IP Library Granted Patent US 8,546,787
Granted Patent B2
US 8,546,787 · App. 13/250,715 · Granted Oct 1, 2013

Group III nitride based quantum well light emitting device structures with an indium containing capping structure

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Quick Facts
Patent No.
US 8,546,787
App. No.
13/250,715
Granted
Oct 1, 2013
Kind
B2
Abstract

Group III nitride based light emitting devices and methods of fabricating Group III nitride based light emitting devices are provided. The emitting devices include an n-type Group III nitride layer, a Group III nitride based active region on the n-type Group III nitride layer and comprising at least one quantum well structure, a Group III nitride layer including indium on the active region, a p-type Group III nitride layer including aluminum on the Group III nitride layer including indium, a first contact on the n-type Group III nitride layer and a second contact on the p-type Group III nitride layer. The Group III nitride layer including indium may also include aluminum.

Claims (16)

1. A light emitting diode, comprising:

an n-type Group III nitride layer;

a Group III nitride light emitting diode active region on the n-type Group III nitride layer, the light emitting diode active region comprising at least one quantum well structure; and

an undoped Group III nitride capping layer comprising indium on the light emitting diode active region opposite from the n-type Group III nitride layer, wherein the capping layer is distinct from the light emitting diode active region, and wherein the capping layer is directly on a binary Group III nitride layer.

2. The light emitting diode of claim 1 , wherein the capping layer comprising indium comprises a quaternary layer.

3. The light emitting diode of claim 1 , wherein the binary Group III nitride layer comprises a barrier layer of the active region.

4. The light emitting diode of claim 1 , wherein the binary Group III nitride layer is between the active region and the undoped capping layer.

5. The light emitting diode of claim 1 , wherein the undoped Group III nitride capping layer further comprises aluminum.

6. The light emitting diode of claim 1 , further comprising:

a p-type Group III nitride layer directly on the undoped Group III nitride capping layer and remote from the active region.

7. The light emitting diode of claim 1 , wherein the undoped Group III nitride capping layer provides a transition from a lattice structure of the light emitting diode active region to a lattice structure of a p-type layer thereon.

8. The light emitting diode of claim 1 , wherein the undoped Group III nitride capping layer does not provide photon emission due to carrier recombination therein.

9. A light emitting diode, comprising:

an n-type Group III nitride layer;

a Group III nitride light emitting diode active region on the n-type Group III nitride layer, the light emitting diode active region comprising at least one quantum well structure; and

an undoped Group III nitride capping layer comprising indium on the light emitting diode active region opposite from the n-type Group III nitride layer, wherein the capping layer is distinct from the light emitting diode active region, and wherein the capping layer is directly on a quaternary barrier layer of the active region.

Assignments (6)
CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF THE ASSIGNEE PREVIOUSLY RECORDED ON REEL 56012 FRAME 200. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Jul 9, 2025
From: CREE, INC.
To: CREELED, INC.
Reel/Frame 071874/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; SMART MODULAR TECHNOLOGIES, INC.; PENGUIN COMPUTING, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →
RELEASE OF PATENT SECURITY INTEREST RECORDED AT R/F 058983/0001 Recorded Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
SECURITY INTEREST Recorded Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2021
From: CREE, INC.
To: CREE LED, INC.
Reel/Frame 056012/0200 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 30, 2021
From: BERGMANN, MICHAEL JOHN; EMERSON, DAVID TODD
To: CREE, INC.
Reel/Frame 055769/0095 →