Method and apparatus for cooling a module portion
View Patent ↗A method of cooling a module portion ( 202 ) of an embedded computer chassis ( 200 ), where the module portion comprises a front module ( 206 ) coupled to a front portion of a backplane ( 204 ), and a rear module ( 208 ) coupled to a rear portion of the backplane, where the front module and the rear module are horizontally disposed, the method includes drawing a cooling air mass ( 240 ) into the embedded computer chassis through a front surface ( 230 ) of a first interspace region ( 220 ) and an upper front surface ( 231 ) of a second interspace region ( 221 ) in a direction substantially perpendicular ( 250 ) to the front surface and the upper front surface. A third interspace region ( 222 ) receives a first portion of the cooling air mass ( 241 ), the cooling air mass exhausting from the embedded computer chassis through a rear surface ( 210 ) in a direction substantially perpendicular ( 256 ) to the rear surface.
1. An embedded computer chassis, comprising:
a plurality of outer surfaces comprising a rear surface, a top surface, a first side surface and a second side surface, wherein the rear surface is substantially perpendicular to the first side surface and the second side surface, and wherein the top surface is substantially perpendicular to the rear surface;
a module portion, comprising:
a backplane disposed substantially vertically within the embedded computer chassis, wherein the backplane is substantially parallel to the rear surface;
a front module coupled to a front portion of the backplane, wherein the front module is substantially horizontally disposed;
a rear module coupled to a rear portion of the backplane, wherein the rear module is substantially horizontally disposed; and
a separation plate horizontally disposed between the front module and the top surface;
a first interspace region defined by the module portion, the first side surface and the rear surface, wherein the first interspace region comprises a front surface substantially perpendicular to the top surface;
a second interspace region defined by the top surface and the separation plate, wherein the second interspace region comprises an upper front surface substantially perpendicular to the top surface and substantially parallel to the front surface, wherein a cooling air mass is drawn into the embedded computer chassis through the front surface and the upper front surface in a direction substantially perpendicular to the front surface and the upper front surface; and
a third interspace region defined by the module portion, the second side surface and the rear surface, wherein the third interspace region is coupled to receive a first portion of the cooling air mass, and wherein the cooling air mass exhausts from the embedded computer chassis through the rear surface in a direction substantially perpendicular to the rear surface.
2. The embedded computer chassis of claim 1 , further comprising an air-moving means disposed in the second interspace region, wherein the air-moving means is coupled to push the first portion of the cooling air mass over the front module in a direction substantially parallel to the backplane, and wherein the air-moving means is coupled to push a second portion of the cooling air mass over the rear module in a direction substantially perpendicular to the backplane.
3. The embedded computer chassis of claim 1 , wherein the backplane operates a switched fabric.
4. The embedded computer chassis of claim 1 , wherein the backplane defines a rear module cooling port, and wherein a second portion of the cooling air mass passes through the rear module cooling port in a direction substantially perpendicular to the backplane.
5. A method of cooling an embedded computer chassis, comprising:
providing the embedded computer chassis including a plurality of outer surfaces comprising a rear surface, a top surface, a first side surface and a second side surface, wherein the rear surface is substantially perpendicular to the first side surface and the second side surface, and wherein the top surface is substantially perpendicular to the rear surface;
providing a module portion, comprising:
a backplane disposed substantially vertically within the embedded computer chassis, wherein the backplane is substantially parallel to the rear surface;
a front module coupled to a front portion of the backplane, wherein the front module is substantially horizontally disposed:
a rear module coupled to a rear portion of the backplane, wherein the rear module is substantially horizontally disposed; and
a separation plate horizontally disposed between the front module and the top surface;
providing a first interspace region defined by the module portion, the first side surface and the rear surface, wherein the first interspace region comprises a front surface substantially perpendicular to the top surface;
providing a second interspace region defined by the top surface and the separation plate, wherein the second interspace region comprises an upper front surface substantially perpendicular to the top surface and substantially parallel to the front surface;
drawing a cooling air mass into the embedded computer chassis through the front surface and the upper front surface in a direction substantially perpendicular to the front surface and the upper front surface;
providing a third interspace region defined by the module portion, the second side surface and the rear surface;
the third interspace region receiving a first portion of the cooling air mass; and
the cooling air mass exhausting from the embedded computer chassis through the rear surface in a direction substantially perpendicular to the rear surface.
6. The method of claim 5 , further comprising:
an air-moving means disposed in the second interspace region pushing the first portion of the cooling air mass over the front module in a direction substantially parallel to the backplane;
the air-moving means pushing a second portion of the cooling air mass over the rear module in a direction substantially perpendicular to the backplane.
7. The method of claim 5 wherein the backplane operates a switched fabric.
8. The method of claim 5 , wherein a second portion of the cooling air mass is passing through a rear module cooling port in a direction substantially perpendicular to the backplane.
9. A method of cooling a module portion of an embedded computer chassis, wherein the module portion comprises a front module coupled to a front portion of a backplane, and a rear module coupled to a rear portion of the backplane, wherein the front module and the rear module are horizontally disposed, the method comprising:
drawing a cooling air mass into the embedded computer chassis through a front surface of a first interspace region and an upper front surface of a second interspace region in a direction substantially perpendicular to the front surface and the upper front surface;
providing a third interspace region receiving a first portion of the cooling air mass, wherein; the cooling air mass is exhausting from the embedded computer chassis through a rear surface in a direction substantially perpendicular to the rear surface.
10. The method of claim 9 , further comprising:
providing an air-moving means disposed in the second interspace region pushing the first portion of the cooling air mass over the front module in a direction substantially parallel to the backplane, wherein the air-moving means pushing a second portion of the cooling air mass over the rear module in a direction substantially perpendicular to the backplane.
11. The method of claim 9 , wherein the backplane operates a switched fabric.
12. The method of claim 9 , wherein a second portion of the cooling air mass is passing through a rear module cooling port in a direction substantially perpendicular to the backplane.