Payload module having a switched fabric enabled mezzanine card
View Patent ↗A multi-service platform system, includes a backplane ( 104 ), a switched fabric ( 106 ) on the backplane, and at least one of a VMEbus network and a PCI network coincident with the switched fabric on the backplane. A payload module ( 102 ) has one of a 3U form factor, a 6U form factor and a 9U form factor, where the payload module is communicatively coupled with the backplane using the switched fabric and at least one of the VMEbus network and the PCI network. At least one multi-gigabit connector ( 118 ) is coupled to a rear edge ( 119 ) of the payload module, where the at least one multi-gigabit connector is coupled to communicatively interface the payload module to the backplane, and where the switched fabric and at least one of the VMEbus network and the PCI network are communicatively coupled with the payload module through the at least one multi-gigabit connector.
1. A multi-service platform system, comprising:
a backplane;
a switched fabric on the backplane;
at least one of a VMEbus network and a PCI network coincident with the switched fabric on the backplane;
a payload module having one of a 3U form factor, a 6U form factor and a 9U form factor, wherein the payload module is communicatively coupled with the backplane using the switched fabric and at least one of the VMEbus network and the PCI network;
at least one multi-gigabit connector coupled to a rear edge of the payload module, wherein the at least one multi-gigabit connector is coupled to communicatively interface the payload module to the backplane, and wherein the switched fabric and at least one of the VMEbus network and the PCI network are communicatively coupled with the payload module through the at least one multi-gigabit connector; and
a switched fabric enabled mezzanine card coupled to the payload module, wherein the switched fabric enabled mezzanine card is coupled to directly communicate with the backplane.
2. The multi-service platform system of claim 1 , further comprising a switch module coupled to the backplane, wherein the switched fabric enabled mezzanine card is coupled to directly communicate with the switch module.
3. The multi-service platform system of claim 1 , further comprising a switch module coupled to the backplane, wherein the switch module directly controls the switched fabric enabled mezzanine card.
4. The multi-service platform system of claim 1 , wherein the switched fabric enabled mezzanine card is directly coupled to the backplane though the at least one multi-gigabit connector.
5. The multi-service platform system of claim 1 , wherein communication between the backplane and the switch fabric enabled mezzanine card occur exclusively through the at least one multi-gigabit connector.
6. The multi-service platform system of claim 1 , wherein at least one multi-gigabit connector spans substantially an entire portion of the rear edge of the payload module.
7. The multi-service platform system of claim 1 , wherein the rear edge of the payload module excludes a legacy connector.
8. The multi-service platform system of claim 1 , further comprising a switch module coupled to the backplane, wherein the switch module controls the switched fabric and wherein the switched fabric enabled mezzanine card is an independent node on the switched fabric.
9. The multi-service platform system of claim 1 , wherein the switched fabric enabled mezzanine card is coupled to directly communicate with the backplane through a fabric switch.
10. A payload module, comprising:
a switched fabric enabled mezzanine card connection site, wherein the payload module has one of a 3U form factor, a 6U form factor and a 9U form factor; and
at least one multi-gigabit connector directly coupled to a rear edge of the payload module and to the switched fabric enabled mezzanine card connection site, wherein the at least one multi-gigabit connector is coupled to communicatively interface the switched fabric enabled mezzanine card connection site to a backplane, wherein the backplane includes a switched fabric coincident with at least one of a VMEbus network and a PCI network, and wherein the switched fabric and at least one of the VMEbus network and the PCI network are communicatively coupled to the switched fabric enabled mezzanine card connection site through the at least one multi-gigabit connector.
11. The payload module of claim 10 , wherein the at least one multi-gigabit connector directly coupled to the switched fabric enabled mezzanine card connection site enables a switched fabric enabled mezzanine card coupled to the switched fabric enabled mezzanine card site to directly communicate with the backplane.
12. The payload module of claim 10 , wherein the switched fabric enabled mezzanine card connection site directly coupled to the at least one multi-gigabit connector enables the switched fabric enabled mezzanine card to directly communicate with a switch module coupled to the backplane.
13. The payload module of claim 10 , wherein the switched fabric enabled mezzanine card connection site directly coupled to the at least one multi-gigabit connector enables a switch module coupled to the backplane to directly control the switched fabric enabled mezzanine card.
14. The payload module of claim 10 , wherein the switched fabric enabled mezzanine card connection site directly coupled to the at least one multi-gigabit connector enables the switched fabric enabled mezzanine card as an independent node on the switched fabric.
15. The payload module of claim 10 , wherein communication between the backplane and the switch fabric enabled mezzanine card connection site occurs exclusively through the at least one multi-gigabit connector.
16. The payload module of claim 10 , wherein at least one multi-gigabit connector spans substantially an entire portion of the rear edge of the payload module.
17. The payload module of claim 10 , wherein the rear edge of the payload module excludes a legacy connector.
18. A method, comprising:
providing a payload module coupled to a backplane, wherein the payload module has one of a 3U form factor, a 6U form factor and a 9U form factor;
providing at least one multi-gigabit connector directly coupled to a rear edge of the payload module, wherein the at least one multi-gigabit connector is coupled to communicatively interface the payload module to a backplane, wherein the backplane includes a switched fabric coincident with at least one of a VMEbus network and a PCI network, and wherein the switched fabric and at least one of the VMEbus network and the PCI network are communicatively coupled to the payload module through the at least one multi-gigabit connector;
coupling a switched fabric enabled mezzanine card to the payload module; and
the switched fabric enabled mezzanine card directly communicating with the backplane.
19. The method of claim 18 , further comprising the switched fabric enabled mezzanine card directly communicating with a switch module coupled to the backplane.
20. The method of claim 18 , further comprising a switch module coupled to the backplane directly controlling the switched fabric enabled mezzanine card.
21. The method of claim 18 , wherein coupling the switched fabric enabled mezzanine card to the payload module comprises coupling the switched fabric enabled mezzanine card to a switched fabric enabled mezzanine card connection site on the payload module.
22. The method of claim 21 , wherein directly communicating the switched fabric enabled mezzanine card directly communicating with the backplane through the switched fabric enabled mezzanine card site and the at least one multi-gigabit connector.
23. The method of claim 18 , wherein directly communicating with the backplane comprises enabling the switched fabric enabled mezzanine card as an independent node on the switched fabric.