IP Library Granted Patent US 8,525,190
Granted Patent B2
US 8,525,190 · App. 13/160,793 · Granted Sep 3, 2013

Conformal gel layers for light emitting diodes

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Quick Facts
Patent No.
US 8,525,190
App. No.
13/160,793
Granted
Sep 3, 2013
Kind
B2
Abstract

Light emitting devices include a light emitting diode die on a mounting substrate and a conformal gel layer on the mounting substrate and/or on the light emitting diode die. The conformal gel layer may at least partially fill a gap between the light emitting diode die and the mounting substrate. A phosphor layer and/or a molded dome may be provided on the conformal gel layer. The conformal gel layer may be fabricated by spraying and/or dispensing the gel that is diluted in the solvent.

Claims (37)

1. A light emitting device comprising:

a mounting substrate;

a light emitting diode die adjacent the mounting substrate to define a gap therebetween; and

a conformal gel layer on the mounting substrate beyond the light emitting diode die and that extends at least partially into the gap, the conformal gel layer including opposing surfaces that both conform to a contour of the mounting substrate.

2. A light emitting device according to claim 1 wherein the conformal gel layer also extends from the gap onto the light emitting diode die.

3. A light emitting device according to claim 2 wherein the opposing surfaces of the conformal gel layer also both conform to a contour of the light emitting diode die.

4. A light emitting device according to claim 3 further comprising a conformal phosphor layer on the conformal gel layer that extends onto the light emitting diode die, the conformal phosphor layer including opposing surfaces that both conform to the contour of the light emitting diode die.

5. A light emitting device according to claim 4 further comprising a lens on the conformal phosphor layer.

6. A light emitting device according to claim 4 wherein the conformal gel layer and the conformal phosphor layer both comprise silicone, but the conformal phosphor layer is not a gel.

7. A light emitting device according to claim 6 wherein the conformal gel layer is at least five times thinner than the conformal phosphor layer.

8. A light emitting device according to claim 3 further comprising a lens on the conformal gel layer.

9. A light emitting device according to claim 1 further comprising a bond region that connects the light emitting diode die to the mounting substrate and that is recessed from an edge of the light emitting diode die to define the gap, the conformal gel layer filling the gap.

10. A light emitting device comprising:

a mounting substrate;

a light emitting diode die adjacent the mounting substrate;

a bond region that connects the light emitting diode die to the mounting substrate and that is recessed from an edge of the light emitting diode die to define a gap;

a conformal phosphor layer that extends from the mounting substrate, across the gap and onto the light emitting diode die, the conformal phosphor layer including opposing surfaces that both conform to the contour of the mounting substrate and the light emitting diode die; and

a filler in the gap that is configured to prevent the conformal phosphor layer from entering the gap sufficiently to degrade operation of the light emitting device.

11. A light emitting device according to claim 10 wherein the filler also extends from the gap between the conformal phosphor layer and the mounting substrate.

12. A light emitting device according to claim 11 wherein the filler also extends from the gap between the conformal phosphor layer and the light emitting diode die.

13. A light emitting device comprising:

a mounting substrate;

a light emitting diode die on the mounting substrate; and

a conformal gel layer on the mounting substrate beyond the light emitting diode die and that extends at least partially onto the light emitting diode die, the conformal gel layer including opposing surfaces that both conform to a contour of the mounting substrate and the light emitting diode die.

14. A light emitting device according to claim 13 further comprising a conformal phosphor layer on the conformal gel layer, the conformal phosphor layer including opposing surfaces that both conform to a contour of the mounting substrate and the light emitting diode die.

15. A light emitting device according to claim 14 wherein the conformal gel layer and the conformal phosphor layer both comprise silicone, but the conformal phosphor layer is not a gel.

16. A light emitting device according to claim 15 wherein the conformal gel layer is at least five times thinner than the conformal phosphor layer.

17. A light emitting device according to claim 13 further comprising a lens on the conformal gel layer.

18. A light emitting device according to claim 14 further comprising a lens on the conformal phosphor layer.

19. A light emitting device according to claim 13 further comprising a phosphor layer on the conformal gel layer.

20. A light emitting device comprising:

a light emitting diode die; and

a gel layer that is less than about 20 μm thick throughout an extent thereof, on the light emitting diode die.

21. A light emitting device according to claim 20 wherein the gel layer is a conformal gel layer including opposing surfaces that both conform to a contour of the light emitting diode die.

22. A light emitting device according to claim 20 wherein the gel layer is less than about 10 μm thick throughout the extent thereof.

23. A light emitting device according to claim 20 wherein the gel layer is about 5 μm thick throughout the extent thereof.

24. A light emitting device according to claim 20 further comprising a phosphor layer on the gel layer.

Assignments (6)
CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF THE ASSIGNEE PREVIOUSLY RECORDED ON REEL 56012 FRAME 200. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Jul 9, 2025
From: CREE, INC.
To: CREELED, INC.
Reel/Frame 071874/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; SMART MODULAR TECHNOLOGIES, INC.; PENGUIN COMPUTING, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →
RELEASE OF PATENT SECURITY INTEREST RECORDED AT R/F 058983/0001 Recorded Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
SECURITY INTEREST Recorded Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2021
From: CREE, INC.
To: CREE LED, INC.
Reel/Frame 056012/0200 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 24, 2011
From: DONOFRIO, MATTHEW; EDMOND, JOHN ADAM; KONG, HUA-SHUANG
To: CREE, INC.
Reel/Frame 026800/0070 →