IP Library Granted Patent US 10,621,024
Granted Patent B2
US 10,621,024 · App. 15/700,561 · Granted Apr 14, 2020

Signal pairing for module expansion of a failsafe computing system

Inventors: Martin Peter John Cornes (Phoenix, AZ); Shlomo Pri-Tal (Phoenix, AZ)
Assignee: SMART Embedded Computing, Inc.
G06F11/0745G06F11/0796G06F13/4068
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Quick Facts
Patent No.
US 10,621,024
App. No.
15/700,561
Granted
Apr 14, 2020
Kind
B2
Abstract

A system includes a central processing unit (CPU), a first input/output (I/O) module, and a second I/O module. The first I/O module includes a first module health controller operatively connected to the CPU. The second I/O module includes a second module health controller operatively connected to the first module health controller and the CPU. One of the first module health controller and the second module health controller is configured to assert a paired module health signal to the CPU indicating that the first I/O module and the second I/O module are health.

Claims (39)

1. A system comprising:

a central processing unit (CPU);

a first input/output (I/O) module comprising a first module health controller operatively connected to the CPU; and

a second I/O module comprising a second module health controller operatively connected to the first module health controller and the CPU,

wherein the first module health controller and the second module health controller are configured to assert a paired module health signal to the CPU indicating that the first I/O module and the second I/O module are healthy, and

wherein the first I/O module and the second I/O module communicate at least one of a peer module present output (PMPO) signal, a peer module present input (PMPI) signal, a module health pair output (MHPO) signal, and a module health pair input (MHPI) signal therebetween.

2. The system of claim 1 , wherein the asserted paired module health signal comprises a repeating, predefined bit pattern.

3. The system of claim 1 , wherein the CPU is configured to place the first I/O module and the second I/O module in one of the following states upon reception of the asserted paired module health signal: an active state or a standby state.

4. The system of claim 1 , wherein one of the first module health controller and the second module health controller is configured to de-assert the paired module health signal if at least one of the first I/O module and the second I/O module is unhealthy.

5. The system of claim 4 , wherein the de-asserted paired module health signal comprises a low signal.

6. The system of claim 4 , wherein the CPU is configured to place the first I/O module and the second I/O module in a failsafe state upon reception of the de-asserted paired module health signal.

7. The system of claim 1 , further comprising:

a backplane operatively connected to the first module health controller, the second module health controller, and the CPU,

wherein the backplane is configured to transmit the at least one PMPO, PMPI, MHPO, and MHPI signals between the first module health controller and the second module health controller.

8. The system of claim 1 , wherein each of the first module health controller and second module health controller is configured to receive a PAIR signal indicating whether the first I/O module and second I/O module should assert their respective health statuses individually or in paired fashion.

9. A method comprising:

receiving, by a first input/output (I/O) module, a PAIR signal indicating whether the first I/O module should assert a paired module health signal or an individual module health signal;

in response to the PAIR signal indicating that the first I/O module should assert the paired module health signal, asserting, by the first I/O module, the paired module health signal; and

in response to the PAIR signal indicating that the first I/O module should assert the individual module health signal, asserting, by the first I/O module, the individual module health signal,

wherein the paired module health signal indicates a module health of both the first I/O module and a second I/O module operatively connected to the first I/O module, and

wherein the individual module health signal indicates a module health of only the first I/O module.

10. The method of claim 9 , further comprising:

in response to the first I/O module asserting the paired module health signal, placing the first I/O module and the second I/O module in one of the following states: an active state or a standby state.

11. The method of claim 9 , wherein the asserted paired module healthy signal comprises a repeating, predefined bit pattern.

12. The method of claim 9 , further comprising:

de-asserting, by the first I/O module, the paired module health signal in response to determining that at least one of the first I/O module and the second I/O module is unhealthy.

13. The method of claim 12 , wherein the de-asserted paired module health signal comprises a low signal.

14. The method of claim 12 , further comprising:

in response to the first I/O module de-asserting the paired module health signal, placing the first I/O module and the second I/O module in a failsafe state.

15. The method of claim 9 , further comprising:

transmitting signals between the first I/O module and the second I/O module.

16. The method of claim 15 , wherein the signals comprise at least one of:

a peer module present output (PMPO) signal;

a peer module present input (PMPI) signal;

a module health pair output (MHPO) signal; and

a module health pair input (MHPI) signal.

17. The method of claim 9 , further comprising:

in response to the first I/O module asserting the individual module health signal, placing the first I/O module in one of the following states: an active state or a standby state.

18. The method of claim 17 , wherein the asserted individual module health signal comprises a repeating, predefined bit pattern.

Assignments (9)
PATENT SECURITY AGREEMENT Recorded Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; SMART MODULAR TECHNOLOGIES, INC.; PENGUIN COMPUTING, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →
RELEASE OF PATENT SECURITY INTEREST RECORDED AT R/F 058983/0001 Recorded Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
RELEASE OF SECURITY INTEREST Recorded Feb 7, 2022
From: BANK OF AMERICA, N.A., AS AGENT
To: SMART EMBEDDED COMPUTING, INC.
Reel/Frame 058913/0097 →
RELEASE OF SECURITY INTEREST AT REEL 050471 FRAME 0912 Recorded Feb 7, 2022
From: BARCLAYS BANK PLC
To: SMART EMBEDDED COMPUTING, INC.
Reel/Frame 058961/0005 →
SECURITY INTEREST Recorded Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
SECURITY INTEREST Recorded Dec 23, 2020
From: SMART EMBEDDED COMPUTING INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 054739/0137 →
CHANGE OF NAME Recorded Jun 24, 2020
From: ARTESYN EMBEDDED COMPUTING, INC.
To: SMART EMBEDDED COMPUTING, INC.
Reel/Frame 053023/0953 →
SECURITY AGREEMENT Recorded Sep 24, 2019
From: SMART EMBEDDED COMPUTING, INC.
To: BARCLAYS BANK PLC
Reel/Frame 050471/0912 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 28, 2017
From: CORNES, MARTIN PETER JOHN; PRI-TAL, SHLOMO
To: ARTESYN EMBEDDED COMPUTING, INC.
Reel/Frame 043725/0988 →