
Reel/Frame 071874/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; SMART MODULAR TECHNOLOGIES, INC.; PENGUIN COMPUTING, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →
RELEASE OF PATENT SECURITY INTEREST RECORDED AT R/F 058983/0001 Recorded Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
SECURITY INTEREST Recorded Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2021
From: CREE, INC.
To: CREE LED, INC.
Reel/Frame 056012/0200 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2021
From: CREE LIGHTING COMPANY
To: CREE, INC.
Reel/Frame 055792/0719 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2021
From: IBBETSON, JAMES
To: CREE LIGHTING COMPANY
Reel/Frame 055792/0663 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2021
From: EMERSON, DAVID TODD; BERGMANN, MICHAEL JOHN; DOVERSPIKE, KATHLEEN MARIE; O'LOUGHLIN, MICHAEL JOHN; NORDBY, HOWARD DEAN, JR.; ABARE, AMBER CHRISTINE
To: CREE, INC.
Reel/Frame 055792/0632 →