IP Library Granted Patent US 8,316,341
Granted Patent B2
US 8,316,341 · App. 12/561,329 · Granted Nov 20, 2012

Hardware description language (HDL) generation systems and methods for custom circuit boards

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Quick Facts
Patent No.
US 8,316,341
App. No.
12/561,329
Granted
Nov 20, 2012
Kind
B2
Abstract

A system comprises an input and a hardware description language (HDL) module. The input receives design specifications for a custom circuit board. The design specifications are selected from predetermined design options for custom circuit boards. The hardware description language (HDL) module generates HDL corresponding to the design specifications and outputs the HDL to a circuit board producer.

Claims (171)

1. A system comprising:

an input that receives design specifications for a custom circuit board, wherein the design specifications are selected from predetermined design options for custom circuit boards; and

a hardware description language (HDL) module that generates a HDL corresponding to the design specifications and that outputs the HDL to a circuit board producer.

2. The system of claim 1 wherein the custom circuit board includes one of a motherboard, a computer on module (COM) board, and an advanced telecom computing architecture (ATCA) blade board, a CompactPCI (CPCI) blade board, and a VME blade board.

3. The system of claim 1 wherein the HDL module selects components to be implemented on the custom circuit board based on the design specifications and generates the HDL according to the components.

4. The system of claim 3 wherein the HDL module selects the components from predefined components stored in a database and generates the HDL based on HDL data stored for the predefined components.

5. The system of claim 4 wherein the predefined components include circuit board form factors, processors, input/output (I/O) ports, connectors, slots, switches, joint test action group (JTAG) expanders, and power supplies.

6. The system of claim 3 wherein the HDL module determines an arrangement for the components on the custom circuit board and generates the HDL and component placement for the custom circuit board based on the arrangement.

7. The system of claim 6 wherein the HDL module performs an optimal placement analysis based on a layout and coordinates on the components and selectively updates the layout based on a result of the optimal placement analysis.

8. The system of claim 3 wherein the HDL module generates a HDL netlist, a bill of materials, a placement for the components, and setup data.

9. The system of claim 1 wherein the HDL module generates the HDL in one of a Verilog language, a very high-speed integrated circuit HDL (VHDL) language, and a System C language.

10. The system of claim 1 wherein the HDL module generates an initial design for the custom circuit board based on the design specifications, outputs the initial design, and delays generating and outputting the HDL until an approval for the initial design has been received.

11. The system of claim 1 wherein the design specifications include at least a form factor for the custom circuit board and a processor.

12. The system of claim 11 wherein the design specifications further include a description of at least one of memory, a number of expansion slots, and on-board peripherals.

13. The system of claim 11 wherein the design specifications further include a description of memory, a number of expansion slots, and on-board peripherals.

14. A system comprising:

a planner module that receives design specifications input for production of a custom circuit board, that selects components for the custom circuit board based on the design specifications, that determines an arrangement for the components on the custom circuit board, and that generates initial design data for the custom circuit board based on the components and the arrangement; and

a code generator module that generates a hardware description language (HDL) that is provided to a circuit board producer for production of the custom circuit board based on the initial design data.

15. The system of claim 14 wherein the code generator module generates an initial design for the custom circuit board based on the initial design data, outputs the initial design, and delays generation of the HDL until an approval for the initial design has been received.

16. The system of claim 14 further comprising a schematic module that finalizes a design for the custom circuit board including detailing electrical connections of the custom circuit board, that generates a final netlist corresponding to the design, and that provides the final netlist to the circuit board producer.

17. The system of claim 16 further comprising a bill of materials (BOM) module that generates a BOM corresponding to the design and provides the BOM to the circuit board producer.

18. The system of claim 16 further comprising a placement module that performs an optimal placement analysis for the components of the design, that selectively updates a placement of the components for the custom circuit board based on a result of the optimal placement analysis, and that provides the placement to the circuit board producer.

19. The system of claim 14 wherein the custom circuit board includes one of a motherboard, a computer on module (COM) board, an advanced telecom computing architecture (ATCA) blade board, a CompactPCI (CPCI) blade board, and a VME blade board.

20. The system of claim 14 wherein a user selects the design specification from predetermined design options presented to the user.

21. The system of claim 14 wherein the planner module selects the components from predefined components stored in a database that satisfy one or more of the design specifications and generates the initial design data based on HDL data for the components selected.

22. The system of claim 21 wherein the predefined components include circuit board form factors, processors, input/output (I/O) ports, connectors, slots, switches, joint test action group (JTAG) expanders, and power supplies.

23. The system of claim 14 wherein the code generator module generates the HDL in one of a Verilog language, a very high-speed integrated circuit HDL (VHDL) language, and a System C language.

24. The system of claim 14 wherein the design specifications include at least a form factor for the custom circuit board and a processor.

25. The system of claim 24 wherein the design specifications further include a description of at least one of memory, a number of expansion slots, and on-board peripherals.

26. The system of claim 24 wherein the design specifications further includes a description of memory, a number of expansion slots, and on-board peripherals.

27. A system comprising:

a planner module that receives design specifications for a custom circuit board, that selects components for the custom circuit board based on the design specifications, that determines an arrangement for the components on the custom circuit board, and that generates initial design data for the custom circuit board based on the components and the arrangement; and

a code generator module that generates a hardware description language (HDL) that is provided to a circuit board producer for production of the custom circuit board based on the initial design data,

wherein the custom circuit board includes one of a motherboard, a computer on module (COM) board, an advanced telecom computing architecture (ATCA) blade board, a CompactPCI (CPCI) blade board, and a VME blade board,

wherein the design specifications are selected from predetermined design options, and

wherein the planner module selects the components for the custom circuit board from predefined components stored in a database.

28. The system of claim 27 wherein the predefined components include circuit board form factors, processors, input/output (I/O) ports, connectors, slots, switches, joint test action group (JTAG) expanders, and power supplies.

29. The system of claim 27 wherein the code generator module generates an initial design for the custom circuit board based on the initial design data, outputs the initial design, and delays generation of the HDL until an approval for the initial design has been received.

30. The system of claim 27 further comprising a schematic module that finalizes a design for the custom circuit board including detailing electrical connections of the custom circuit board, that generates a final netlist corresponding to the design, and that provides the final netlist to the circuit board producer.

31. The system of claim 30 further comprising a bill of materials (BOM) module that generates a BOM corresponding to the design and provides the BOM to the circuit board producer.

32. The system of claim 30 further comprising a placement module that performs an optimal placement analysis for the components of the design, that selectively updates a placement of the components for the custom circuit board based on a result of the optimal placement analysis, and that provides the placement to the circuit board producer.

33. The system of claim 27 wherein the code generator module generates the HDL in one of a Verilog language, a very high-speed integrated circuit HDL (VHDL) language, and a System C language.

34. The system of claim 27 wherein the design specifications include at least a form factor for the custom circuit board and a processor.

35. The system of claim 34 wherein the design specifications further include a description of at least one of memory, a number of expansion slots, and on-board peripherals.

36. The system of claim 34 wherein the design specifications further includes a description of memory, a number of expansion slots, and on-board peripherals.

37. A method including a processor with memory comprising:

receiving design specifications for a custom circuit board, wherein the design specifications are selected from predetermined design options for custom circuit boards;

generating a hardware description language (HDL) corresponding to the design specifications; and

outputting the HDL to a circuit board producer using the processor.

38. The method of claim 37 wherein the custom circuit board includes one of a motherboard, a computer on module (COM) board, an advanced telecom computing architecture (ATCA) blade board, a CompactPCI (CPCI) blade board, and a VME blade board.

39. The method of claim 37 further comprising:

selecting components to be implemented on the custom circuit board based on the design specifications; and

generating the HDL according to the components.

40. The method of claim 39 further comprising:

selecting the components from predefined components stored in a database; and

generating the HDL based on HDL data stored for the predefined components.

41. The method of claim 40 wherein the predefined components include circuit board form factors, processors, input/output (I/O) ports, connectors, slots, switches, joint test action group (JTAG) expanders, and power supplies.

42. The method of claim 39 further comprising:

determining an arrangement for the components on the custom circuit board; and

generating the HDL including a placement for the custom circuit board based on the arrangement.

43. The method of claim 42 further comprising:

performing an optimal placement analysis based on a layout and coordinates on the components; and

selectively updating the layout based on a result of the optimal placement analysis.

44. The method of claim 39 wherein the HDL module generates an HDL netlist, a bill of materials, a placement for the components, testing data, and setup data.

45. The method of claim 37 further comprising generating the HDL in one of a Verilog language, a very high-speed integrated circuit HDL (VHDL) language, and a System C language.

46. The method of claim 37 further comprising:

generating an initial design for the custom circuit board based on the design specifications;

outputting the initial design; and

delaying the generating and outputting the HDL until an approval for the initial design has been received.

47. The method of claim 37 wherein the design specifications include at least a form factor for the custom circuit board and a processor.

48. The method of claim 47 wherein the design specifications further include a description of at least one of memory, a number of expansion slots, and on-board peripherals.

49. The method of claim 47 wherein the design specifications further include a description of memory, a number of expansion slots, and on-board peripherals.

50. A method including a processor and memory comprising:

receiving design specifications for a custom circuit board;

selecting components for the custom circuit board based on the design specifications;

determining an arrangement for the components on the custom circuit board;

generating initial design data for the custom circuit board based on the components and the arrangement; and

generating a hardware description language (HDL) using the processor that is output to a circuit board producer for production of the custom circuit board based on the initial design data,

wherein the custom circuit board includes one of a motherboard, a computer on module (COM) board, an advanced telecom computing architecture (ATCA) blade board, a CompactPCI (CPCI) blade board, and a VME blade board,

wherein the design specifications are selected from predetermined design options, and

wherein the components are selected from predefined components stored in a database.

51. The method of claim 50 wherein the predefined components include circuit board form factors, processors, input/output (I/O) ports, connectors, slots, switches, joint test action group (JTAG) expanders, and power supplies.

52. The method of claim 50 further comprising:

generating an initial design for the custom circuit board based on the initial design data;

outputting the initial design; and

delaying generation of the HDL until an approval for the initial design has been received.

53. The method of claim 50 further comprising:

finalizing a design for the custom circuit board including detailing electrical connections of the custom circuit board;

generating a final netlist corresponding to the design; and

providing the final netlist to the circuit board producer.

54. The method of claim 53 further comprising:

generating a BOM corresponding to the design; and

providing the BOM to the circuit board producer.

55. The method of claim 53 further comprising:

performing an optimal placement analysis for the components of the design;

selectively updating a placement of the components for the custom circuit board based on a result of the optimal placement analysis; and

providing the placement to the circuit board producer.

56. The method of claim 50 further comprising generating the HDL in one of a Verilog language, a very high-speed integrated circuit HDL (VHDL) language, and a System C language.

57. The method of claim 50 wherein the design specifications include at least a form factor for the custom circuit board and a processor.

58. The method of claim 57 wherein the design specifications further include a description of at least one of memory, a number of expansion slots, and on-board peripherals.

59. The method of claim 57 wherein the design specifications further includes a description of memory, a number of expansion slots, and on-board peripherals.

60. A method including a processor and a memory for producing a custom circuit board, the method comprising:

receiving design specifications for the custom circuit board, wherein the design specifications are selected from predetermined design options for custom circuit boards;

generating a hardware description language (HDL) corresponding to the design specifications;

outputting the HDL to a circuit board producer; and

producing the custom circuit board according to the HDL using the processor.

61. The method of claim 60 wherein producing the custom circuit board further comprises at least one of:

routing the custom circuit board according to the HDL to define routes;

applying an electrically conductive material to the routes;

attaching components to the custom circuit board;

establishing electrical connections as specified in the HDL; and

uploading setup data to the custom circuit board.

62. The method of claim 60 wherein the custom circuit board includes one of a motherboard, a computer on module (COM) board, an advanced telecom computing architecture (ATCA) blade board, a CompactPCI (CPCI) blade board, and a VME blade board.

63. The method of claim 60 further comprising:

selecting components to be implemented on the custom circuit board based on the design specifications; and

generating the HDL according to the components.

64. The method of claim 63 further comprising:

selecting the components from predefined components stored in a database; and

generating the HDL based on HDL data stored for the predefined components.

65. The method of claim 64 wherein the predefined components include circuit board form factors, processors, input/output (I/O) ports, connectors, slots, switches, joint test action group (JTAG) expanders, and power supplies.

66. The method of claim 63 further comprising:

determining an arrangement for the components on the custom circuit board; and

generating the HDL including a placement for the custom circuit board based on the arrangement.

67. The method of claim 66 further comprising:

performing an optimal placement analysis based on the layout and coordinates on the components; and

selectively updating the layout based on a result of the optimal placement analysis.

68. The method of claim 63 wherein the HDL module generates an HDL netlist, a bill of materials, a placement for the components, testing data, and setup data.

69. The method of claim 60 further comprising generating the HDL in one of a Verilog language, a very high-speed integrated circuit HDL (VHDL) language, and a System C language.

70. The method of claim 60 further comprising:

generating an initial design for the custom circuit board based on the design specifications;

outputting the initial design; and

delaying the generating and outputting the HDL until an approval for the initial design has been received.

71. The method of claim 60 wherein the design specifications include at least a form factor for the custom circuit board and a processor.

72. The method of claim 71 wherein the design specifications further include a description of at least one of memory, a number of expansion slots, and on-board peripherals.

73. The method of claim 71 wherein the design specifications further include a description of memory, a number of expansion slots, and on-board peripherals.

74. A method including a processor and memory for producing a custom circuit board, the method comprising:

receiving design specifications for the custom circuit board;

selecting components for the custom circuit board based on the design specifications;

determining an arrangement for the components on the custom circuit board;

generating initial design data for the custom circuit board based on the components and the arrangement;

generating a hardware description language (HDL) based on the initial design data using the processor; and

producing the custom circuit board in accordance with the HDL,

wherein the custom circuit board includes one of a motherboard, a computer on module (COM) board, an advanced telecom computing architecture (ATCA) blade board, a CompactPCI (CPCI) blade board, and a VME blade board,

wherein the design specifications are selected from predetermined design options, and

wherein the components are selected from predefined components stored in a database.

75. The method of claim 74 wherein producing further comprises at least one of:

routing the custom circuit board according to the HDL to define routes;

applying an electrically conductive material to the routes;

attaching components to the custom circuit board;

establishing electrical connections as specified in the HDL; and

uploading setup data to the custom circuit board.

76. The method of claim 74 wherein the predefined components include circuit board form factors, processors, input/output (I/O) ports, connectors, slots, switches, joint test action group (JTAG) expanders, and power supplies.

77. The method of claim 74 further comprising:

generating an initial design for the custom circuit board based on the initial design data;

outputting the initial design; and

delaying generation of the HDL until an approval for the initial design has been received.

78. The method of claim 74 further comprising:

finalizing a design for the custom circuit board including detailing electrical connections of the custom circuit board;

generating a final netlist corresponding to the design; and

providing the final netlist to the circuit board producer.

79. The method of claim 78 further comprising:

generating a BOM corresponding to the design; and

providing the BOM to the circuit board producer.

80. The method of claim 78 further comprising:

performing an optimal placement analysis for the components of the design;

selectively updating a placement of the components for the custom circuit board based on a result of the optimal placement analysis; and

providing the placement to the circuit board producer.

81. The method of claim 74 further comprising generating the HDL in one of a Verilog language, a very high-speed integrated circuit HDL (VHDL) language, and a System C language.

82. The method of claim 74 wherein the design specifications include at least a form factor for the custom circuit board and a processor.

83. The method of claim 82 wherein the design specifications further include a description of at least one of memory, a number of expansion slots, and on-board peripherals.

84. The method of claim 82 wherein the design specifications further includes a description of memory, a number of expansion slots, and on-board peripherals.

Assignments (9)
PATENT SECURITY AGREEMENT Recorded Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; SMART MODULAR TECHNOLOGIES, INC.; PENGUIN COMPUTING, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →
RELEASE OF PATENT SECURITY INTEREST RECORDED AT R/F 058983/0001 Recorded Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
SECURITY INTEREST Recorded Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
CHANGE OF NAME Recorded Jun 24, 2020
From: ARTESYN EMBEDDED COMPUTING, INC.
To: SMART EMBEDDED COMPUTING, INC.
Reel/Frame 053023/0953 →
CHANGE OF NAME Recorded Jun 18, 2020
From: EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.
To: ARTESYN EMBEDDED COMPUTING, INC.
Reel/Frame 052978/0634 →
RELEASE OF SECURITY INTEREST Recorded Jul 9, 2019
From: ARTESYN EMBEDDED COMPUTING, INC. (F/K/A EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.)
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049698/0222 →
PARTIAL RELEASE OF SECURITY INTEREST Recorded Jul 8, 2019
From: BANK OF AMERICA, N.A.
To: ARTESYN EMBEDDED COMPUTING, INC. (F/K/A EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.)
Reel/Frame 049694/0096 →
SECURITY AGREEMENT Recorded Nov 26, 2013
From: ARTESYN TECHNOLOGIES, INC.; ARTESYN NORTH AMERICA LLC; EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 031731/0048 →
SECURITY AGREEMENT Recorded Nov 25, 2013
From: ARTESYN TECHNOLOGIES, INC.; ARTESYN NORTH AMERICA LLC; EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT AND GRANTEE
Reel/Frame 031719/0417 →