IP Library Granted Patent US 7,372,198
Granted Patent B2
US 7,372,198 · App. 10/947,704 · Granted May 13, 2008

Semiconductor light emitting devices including patternable films comprising transparent silicone and phosphor

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,372,198
App. No.
10/947,704
Granted
May 13, 2008
Kind
B2
Abstract

Semiconductor light emitting devices include a semiconductor light emitting element having a light emitting surface, and a patternable film including transparent silicone and phosphor on at least a portion of the light emitting surface. The patternable film may be a photopatternable film and/or a printable film including transparent silicone and phosphor. The patternable film includes an aperture therein that exposes a portion of a light emitting surface, and a bond pad is provided on the light emitting surface in the aperture. A wire bond may be provided on the bond pad. Related methods of fabricating semiconductor light emitting devices are also provided.

Claims (26)

1. A semiconductor light emitting device comprising:

a semiconductor light emitting element that includes a light emitting surface; and

a patternable film comprising transparent silicone and phosphor on at least a portion of the light emitting surface;

wherein the light emitting surface includes a face and an oblique sidewall that extends obliquely from the face, and wherein the patternable film comprising transparent silicone and phosphor is on the face and on the oblique sidewall; and

wherein the patternable film comprising transparent silicone and phosphor is thicker on the oblique sidewall than on the face.

2. A semiconductor light emitting device according to claim 1 wherein the patternable film comprising transparent silicone and phosphor includes an aperture therein that exposes a portion of the light emitting surface, and wherein the semiconductor light emitting device further comprises a bond pad on the exposed portion of the light emitting surface in the aperture.

3. A semiconductor light emitting device according to claim 2 further comprising a wire bond on the bond pad opposite the light emitting surface.

4. A semiconductor light emitting device according to claim 1 wherein the patternable film comprising transparent silicone and phosphor is at least 10% thicker on the oblique sidewall than on the face.

5. A semiconductor light emitting device according to claim 1 wherein the phosphor is configured to convert at least some light that is emitted from the light emitting surface such that light that emerges from the semiconductor light emitting device appears as white light.

6. A semiconductor light emitting device according to claim 1 further comprising:

a patternable film comprising transparent silicone and free of phosphor, between the light emitting surface and the transparent patternable film comprising silicone and phosphor.

7. A semiconductor light emitting device according to claim 1 wherein the semiconductor light emitting element comprises a first semiconductor light emitting element and wherein the light emitting surface comprise a first light emitting surface, the semiconductor light emitting device further comprising:

a second semiconductor light emitting element that is monolithically integrated with the first semiconductor light emitting element and that includes a second light emitting surface; and

wherein the patternable film comprising transparent silicone and phosphor is on at least a portion of the first and second light emitting surfaces.

8. A semiconductor light emitting device according to claim 1 wherein the semiconductor light emitting element comprises a first semiconductor light emitting element and wherein the light emitting surface comprises a first light emitting surface, the semiconductor light emitting device further comprising:

a second semiconductor light emitting element that includes a second light emitting surface; and

a mounting tape;

wherein the first and second light emitting devices are on the mounting tape and spaced apart from one another; and

wherein the patternable film comprising transparent silicone and phosphor is on at least a portion of the first and second light emitting surfaces.

9. A semiconductor light emitting device according to claim 8 wherein the patternable film comprising transparent silicone and phosphor extends onto the mounting tape between the spaced apart first and second light emitting devices.

10. A semiconductor light emitting device according to claim 9 wherein the first light emitting surface includes a first oblique sidewall facing the second semiconductor light emitting element, wherein the second light emitting surface includes a second oblique sidewall facing the first semiconductor light emitting element and wherein the patternable film comprising transparent silicone and phosphor also extends onto at least a portion of the first and second oblique sidewalls.

11. A semiconductor light emitting device according to claim 1 wherein the patternable film comprising transparent silicone and phosphor comprises a photopatternable film transparent comprising silicone and phosphor.

12. A semiconductor light emitting device according to claim 1 wherein the patternable film comprising transparent silicone and phosphor comprises a printable film comprising transparent silicone and phosphor.

13. A semiconductor light emitting device according to claim 1 wherein the patternable film comprising transparent silicone and phosphor is a first patternable film comprising transparent silicone and a first phosphor, the device further comprising:

a second patternable film comprising transparent silicone and a second phosphor on the first patternable film comprising transparent silicone and a first phosphor, opposite the light emitting surface.

14. A semiconductor light emitting device according to claim 13 wherein the first phosphor comprises a green phosphor and the second phosphor comprises a red phosphor.

Assignments (6)
CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF THE ASSIGNEE PREVIOUSLY RECORDED ON REEL 56012 FRAME 200. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Jul 9, 2025
From: CREE, INC.
To: CREELED, INC.
Reel/Frame 071874/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; SMART MODULAR TECHNOLOGIES, INC.; PENGUIN COMPUTING, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →
RELEASE OF PATENT SECURITY INTEREST RECORDED AT R/F 058983/0001 Recorded Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
SECURITY INTEREST Recorded Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2021
From: CREE, INC.
To: CREE LED, INC.
Reel/Frame 056012/0200 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 20, 2004
From: NEGLEY, GERALD H.
To: CREE, INC.
Reel/Frame 015479/0147 →