OPTICAL ELEMENT WITH INTEGRATED INDICATOR
Solid state fixtures and packages are disclosed that include an optical element, such as an encapsulant, having an integrated indicator which indicates one or more characteristics of the package to a user, such as package orientation, polarity, chip-type, etc. The host optical element can be substantially symmetrical but for the indicator. Indicators can be additive, such as a bump, or subtractive, such as a hole. The indicator can be visible to the human eye, and/or can be machine detectable, such as by pick-and-place technology. Indicators can be formed by many processes including molding and laser ablation/imprinting, which is particularly suited for use with a hard host material.
1 . A light emitting device, comprising:
an optical element comprising an indicator.
2 . The light emitting device of claim 1 , further comprising a substrate;
wherein said optical element is on 90% or more of a top surface of said substrate.
3 . The light emitting device of claim 1 , further comprising a substrate;
wherein said encapsulant is on substantially all of a top surface of said substrate.
4 . The light emitting device of claim 1 , wherein said optical element is substantially opaque.
5 . The light emitting device of claim 1 , wherein said optical element is substantially symmetrical but for said indicator.
6 . The light emitting device of claim 1 , wherein said package is substantially symmetrical but for said indicator.
7 . The light emitting device of claim 1 , wherein said package is configured to emit a lumen output substantially equal to an equivalent package without said indicator.
8 . The light emitting device of claim 1 , wherein said package is configured to emit light with an output profile substantially similar to an equivalent package without said indicator.
9 . The light emitting device of claim 1 , wherein said optical element is molded.
10 . The light emitting device of claim 1 , wherein said optical element comprises silicone.
11 . The light emitting device of claim 1 , wherein said optical element is an encapsulant.
12 . The light emitting device of claim 1 , wherein said optical element is a lens.
13 . The light emitting device of claim 1 , wherein the shape of said optical element comprises said indicator.
14 . The light emitting device of claim 1 , wherein said indicator indicates the proper mounting orientation for said light emitting device.
15 . The light emitting device of claim 1 , further comprising at least one electrical connection;
wherein said indicator indicates the polarity of said electrical connection.
16 . The light emitting device of claim 1 , wherein said optical element comprises a material more rigid than silicone.
17 . The light emitting device of claim 1 , wherein said optical element comprises glass.
18 . The light emitting device of claim 1 , wherein said optical element is the primary mechanical support for said device.
19 . An optical element shaped to define at least one integrated indicator.
20 . The optical element of claim 19 , wherein said optical element is substantially symmetrical but for said at least one integrated indicator.
21 . The optical element of claim 19 , wherein said at least one integrated indicator is visible to the human eye.
22 . The optical element of claim 19 , wherein said integrated indicator comprises a first dimension of about 200 μm to about 500 μm.
23 . The optical element of claim 19 , wherein said optical element comprises said at least one integrated indicator.
24 . The optical element of claim 19 , wherein said at least one integrated indicator is additive.
25 . The optical element of claim 19 , wherein said at least one integrated indicator is subtractive.
26 . The optical element of claim 19 , wherein said at least one integrated indicator is frustospherical.
27 . The optical element of claim 19 , wherein said optical element is shaped to define at least one continuous integrated indicator that is not along a line of symmetry of said optical element.
28 . A method of forming an optical element, comprising:
providing a substantially symmetrical optical element; and
forming an indicator such that said optical element is no longer substantially symmetrical.
29 . The method of claim 28 , comprising providing an emitter wafer, said emitter wafer comprising a plurality of packages each comprising an optical element; and
forming an indicator in each of said optical elements.
30 . The method of claim 29 , further comprising singulating said packages such that each package comprises only one indicator.
31 . The method of claim 29 , wherein said optical elements share a common layer divisible to form at least part of each of said optical elements; and
wherein said common layer is shaped to define said indicators.
32 . The method of claim 31 , wherein said indicators comprise discrete indicators formed in each of said optical elements.
33 . The method of claim 31 , comprising forming a continuous indicator, said continuous indicator comprising an indicator in two or more of said optical elements.
34 . The method of claim 31 , wherein said wafer is a virtual wafer.
35 . The method of claim 31 , wherein said common layer comprises a material more rigid than silicone.
36 . The method of claim 31 , wherein said common layer comprises glass.
37 . The method of claim 28 , wherein said indicator is formed by laser imprinting or ablation.
38 . The method of claim 28 , wherein said indicator is formed by molding.
39 . The method of claim 28 , comprising curing or hardening said optical element around an indicator imprint.
40 . An emitter wafer, comprising:
a plurality of emitter packages, said emitter packages collectively comprising one or more common layers;
wherein said one or more common layers comprises a top layer; and
wherein said top layer is shaped to define an indicator in each of said emitter packages.
41 . The emitter wafer of claim 40 , wherein said indicator is continuous between two or more of said emitter packages.
42 . The emitter wafer of claim 40 , wherein said one or more common layers comprises a lower layer; and
wherein said top layer is more rigid than said lower layer.