IP Library Granted Patent US 8,822,245
Granted Patent B2
US 8,822,245 · App. 13/486,223 · Granted Sep 2, 2014

Packaged semiconductor light emitting devices having multiple optical elements and methods of forming the same

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Quick Facts
Patent No.
US 8,822,245
App. No.
13/486,223
Granted
Sep 2, 2014
Kind
B2
Abstract

Methods of packaging a semiconductor light emitting device include providing a substrate having the semiconductor light emitting device on a front face thereof. A first optical element is formed from a first material on the front face proximate the semiconductor light emitting device but not covering the semiconductor light emitting device and a second optical element is formed from a second material, different from the first material, over the semiconductor light emitting device and the first optical element. Packaged semiconductor light emitting devices are also provided.

Claims (12)

1. A method of packaging a semiconductor light emitting device, comprising:

providing a substrate having the semiconductor light emitting device on a front face thereof;

forming a first optical element from a first material on the front face proximate the semiconductor light emitting device using a process other than compression molding;

forming a second optical element from a second material, different from the first material, over the semiconductor light emitting device and the first optical element by compression molding the second optical element without leaving a gap between the first optical element and the second optical element, wherein the second optical element is formed to have a bi-axially symmetric shape centered over and surrounding the semiconductor light emitting device, wherein the bi-axially symmetric shape comprises a dome, and wherein the first optical element and the second optical element have different refractive indexes selected to provide a desired optical characteristic for the packaged semiconductor light emitting device;

removing the second material such that none of the second material remains outside of the dome; and

leaving an upper surface of the second optical element in contact with air in the packaged semiconductor light emitting device.

2. The method of claim 1 , wherein the substrate includes a plurality of semiconductor light emitting devices on the front face thereof and wherein forming the first optical element and forming the second optical element comprise:

forming a plurality of first optical elements using a process other than compression molding over respective ones of the plurality of semiconductor light emitting devices; and

forming a plurality of second optical elements over respective ones of the plurality of semiconductor light emitting devices and first optical elements using compression molding, wherein respective ones of the plurality of second optical elements have different bi-axially symmetric shapes selected to provide a desired optical performance characteristic.

3. The method of claim 2 , wherein forming a plurality of second optical elements comprises forming a plurality of second optical elements separated from each other.

4. The method of claim 2 , wherein forming a plurality of second optical elements comprises forming a plurality of second optical elements such that the plurality of second optical elements are not connected to each other by the second material.

5. The method of claim 1 , wherein forming the second optical element comprises forming the dome such that a bottom of the dome contacts the substrate.

Assignments (6)
CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF THE ASSIGNEE PREVIOUSLY RECORDED ON REEL 56012 FRAME 200. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Jul 9, 2025
From: CREE, INC.
To: CREELED, INC.
Reel/Frame 071874/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; SMART MODULAR TECHNOLOGIES, INC.; PENGUIN COMPUTING, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →
RELEASE OF PATENT SECURITY INTEREST RECORDED AT R/F 058983/0001 Recorded Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
SECURITY INTEREST Recorded Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2021
From: CREE, INC.
To: CREE LED, INC.
Reel/Frame 056012/0200 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 31, 2021
From: MEDENDORP, NICHOLAS W., JR.
To: CREE, INC.
Reel/Frame 055779/0410 →