Time-division multiplexing data aggregation over high speed serializer/deserializer lane
View Patent ↗A digital signal interface includes a multiplexer coupled to receive a plurality of data signals from at least one of a microprocessor, a microcontroller, or a field-programmable gate array (FPGA), the multiplexer multiplexing the plurality of data signals. The interface further includes a serializer/deserializer (SerDes) transceiver coupled to receive the multiplexed data signals, the SerDes transceiver serializing the multiplexed data signals and transmitting the serialized data signals.
1. A digital signal interface, comprising:
a multiplexer coupled to receive a plurality time division multiplexed (TDM) data signals from a corresponding plurality of digital signal processors (DSP) comprising a DSP farm located on a front board of a telecommunications processing device connected to a rear transition module via a backplane, the multiplexer multiplexing the plurality of parallel data signals, wherein the data signal output by each DSP includes a plurality of output signal lines communicating signals in parallel; and
a serializer/deserializer (SerDes) transceiver coupled to receive the multiplexed plurality of TDM data signals, the SerDes transceiver serializing the multiplexed plurality of TDM data signals and transmitting the serialized data signals to the rear transition module, the rear transition module including a timeslot interchange (TSI) switch, receiving the serialized data
wherein each data signal includes a pair of serial clock signals and a pair of frame synchronization signals for receiving and transmitting the parallel data signals.
2. The interface of claim 1 , wherein the telecommunications board is an Advanced Telecommunications Computing Architecture (AdvancedTCA or ATCA) blade.
3. The interface of claim 1 , wherein the multiplexer and the SerDes transceiver comprise a time-division multiplexing (TDM) interface.
4. The interface of claim 3 , wherein the TDM interface is one of a Telecom Serial Interface Port (TSIP), an E1/T1 SPI POS-PHY level 4, a scalable bandwidth interconnect (SBI), or a high-speed multi vendor interface protocol (HMVIP).
5. The interface of claim 1 , wherein the SerDes transceiver further comprises a parallel-to-serial (PISO) functional module and a serial-to-parallel (SIPO) functional module and uses an 8B/10B SerDes coding scheme.
6. The interface of claim 1 , wherein the SerDes transceiver transmits the serialized data signals to a framer.
7. The interface of claim 1 , wherein the SerDes transceiver transmits the serialized data signals to an Ethernet switch.
8. The interface of claim 1 , wherein the DSP farm is positioned on at least one of a Versa Module Europa bus (VMEbus) board, an Advanced Mezzanine Card (AMC) module, or a standard motherboard.
9. A digital signal interface, comprising:
a multiplexer coupled to receive a plurality of time division multiplexed (TDM) data signals from a corresponding plurality of digital signal processors (DSP) comprising a DSP farm located on a front board of a telecommunications processing device connected to a rear transition module via a backplane, the multiplexer multiplexing the plurality of data signals, wherein the data signal output by each DSP includes a plurality of output signal lines communicating signals in parallel; and
a serializer/deserializer (SerDes) transceiver coupled to receive the multiplexed plurality of TDM data signals, the SerDes transceiver serializing the multiplexed plurality of TDM data signals and transmitting the serialized data signals to the rear transition module, the rear transition module including having a timeslot interchange (TSI) switch receiving the serialized data,
wherein the front board of the telecommunications processing device communicates using a time-division multiplexing (TDM) bus protocol,
wherein each data signal includes a pair of serial clock signals and a pair of frame synchronization signals.
10. The interface of claim 9 , wherein the SerDes transceiver further comprises a parallel-to-serial (PISO) functional module and a serial-to-parallel (SIPO) functional module and uses an 8B/10B SerDes coding scheme.
11. The interface of claim 9 , wherein the DSP farm is positioned on at least one of a Versa Module Europa bus (VMEbus) board, an Advanced Mezzanine Card (AMC) module, or a standard motherboard.
12. The interface of claim 9 , wherein the multiplexer and the SerDes transceiver are configured to reside with a time-division multiplexing (TDM) interface.
13. The interface of claim 12 , wherein the TDM interface is coupled to a second TDM interface using a connector capable of supporting transfer of high speed differential signals.