IP Library Granted Patent US 8,957,438
Granted Patent B2
US 8,957,438 · App. 13/082,034 · Granted Feb 17, 2015

Methods of fabricating light emitting devices including multiple sequenced luminophoric layers

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Quick Facts
Patent No.
US 8,957,438
App. No.
13/082,034
Granted
Feb 17, 2015
Kind
B2
Abstract

An LED includes a first pedestal and may be fabricated by coating a first phosphor layer on the LED, thinning the first phosphor layer to expose the first pedestal, forming a second pedestal on the first pedestal, coating a second phosphor layer and thinning the second phosphor layer to expose the second pedestal. Alternatively, an LED having a pedestal is coated with a first phosphor layer, coated with a second phosphor layer and then planarized to expose the pedestal. Related structures are also provided.

Claims (42)

1. A method of fabricating a light emitting device, comprising:

providing a Light Emitting Diode (“LED”) including a first conductive pedestal that protrudes away from a face thereof;

coating a first luminophoric layer on the face including on the first conductive pedestal;

thinning the first luminophoric layer to expose the first conductive pedestal;

forming a second conductive pedestal on the first conductive pedestal that was exposed;

coating a second luminophoric layer on the first luminophoric layer and on the second conductive pedestal; and

thinning the second luminophoric layer to expose the second conductive pedestal.

2. A method according to claim 1 wherein coating the first luminophoric layer and coating the second luminophoric layer are performed using different luminophoric layer coating processes.

3. A method according to claim 1 wherein coating the first luminophoric layer and coating the second luminophoric layer both comprise syringe or nozzle dispensing.

4. A method according to claim 1 :

wherein the first luminophoric layer has a first absorption and emission spectra and the second luminophoric layer has a second absorption and emission spectra, and

wherein a shorter wavelength end of the emission spectrum of the second luminophoric layer overlaps with a longer wavelength end of the absorption spectrum of the first luminophoric layer.

5. A method according to claim 1 wherein providing an LED comprises providing a wafer including the LED.

6. A method according to claim 1 wherein providing an LED comprises providing an LED chip.

7. A method according to claim 4 wherein the LED has a peak emission wavelength in the blue region, the first luminophoric layer has a peak emission wavelength in the red region and the second luminophoric layer has a peak emission wavelength in the yellow region.

8. A method of fabricating a light emitting device, comprising:

providing a Light Emitting Diode (“LED”) including a conductive pedestal that protrudes away from a face thereof;

coating a first luminophoric layer on the face including on the conductive pedestal to provide a nonplanar first luminophoric layer;

coating a second luminophoric layer on the nonplanar first luminophoric layer and on the conductive pedestal; and then

planarizing the LED to expose the conductive pedestal.

9. A method according to claim 8 wherein coating the first luminophoric layer and coating the second luminophoric layer are performed using different luminophoric layer coating processes.

10. A method according to claim 8 wherein coating the first luminophoric layer comprises spray coating the first luminophoric layer and wherein coating the second luminophoric layer comprises syringe or nozzle dispensing the second luminophoric layer.

11. A method according to claim 8 :

wherein the first luminophoric layer has a first absorption and emission spectra and the second luminophoric layer has a second absorption and emission spectra, and

wherein a shorter wavelength end of the emission spectrum of the second luminophoric layer overlaps with a longer wavelength end of the absorption spectrum of the first luminophoric layer.

12. A method according to claim 8 wherein providing an LED comprises providing a wafer including the LED.

13. A method according to claim 8 wherein providing an LED comprises providing an LED chip.

14. A method according to claim 11 wherein the LED has a peak emission wavelength in the blue region, the first luminophoric layer has a peak emission wavelength in the red region and the second luminophoric layer has a peak emission wavelength in the yellow region.

15. A method of fabricating a light emitting device, comprising:

providing a Light Emitting Diode (“LED”) including a first conductive pedestal that protrudes away from a face thereof;

coating a first layer on the face including on the first conductive pedestal;

thinning the first layer to expose the first conductive pedestal;

forming a second conductive pedestal on the first conductive pedestal that was exposed;

coating a second layer on the first layer and on the second conductive pedestal; and

thinning the second layer to expose the second conductive pedestal.

16. A method according to claim 15 wherein coating the first layer and coating the second layer are performed using different coating processes.

17. A method of fabricating a light emitting device, comprising:

providing a Light Emitting Diode (“LED”) including a conductive pedestal that protrudes away from a face thereof;

coating a first layer on the face including on the conductive pedestal to provide a nonplanar first layer;

coating a second layer on the nonplanar first layer and on the conductive pedestal; and then

planarizing the LED to expose the conductive pedestal.

18. A method according to claim 17 wherein coating the first layer and coating the second layer are performed using different coating processes.

Assignments (6)
CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF THE ASSIGNEE PREVIOUSLY RECORDED ON REEL 56012 FRAME 200. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Jul 9, 2025
From: CREE, INC.
To: CREELED, INC.
Reel/Frame 071874/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; SMART MODULAR TECHNOLOGIES, INC.; PENGUIN COMPUTING, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →
RELEASE OF PATENT SECURITY INTEREST RECORDED AT R/F 058983/0001 Recorded Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
SECURITY INTEREST Recorded Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2021
From: CREE, INC.
To: CREE LED, INC.
Reel/Frame 056012/0200 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 7, 2011
From: CABALU, JASPER; DILLON, ALAN WELLFORD
To: CREE, INC.
Reel/Frame 026092/0705 →