IP Library Granted Patent US 8,283,869
Granted Patent B2
US 8,283,869 · App. 12/419,480 · Granted Oct 9, 2012

Semiconductor light emitting circuits including light emitting diodes and semiconductor shunt devices

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Quick Facts
Patent No.
US 8,283,869
App. No.
12/419,480
Granted
Oct 9, 2012
Kind
B2
Abstract

Semiconductor light emitting circuits include semiconductor light emitting diodes that are serially connected between a pair of input terminals. Four layer semiconductor devices, such as Shockley diodes and/or thyristors are also provided, a respective one of which is connected across a respective one of the semiconductor light emitting diodes. The four layer semiconductor devices can allow a string of light emitting diodes to continue to be lit if one light emitting diode fails.

Claims (26)

1. A semiconductor light emitting circuit comprising:

a plurality of semiconductor light emitting diodes having a diode forward voltage, that are serially connected between a pair of input terminals; and

a plurality of semiconductor shunt devices having a shunt device forward voltage that is approximately equal to the diode forward voltage, a respective one of which is connected across a respective one of the plurality of semiconductor light emitting diodes, so as to turn on upon failure of the respective one of the plurality of semiconductor light emitting diodes and preserve the serial connection between the pair of input terminals.

2. A circuit according to claim 1 wherein the plurality of semiconductor shunt devices comprise a plurality of three terminal four layer semiconductor devices.

3. A circuit according to claim 1 wherein the plurality of semiconductor shunt devices comprise a plurality of Shockley diodes or a plurality of thyristors.

4. A circuit according to claim 1 wherein the plurality of semiconductor shunt devices are connected across a respective one of the plurality of semiconductor light emitting diodes in parallel, such that an anode of a respective semiconductor light emitting diode is connected to an anode of a respective semiconductor shunt device.

5. A circuit according to claim 1 wherein the plurality of semiconductor light emitting diodes and the plurality of semiconductor shunt devices comprise a same semiconductor material.

6. A circuit according to claim 1 wherein a respective semiconductor light emitting diode and a respective semiconductor shunt device are integrated on a common semiconductor substrate.

7. A circuit according to claim 1 further comprising a constant current source that is connected to the pair of input terminals.

8. A circuit according to claim 1 further comprising:

a power source that is connected to the pair of input terminals and is responsive to a change in a voltage across the input terminals to increase a current provided through the semiconductor light emitting diodes.

9. A circuit according to claim 1 wherein the plurality of semiconductor shunt devices are a plurality of non-light emitting semiconductor shunt devices.

10. A circuit according to claim 1 wherein the plurality of semiconductor shunt devices are a plurality of non-light responsive semiconductor shunt devices.

11. A semiconductor light emitting circuit comprising:

a semiconductor light emitting diode having a diode anode and a diode cathode;

a semiconductor shunt device having a shunt device anode and a shunt device cathode and connected in parallel to the semiconductor light emitting diode such that the light emitting diode anode is connected to the shunt device anode, the light emitting diode cathode is connected to the shunt device cathode and the semiconductor shunt device turns on upon failure of the semiconductor light emitting diode; and

a direct current (DC) power supply that is connected across the diode anode/shunt device anode and the diode cathode/shunt device cathode.

12. A circuit according to claim 11 wherein the semiconductor shunt device comprises a three terminal four layer semiconductor device.

13. A circuit according to claim 11 wherein the semiconductor shunt device comprises a Shockley diode or a thyristor.

14. A circuit according to claim 11 wherein the semiconductor light emitting diode has a diode forward voltage and wherein the semiconductor shunt device has a peak forward voltage that is approximately equal to the diode forward voltage.

15. A circuit according to claim 11 wherein the semiconductor light emitting diode and the semiconductor shunt device comprise a same semiconductor material.

16. A circuit according to claim 11 wherein the semiconductor light emitting diode and the semiconductor shunt device are integrated on a common semiconductor substrate.

17. A circuit according to claim 11 wherein the DC power supply is a constant current DC power supply.

18. A circuit according to claim 11 wherein the DC power supply is responsive to a change in a voltage across the semiconductor light emitting diode to increase a current provided through the semiconductor light emitting diode.

19. A circuit according to claim 11 wherein the semiconductor shunt device is a non-light emitting semiconductor shunt device.

20. A circuit according to claim 11 wherein the semiconductor shunt device is a non-light responsive semiconductor shunt device.

Assignments (6)
CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF THE ASSIGNEE PREVIOUSLY RECORDED ON REEL 56012 FRAME 200. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Jul 9, 2025
From: CREE, INC.
To: CREELED, INC.
Reel/Frame 071874/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; SMART MODULAR TECHNOLOGIES, INC.; PENGUIN COMPUTING, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →
RELEASE OF PATENT SECURITY INTEREST RECORDED AT R/F 058983/0001 Recorded Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
SECURITY INTEREST Recorded Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2021
From: CREE, INC.
To: CREE LED, INC.
Reel/Frame 056012/0200 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 31, 2021
From: NEGLEY, GERALD H.; VAN DE VEN, ANTONY P.
To: CREE, INC.
Reel/Frame 055778/0394 →